-
公开(公告)号：US12035029B2
公开(公告)日：2024-07-09
申请号：US17833025
申请日：2022-06-06
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu Wang , Bojie Zhao , Zhenyu Chen , Nan Guo , Takehiko Tanaka
IPC: H04N5/335 , G02B7/00 , G02B7/02 , G03B13/36 , H01L27/146 , H04N23/45 , H04N23/54 , H04N23/55 , H04N23/57 , H04N23/90 , H05K1/18 , G02B5/20 , G02B7/08 , G02B7/09 , H02K41/035 , H02N2/02 , H05K1/02 , H05K3/28
CPC classification number: H04N23/55 , G02B7/006 , G02B7/02 , G03B13/36 , H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L27/14645 , H04N23/45 , H04N23/54 , H04N23/57 , H04N23/90 , H05K1/182 , G02B5/208 , G02B7/021 , G02B7/08 , G02B7/09 , H01L27/14636 , H01L2224/48091 , H02K41/0354 , H02N2/026 , H05K1/0274 , H05K1/181 , H05K3/284 , H05K2201/10083 , H05K2201/10121 , H05K2201/10151 , H05K2201/10522 , H05K2201/2018 , H05K2203/1316 , H01L2224/48091 , H01L2924/00014
Abstract: A camera module and an array camera module based on an integral packing process are disclosed. The camera module or each of the camera module units of the array camera module includes a circuit board, an integral base, a photosensitive element operatively connected to the circuit board, a lens, a light filter holder installed at the integral base and a light filter installed at the light filter holder. The light filter is not required to be directly installed to the integral base, so that the light filter is protected and the requiring area of the light filter is reduced.
-
公开(公告)号：US12028982B2
公开(公告)日：2024-07-02
申请号：US18480303
申请日：2023-10-03
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Benjamin J. Grena , Kyusang Kim , David M. Kindlon , Pierpaolo Lupo , Kishore N. Renjan , Manoj Vadeentavida
CPC classification number: H05K1/186 , H05K1/0298 , H05K1/189 , H05K1/0274 , H05K2201/10083 , H05K2201/10106 , H05K2201/10121 , H05K2201/10151 , H05K2201/10159
Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.
-
公开(公告)号：US11864322B2
公开(公告)日：2024-01-02
申请号：US18164180
申请日：2023-02-03
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Benjamin J. Grena , Kyusang Kim , David M. Kindlon , Pierpaolo Lupo , Kishore N. Renjan , Manoj Vadeentavida
CPC classification number: H05K1/186 , H05K1/0298 , H05K1/189 , H05K1/0274 , H05K2201/10083 , H05K2201/10106 , H05K2201/10121 , H05K2201/10151 , H05K2201/10159
Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.
-
公开(公告)号：US20230298862A1
公开(公告)日：2023-09-21
申请号：US17696594
申请日：2022-03-16
Applicant: Applied Materials, Inc.
Inventor： Alexander BERGER , Ming XU
IPC: H01J37/32 , B81B7/04 , H05K1/02 , C23C16/50 , C23C16/455
CPC classification number: H01J37/32449 , B81B7/04 , H05K1/0272 , C23C16/50 , C23C16/45565 , B81B2201/054 , B81B2207/053 , B81B2207/99 , B81B2207/012 , H05K2201/10083 , H05K2201/10522 , H05K2201/10545 , H05K2201/09063 , H05K1/181
Abstract: A showerhead for a processing chamber includes a faceplate with a plurality of openings. A plurality of compartments are recessed into a top surface of the faceplate. The showerhead includes a plurality of MEMS devices. Each MEMS device is disposed in a corresponding compartment of the plurality of compartments. A printed circuit board including a plurality of ports therethrough is coupled to each MEMS device. Each MEMS device is configured to regulate a gas flow into each corresponding compartment through a corresponding port of the plurality of ports in the printed circuit board.
-
公开(公告)号：US11665823B2
公开(公告)日：2023-05-30
申请号：US16875599
申请日：2020-05-15
Applicant: Ian J. Forster
Inventor： Ian J. Forster
IPC: H05K1/00 , H05K1/18 , H05K7/00 , H05K1/16 , H05K1/09 , H05K1/02 , H05K1/05 , H05K1/03 , G11C11/14 , H03H9/02 , H03H9/05
CPC classification number: H05K1/16 , G11C11/14 , H05K1/0233 , H05K1/034 , H05K1/0306 , H05K1/05 , H05K1/09 , H03H9/02551 , H03H9/02559 , H03H9/0542 , H05K2201/015 , H05K2201/083 , H05K2201/086 , H05K2201/10083 , H05K2201/10265
Abstract: A circuit device formed from a functional substrate. The circuit device comprises a functional substrate component and printed electronic elements formed on the functional substrate component. The printed electronic elements formed on the functional substrate component interact with the substrate component to perform a function and to modify the functional substrate component. The circuit device typically needs a passive base material that takes no functional part in the device operation except mechanical support.
-
Patent Agency Ranking
公开(公告)号：US20190050054A1
公开(公告)日：2019-02-14
申请号：US16067767
申请日：2017-01-12
Applicant: ELECTROLUX HOME PRODUCTS, INC.
Inventor： Paul Stoufer
CPC classification number: G06F3/016 , G08B6/00 , H05K1/165 , H05K1/181 , H05K2201/09072 , H05K2201/1003 , H05K2201/10083 , H05K2201/10151 , H05K2201/1025 , H05K2201/10265 , H05K2201/10522 , Y02P70/611
Abstract: An apparatus such as an appliance with a printed circuit board, PCB, (202) mounted haptic feedback device (200) is provided. The apparatus comprises a printed circuit board (PCB) having an opening (204) defined therein, and a spool (206) affixed to the PCB and having a shaft with a coil (208) wound thereabout. The shaft defines an opening aligned with the opening of the PCB. The apparatus also comprises a spring-loaded plunger positioned and movable within the opening of the shaft. The spring-loaded plunger includes a metallic disk operatively coupled to an end of the plunger and distally positioned to the spool. A control component of the apparatus is configured to energize the coil according to a haptic feedback pattern, and thereby cause the coil to at tract the metallic disk and move the plunger within the opening of the shaft of the spool, and through the opening of the PCB.
-
公开(公告)号：US20180235075A1
公开(公告)日：2018-08-16
申请号：US15434919
申请日：2017-02-16
Applicant: Intel Corporation
Inventor： Taylor Gaines , Anna M. Prakash , Ziv Belman , Baruch Schiffmann , Arnon Hirshberg , Ron Wittenberg , Vladimir Malamud
CPC classification number: H01L23/552 , H05K1/0218 , H05K1/0243 , H05K2201/0317 , H05K2201/0715 , H05K2201/10083 , H05K2201/10098 , H05K2201/10106 , H05K2201/10121 , H05K2201/10151 , H05K2201/10159 , H05K2201/2018 , H05K2203/072 , H05K2203/0723
Abstract: Semiconductor packages may include different portions associated one or more electronic components of the semiconductor package where electromagnetic (for example, radio-frequency, RF) shielding at predetermined frequencies ranges may be needed. Accordingly, in an embodiment, compartmental shielding can be used in the areas between the electronic components on the semiconductor package to provide RF shielding to the electronic components on the semiconductor package or to other electronic components in proximity to the electronic components on the semiconductor package. Further, in another embodiment, conformal coating shielding can be used to provide RF shielding to provide RF shielding to the electronic components on the semiconductor package or to other electronic components in proximity to the electronic components on the semiconductor package.
-
公开(公告)号：US20180063623A1
公开(公告)日：2018-03-01
申请号：US15691015
申请日：2017-08-30
Applicant: BLUECOM Co., Ltd.
Inventor： Beom-Seok KIM
CPC classification number: H04R1/1033 , B65H75/406 , B65H75/4434 , B65H2701/3919 , H02G11/02 , H04R1/1041 , H04R5/0335 , H05K1/02 , H05K1/0257 , H05K5/0069 , H05K5/0247 , H05K2201/09027 , H05K2201/09063 , H05K2201/10083 , H05K2201/1009
Abstract: An automatic rewinding apparatus with an abrasion-resistant rotation axis includes: a main base lower housing including a cylindrical fixing axis at a center; a PCB substrate penetrated by the fixing axis and combined with the main base lower housing; a contact terminal coupling plate; a middle base coil housing including: a sub-base lower housing, a cylindrical winding bobbin, a sub-base upper housing, and an abrasion-resistance improving insert disposed on internal circumferential surfaces of punctured centers of the sub-base lower housing, the winding bobbin and the sub-base upper housing; a rolling elastic member with elasticity; grease cover plates on both sides of the rolling elastic member; a cap for covering the opening of the sub-base upper housing and combination with the sub-base upper housing; a stopper ball; and a main base upper housing combined with the main base lower housing and covering a second side where the track of the cap.
-
公开(公告)号：US20180062611A1
公开(公告)日：2018-03-01
申请号：US15681153
申请日：2017-08-18
Applicant: WISOL CO., LTD.
Inventor： Jong Soo HA , Eun Tae PARK , Bong Soo KIM , Jung Hoon HAN , Chang Dug KIM
CPC classification number: H03H9/02992 , H03H3/02 , H03H9/059 , H03H9/1085 , H05K1/181 , H05K3/28 , H05K3/32 , H05K2201/032 , H05K2201/10068 , H05K2201/10083 , H05K2201/10568 , H05K2201/10674 , H05K2201/2036
Abstract: Disclosed is a radiofrequency (RF) module including a surface acoustic wave (SAW) device that includes a piezoelectric substrate, an interdigital transducer (IDT) electrode and an input/output electrode formed on one surface of the piezoelectric substrate, and a bump joined to the input/output electrode, a printed circuit board (PCB) that includes a terminal corresponding to the input/output electrode and on which the SAW device is mounted to join the bump to the terminal, a molding portion that covers the SAW device, and a dam portion that surrounds the IDT electrode, the input/output electrode, and the bump not to allow a molding material that forms the molding portion to penetrate a space in which the IDT electrode, the input/output electrode, and the bump are arranged.
-
公开(公告)号：US09854676B2
公开(公告)日：2017-12-26
申请号：US14951491
申请日：2015-11-25
Applicant: Joseph Erskine , Alan Hardie , Gerard McGoogan
Inventor： Joseph Erskine , Alan Hardie , Gerard McGoogan
IPC: H05K1/16 , H05K1/18 , H01L41/113 , H05K3/34 , F16C41/00 , H01L41/047 , H01L41/053
CPC classification number: H05K1/18 , F16C19/527 , F16C41/00 , H01L41/0475 , H01L41/053 , H01L41/1132 , H05K1/189 , H05K3/34 , H05K2201/053 , H05K2201/056 , H05K2201/10083
Abstract: An assembly comprising at least an electrical component mounted on a substrate. The component includes at least a first electrode and a second electrode. The substrate includes at least a first electrical conductor and a second electrical conductor. The first electrode is electrically connected to the first electrical conductor and the second electrode is electrically connected to the second electrical conductor. In a direction perpendicular to the substrate, the first electrode is located between the first electrical conductor and the second electrode. The second electrode is connected to the second electrical conductor by a connecting element extending between the second electrode and the second electrical conductor.
-
-
-
-
-
-
-
-
-
Search Results
495
records
(took 0.021 seconds)
