公开(公告)号：US20130235237A1

公开(公告)日：2013-09-12

申请号：US13788898

申请日：2013-03-07

Applicant: OLYMPUS CORPORATION

Inventor： Jun Aoki

IPC: H01L27/146

CPC classification number: H01L27/14625 ,  H01L27/14605 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/14636 ,  H01L27/1464

Abstract: A first substrate has a plurality of photoelectric conversion units. A second substrate has through vias connected to the first substrate, and a plurality of photoelectric conversion units. A third substrate has vias connected to the second substrate, and a circuit that processes a signal. Wiring lines of the first substrate select the angle of a light ray that is transmitted through the first substrate and enters the second substrate.

Abstract translation: 第一基板具有多个光电转换单元。 第二基板具有连接到第一基板的通孔和多个光电转换单元。 第三基板具有连接到第二基板的通孔和处理信号的电路。 第一基板的布线选择通过第一基板透射并进入第二基板的光线的角度。

公开(公告)号：US20130107093A1

公开(公告)日：2013-05-02

申请号：US13665333

申请日：2012-10-31

Applicant: OLYMPUS CORPORATION

Inventor： Jun Aoki

IPC: H04N5/335

CPC classification number: H04N5/3745 ,  H04N5/3742 ,  H04N5/378

Abstract: A solid-state imaging device includes: a pixel unit in which pixels each including a photoelectric conversion element are arrayed in a matrix form; a column circuit unit that includes a plurality of column processing circuits which are disposed in correspondence with columns of the pixels in the pixel unit; and an output unit that outputs a signal processed by the column processing circuit to the outside of the solid-state imaging device. The pixel unit is disposed in the 1st substrate. The column circuit unit is disposed in each of at least two or more different substrates of the 1st to nth substrates. The signal processing corresponding to the pixel of each column in the pixel unit is performed in a distributive manner by the column circuit units disposed in at least the two or more different substrates.

Abstract translation: 固态成像装置包括：像素单元，其中包括光电转换元件的像素以矩阵形式排列; 列电路单元，其包括与像素单元中的像素列相对应地设置的多个列处理电路; 以及输出单元，其将由列处理电路处理的信号输出到固态成像装置的外部。 像素单元设置在第一基板中。 列电路单元设置在第1至第n基板的至少两个或更多个不同的基板中的每一个中。 通过布置在至少两个或更多个不同基板中的列电路单元以分布方式执行与像素单元中的每列的像素相对应的信号处理。

公开(公告)号：US09954023B2

公开(公告)日：2018-04-24

申请号：US15000788

申请日：2016-01-19

Applicant: OLYMPUS CORPORATION

Inventor： Jun Aoki

IPC: H01L27/146 ,  H04N5/374 ,  H04N5/361 ,  H04N5/378

CPC classification number: H01L27/14634 ,  H01L27/14605 ,  H01L27/14623 ,  H01L27/14636 ,  H01L27/14643 ,  H01L27/1469 ,  H04N5/361 ,  H04N5/374 ,  H04N5/378

Abstract: A solid-state imaging device includes a first substrate and a second substrate electrically connected to the first substrate. The first substrate includes a first semiconductor layer and one or more first wiring layers. The second substrate includes a second semiconductor layer and one or more second wiring layers. The first photoelectric conversion element overlaps any of the one or more first wiring layers at all positions on the first photoelectric conversion element in a planar view of the first substrate. The second photoelectric conversion element does not overlap any of the one or more first wiring layers at some positions on the second photoelectric conversion element in the planar view of the first substrate.

公开(公告)号：US09473721B2

公开(公告)日：2016-10-18

申请号：US14809622

申请日：2015-07-27

Applicant: OLYMPUS CORPORATION

Inventor： Jun Aoki

IPC: H04N5/3745 ,  H04N5/372 ,  H04N5/369 ,  H01L27/146 ,  H04N5/232 ,  H04N5/238

CPC classification number: H04N5/3745 ,  H01L27/14603 ,  H01L27/14634 ,  H04N5/23212 ,  H04N5/23296 ,  H04N5/238 ,  H04N5/361 ,  H04N5/3698 ,  H04N5/372 ,  H04N5/37457 ,  H04N5/378

Abstract: A solid-state image capture device includes a plurality of pixels and a first substrate and a second substrate in which circuit elements constitutes the pixels are disposed and which are electrically connected by a connection unit. The pixels includes: photoelectric conversion elements disposed in the first substrate and generating signals corresponding to amounts of incident light; sample hold capacities disposed in the second substrate and holding output signals corresponding to the signals generated by the photoelectric conversion elements; and a clamp capacitor disposed in the second substrate, shared by the plurality of pixels, and clamping voltages of the output signals held in the plurality of sample hold capacities. The sample hold capacities and the clamp capacitor are capacities having a structure in which two sheets of metal electrodes having a quadrangular flat plate shape are opposite to each other.

Abstract translation: 固态图像捕获装置包括多个像素，并且其中电路元件构成像素的第一基板和第二基板被布置并且通过连接单元电连接。 像素包括：设置在第一基板中并产生对应于入射光量的信号的光电转换元件; 样品保持容量设置在第二衬底中并保持对应于由光电转换元件产生的信号的输出信号; 以及设置在所述第二基板中的由所述多个像素共享的钳位电容以及保持在所述多个采样保持容量中的所述输出信号的钳位电压。 样品保持容量和钳位电容器是具有两片四边形平板形状的金属电极彼此相对的结构的容量。

公开(公告)号：US09025064B2

公开(公告)日：2015-05-05

申请号：US13665333

申请日：2012-10-31

Applicant: Olympus Corporation

Inventor： Jun Aoki

IPC: H04N5/3745 ,  H04N5/374 ,  H04N5/378

CPC classification number: H04N5/3745 ,  H04N5/3742 ,  H04N5/378

Abstract: A solid-state imaging device includes: a pixel unit in which pixels each including a photoelectric conversion element are arrayed in a matrix form; a column circuit unit that includes a plurality of column processing circuits which are disposed in correspondence with columns of the pixels in the pixel unit; and an output unit that outputs a signal processed by the column processing circuit to the outside of the solid-state imaging device. The pixel unit is disposed in the 1st substrate. The column circuit unit is disposed in each of at least two or more different substrates of the 1st to nth substrates. The signal processing corresponding to the pixel of each column in the pixel unit is performed in a distributive manner by the column circuit units disposed in at least the two or more different substrates.

Abstract translation: 固态成像装置包括：像素单元，其中包括光电转换元件的像素以矩阵形式排列; 列电路单元，其包括与像素单元中的像素列相对应地设置的多个列处理电路; 以及输出单元，其将由列处理电路处理的信号输出到固态成像装置的外部。 像素单元设置在第一基板中。 列电路单元设置在第1至第n基板的至少两个或更多个不同的基板中的每一个中。 通过布置在至少两个或更多个不同基板中的列电路单元以分布方式执行与像素单元中的每列的像素相对应的信号处理。

公开(公告)号：US08842205B2

公开(公告)日：2014-09-23

申请号：US13788898

申请日：2013-03-07

Applicant: Olympus Corporation

Inventor： Jun Aoki

IPC: H04N5/335 ,  H01L27/146

CPC classification number: H01L27/14625 ,  H01L27/14605 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/14636 ,  H01L27/1464

Abstract: A first substrate has a plurality of photoelectric conversion units. A second substrate has through vias connected to the first substrate, and a plurality of photoelectric conversion units. A third substrate has vias connected to the second substrate, and a circuit that processes a signal. Wiring lines of the first substrate select the angle of a light ray that is transmitted through the first substrate and enters the second substrate.

Abstract translation: 第一基板具有多个光电转换单元。 第二基板具有连接到第一基板的通孔和多个光电转换单元。 第三基板具有连接到第二基板的通孔和处理信号的电路。 第一基板的布线选择通过第一基板透射并进入第二基板的光线的角度。

公开(公告)号：US10304892B2

公开(公告)日：2019-05-28

申请号：US15889509

申请日：2018-02-06

Applicant: OLYMPUS CORPORATION

Inventor： Jun Aoki

IPC: H01L27/146 ,  H04N5/369 ,  H04N5/225 ,  H04N5/374

Abstract: A solid-state imaging device includes a first substrate, a second substrate, a plurality of first connectors, and a plurality of second connectors. The plurality of first connectors are configured to transmit a first signal. The plurality of second connectors are configured to transmit a second signal. The first signal has at least two levels, and the levels of the first signal discretely vary between the at least two levels. The second signal is a continuous time signal. A first area of a first region is smaller than a second area of a second region. The first region is a projection region of each of the plurality of first connectors in a principal surface of the first substrate. The second region is a projection region of each of the plurality of second connectors in the principal surface.

公开(公告)号：US20140042577A1

公开(公告)日：2014-02-13

申请号：US13961456

申请日：2013-08-07

Applicant: OLYMPUS CORPORATION

Inventor： Jun Aoki

IPC: H01L27/146

CPC classification number: H01L27/14627 ,  H01L27/1461 ,  H01L27/14612 ,  H01L27/14621 ,  H01L27/14629 ,  H01L27/14634 ,  H01L27/14636

Abstract: A first substrate has a plurality of photoelectric conversion units arranged in two dimensions. A second substrate has a plurality of photoelectric conversion units arranged in two dimensions. A plurality of photoelectric conversion units are arranged in a region of the second substrate corresponding to a region of the first substrate where one photoelectric conversion unit is arranged. The imaging signals based on signal charges stored in the photoelectric conversion units and the light field signals based on signal charges stored in the photoelectric conversion units are read.

Abstract translation: 第一基板具有二维布置的多个光电转换单元。 第二基板具有以二维布置的多个光电转换单元。 多个光电转换单元布置在与设置有一个光电转换单元的第一基板的区域对应的第二基板的区域中。 读取基于存储在光电转换单元中的信号电荷的成像信号和基于存储在光电转换单元中的信号电荷的光场信号。