公开(公告)号：US20240164017A1

公开(公告)日：2024-05-16

申请号：US18504717

申请日：2023-11-08

Applicant: NITTO DENKO CORPORATION

Inventor： Hideki MATSUI ,  Naoki SHIBATA ,  Ryosuke SASAOKA

IPC: H05K1/11 ,  H05K3/10 ,  H05K3/18 ,  H05K3/38

CPC classification number: H05K1/11 ,  H05K3/108 ,  H05K3/18 ,  H05K3/38 ,  H05K3/244 ,  H05K2201/0347 ,  H05K2201/099

Abstract: A wiring circuit board includes a first insulating layer, a conductive pattern disposed at one side of the first insulating layer in a thickness direction and having a terminal and a wire connected with the terminal, and a second insulating layer for suppressing release of the terminal from the first insulating layer. The second insulating layer has a first portion disposed at the one side of the first insulating layer in the thickness direction and a second portion disposed at one side of a peripheral edge portion of the terminal in the thickness direction and covering the peripheral edge portion.

公开(公告)号：US20230380058A1

公开(公告)日：2023-11-23

申请号：US18315878

申请日：2023-05-11

Applicant: NITTO DENKO CORPORATION

Inventor： Hideki MATSUI ,  Naoki SHIBATA ,  Ryosuke SASAOKA

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0296 ,  H05K1/117

Abstract: Provided is a wiring circuit board capable of suppressing peeling of a terminal from an insulating layer. The wiring circuit board includes a base insulating layer, and a conductive pattern disposed on one surface of the base insulating layer in a thickness direction. The conductive pattern includes a wiring and a terminal. The terminal protrudes from one end edge of the wiring. The terminal includes a first terminal layer and a second terminal layer. A ratio (Y/X) of the volume Y of the wiring in a folded region with respect to the volume X of the terminal is 0.1 or more. The folded region is a region when a region of the terminal when viewed in the thickness direction is folded back toward the opposite side in a protruding direction of the terminal with the one end edge of the wiring as a starting point.