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公开(公告)号：US12127336B2
公开(公告)日：2024-10-22
申请号：US17802421
申请日：2020-12-18
Applicant: NITTO DENKO CORPORATION
Inventor： Takahito Azuma , Yoshito Fujimura
IPC: H05K1/02
CPC classification number: H05K1/0271
Abstract: A suspension board with circuit extending in a predetermined direction includes a base insulating layer, and a conductive layer disposed on one side in a thickness direction of the base insulating layer. The base insulating layer includes a first body base and a second body base disposed spaced apart from each other in a width direction, and a connection portion connecting a portion of the first body base in the longitudinal direction to a portion of the second body base in the longitudinal direction. The suspension board with circuit further includes a reinforcing portion disposed on the surface of the connection portion and reinforcing the connection portion. The reinforcing portion includes two or more resin layers laminated in the thickness direction, or a metal member.
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公开(公告)号：US12108529B2
公开(公告)日：2024-10-01
申请号：US17798810
申请日：2020-11-12
Applicant: NITTO DENKO CORPORATION
Inventor： Yoshito Fujimura
CPC classification number: H05K1/111 , H05K1/056 , H05K2201/10083
Abstract: A suspension board with circuit including a first mounting region for mounting a slider and a second mounting region for mounting a piezoelectric element. The wiring circuit board includes a metal support layer, a base insulating layer, and a conductive layer. The conductive layer includes a first wiring pattern, a second wiring pattern, and a shield wiring pattern. The first wiring pattern includes a read wiring. The second wiring pattern includes a power supply wiring disposed at spaced intervals to the read wiring. The shield wiring pattern includes a shield wiring disposed between the read wiring and the power supply wiring.
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公开(公告)号：US10687427B2
公开(公告)日：2020-06-16
申请号：US15478711
申请日：2017-04-04
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu Sugimoto , Hiroyuki Tanabe , Yoshito Fujimura
Abstract: A method for producing a wired circuit board including an insulating layer and a conductive pattern, including (1), providing the insulating layer having an inclination face; (2), providing a metal thin film at least on the surface of the insulating layer; (3), providing a photoresist on the surface of the metal thin film; (4), disposing a photomask so that a first portion, where the conductive pattern is provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask; (5), removing the first portion to expose the metal thin film corresponding to the first portion; and (6), providing the conductive pattern on the surface of the metal thin film exposed from the photoresist. The inclination face has a second portion that allows the light reflected at the metal thin film to reach the first portion.
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公开(公告)号：US10251263B2
公开(公告)日：2019-04-02
申请号：US15712613
申请日：2017-09-22
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu Sugimoto , Yoshito Fujimura , Hiroyuki Tanabe
Abstract: A method of producing a wired circuit board including an insulating layer and a conductive pattern, including: (1), an insulating layer having an inclination face, (2), a metal thin film provided at least on the inclination face, (3), a photoresist provided on the surface of the metal thin film, (4), a light shield portion of a photomask disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask, (5), the first portion of the photoresist is removed to expose the metal thin film corresponding to the first portion, and (6), the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist.
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公开(公告)号：US09913373B2
公开(公告)日：2018-03-06
申请号：US15368862
申请日：2016-12-05
Applicant: NITTO DENKO CORPORATION
Inventor： Yoshito Fujimura
CPC classification number: H05K1/056 , G11B5/483 , G11B5/4853 , H05K1/0313 , H05K1/111 , H05K1/181 , H05K3/0023 , H05K2201/10083
Abstract: A suspension board with circuit includes a metal supporting board, a conductor layer having a terminal capable of being electrically connected to the piezoelectric element and disposed above the metal supporting board at spaced intervals thereto, a first insulating layer disposed between the metal supporting board and the conductor layer so as to support the conductor layer, and a second insulating layer disposed on the first insulating layer and the conductor layer so as to expose the terminal. The first insulating layer includes a first portion including the terminal viewed from a thickness direction of the metal supporting board and a second portion disposed in a position different from that of the first portion viewed from the thickness direction. The thickness of the first portion is thinner than that of the second portion.
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Patent Agency Ranking
公开(公告)号：US09865288B2
公开(公告)日：2018-01-09
申请号：US15040199
申请日：2016-02-10
Applicant: NITTO DENKO CORPORATION
Inventor： Naohiro Terada , Saori Kanezaki , Hiroyuki Tanabe , Yoshito Fujimura
CPC classification number: G11B5/4853 , G06F1/184 , G11B5/4826 , G11B5/4873 , H05K1/056 , H05K3/305 , Y02P70/613
Abstract: A suspension board with circuit includes one pair of pedestals. A pedestal conductive layer of one pedestal has a fan portion and a continuous portion. The pedestal conductive layer of the other pedestal has at least the fan portion. When the pedestal conductive layer of the other pedestal has only the fan portion, the pedestal supporting layer is disposed so as to be overlapped with the fan portion in the thickness direction in each of the pedestals and so as not to be overlapped with the continuous portion in the one pedestal and when the pedestal conductive layer of the other pedestal has the continuous portion, the pedestal supporting layer is disposed so as to be overlapped with the continuous portion or is disposed so as to be overlapped with the fan portion and so as not to be overlapped with the continuous portion in each of the pedestals.
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公开(公告)号：US09865287B2
公开(公告)日：2018-01-09
申请号：US15059850
申请日：2016-03-03
Applicant: NITTO DENKO CORPORATION
Inventor： Hiroyuki Tanabe , Yuu Sugimoto , Yoshito Fujimura
CPC classification number: G11B5/4833 , G11B5/484 , G11B5/4853 , H05K1/056 , H05K1/184
Abstract: A suspension board with circuit includes a first layer made of a metal supporting board, a second layer having insulating properties and provided at one side in a thickness direction of the first layer, and a third layer provided at one side in the thickness direction of the second layer and made of copper or a copper alloy. The first layer includes a first opening portion passing through in the thickness direction. The first opening portion is provided with a conductor layer that is, when projected in a direction orthogonal to the thickness direction, overlapped with the first layer. The conductor layer includes a first conductor circuit having a first electronic component-connecting terminal for being electrically connected to a first electronic component and made of copper or a copper alloy. The third layer includes a second conductor circuit having a second electronic component-connecting terminal for being electrically connected to a second electronic component.
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公开(公告)号：US11026334B2
公开(公告)日：2021-06-01
申请号：US16860383
申请日：2020-04-28
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu Sugimoto , Hiroyuki Tanabe , Yoshito Fujimura
Abstract: A method for producing a wired circuit board including an insulating layer and a conductive pattern, including (1), providing the insulating layer having an inclination face; (2), providing a metal thin film at least on the surface of the insulating layer; (3), providing a photoresist on the surface of the metal thin film; (4), disposing a photomask so that a first portion, where the conductive pattern is provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask; (5), removing the first portion to expose the metal thin film corresponding to the first portion; and (6), providing the conductive pattern on the surface of the metal thin film exposed from the photoresist. The inclination face has a second portion that allows the light reflected at the metal thin film to reach the first portion.
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公开(公告)号：US10520817B2
公开(公告)日：2019-12-31
申请号：US15605259
申请日：2017-05-25
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu Sugimoto , Hiroyuki Tanabe , Yoshito Fujimura
Abstract: In a method for producing a wired circuit board includes a step (1), in which the insulating layer having an inclination face is provided; a step (2), in which a metal thin film is provided on the surface of the insulating layer including the inclination face; a step (3), in which a photoresist is provided on the surface of the metal thin film; a step (4), in which a photomask is disposed so that a first light exposure portion and a second light exposure portion in the photoresist are exposed to light, and the photoresist is exposed to light; a step (5), in which the first light exposure portion and the second light exposure portion are removed; and a step (6), in which the first wire and the second wire are provided on the surface of the metal thin film.
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公开(公告)号：US09980390B2
公开(公告)日：2018-05-22
申请号：US14605150
申请日：2015-01-26
Applicant: NITTO DENKO CORPORATION
Inventor： Naohiro Terada , Yoshito Fujimura , Tomoaki Okuno
CPC classification number: H05K3/0097 , G11B5/4853 , G11B5/486 , H05K1/0393 , H05K1/056 , H05K1/118 , H05K1/189 , H05K3/0052 , H05K2201/05 , H05K2201/09027 , H05K2201/0909 , H05K2201/0969 , H05K2203/0169 , H05K2203/1545
Abstract: A suspension board with circuit assembly sheet includes an assembly provided region provided with a plurality of suspension boards with circuits at spaced intervals to each other along one direction and a margin region provided at least at one side in a crossing direction with respect to the one direction of the assembly provided region. In the assembly provided region, a first opening portion is provided between the suspension boards with circuits that are adjacent to each other and in the margin region, a fragile portion is provided.
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