公开(公告)号：US11600751B2

公开(公告)日：2023-03-07

申请号：US16769586

申请日：2018-12-06

Applicant: Osram Oled GmbH

Inventor： Adrian Stefan Avramescu ,  Siegfried Herrmann ,  Alexander Behres

IPC: H01L33/50 ,  H01L27/15

Abstract: A light-emitting semiconductor component may include a semiconductor body having an active region configured to emit a primary radiation, a first conversion element to convert the primary radiation to a first secondary radiation, a second conversion element to convert the primary radiation to a second secondary radiation, and a mask. The first conversion element and the second conversion element may be arranged at a top side of the semiconductor body, may be configured as bodies that partly cover the semiconductor body, and may be connected to the semiconductor body. The mask may be arranged between the first conversion element, the second conversion element, and the semiconductor body. The mask may have an opening in the region of each conversion element.

公开(公告)号：US11527689B2

公开(公告)日：2022-12-13

申请号：US16975088

申请日：2019-02-22

Applicant: OSRAM OLED GmbH

Inventor： Frank Singer ,  Siegfried Herrmann

IPC: H01L33/62 ,  G02B6/42

Abstract: An optoelectronic assembly comprises at least two electrical contacts on a surface of an optoelectronic component for supplying electrical energy for generating electromagnetic radiation, and at least two meander-shaped contact lugs, each of which comprises a first and a second section. The first section in each case of the at least two meander-shaped contact lugs is coupled to one of the at least two electrical contacts. The second section in each case of the at least two meander-shaped contact lugs comprises a fastening element which is designed to go into a mechanical linkage to a fiber structure of a carrier and to create an electrical connection to the first section.

公开(公告)号：US20210296549A1

公开(公告)日：2021-09-23

申请号：US17264318

申请日：2019-07-25

Applicant: OSRAM OLED GMBH

Inventor： Michael Voelkl ,  Siegfried Herrmann

IPC: H01L33/62 ,  H01L33/38 ,  H01L25/16 ,  H01L33/46

Abstract: The optoelectronic semiconductor chip may include a semiconductor layer sequence having an active zone for generating radiation between a first region and a second region. The second region is electrically contacted via electrical through-connections that are electrically connected via metallic contact strips. The first region is electrically contacted via a metallic contact layer. An electrical insulation layer is located between the contact strips and the contact layer. The contact layer and the contact strips are located on a back side of the first region. The through-connections extend from the contact strips through the first region and through the active zone into the second region. The contact strips lie at least predominantly between the back side and the contact layer.

公开(公告)号：US20210214864A1

公开(公告)日：2021-07-15

申请号：US17252213

申请日：2019-05-24

Applicant: OSRAM OLED GmbH

Inventor： Michael Bestele ,  Siegfried Herrmann

IPC: D02G3/44 ,  F21S4/26 ,  D03D1/00

Abstract: An optoelectronic fiber, an apparatus for manufacturing an optoelectronic fiber and a method for manufacturing an optoelectronic fiber are disclosed. In an embodiment an optoelectronic fiber includes at least one carrier extending in a longitudinal direction, optoelectronic components arranged on the at least one carrier and a sheath extending in the longitudinal direction and surrounding the at least one carrier and the optoelectronic components, wherein the sheath includes at least one thread guided around the at least one carrier and the optoelectronic components and/or at least one tape helically wound around the at least one carrier and the optoelectronic components, wherein at least one metal wire is integrated into the sheath and twisted, braided or interwoven with the at least one thread, and wherein the at least one metal wire is electrically coupled to at least one of the optoelectronic components.

公开(公告)号：US20210005660A1

公开(公告)日：2021-01-07

申请号：US16772741

申请日：2018-12-17

Applicant: OSRAM OLED GmbH

Inventor： Siegfried Herrmann

IPC: H01L27/15 ,  H01L33/00 ,  H01L33/06 ,  H01L33/24 ,  H01L33/38 ,  H01L33/44 ,  H01L33/62

Abstract: An optoelectronic semiconductor component and a method for producing optoelectronic semiconductor components are disclosed. In an embodiment a optoelectronic semiconductor component includes a plurality of semiconductor pillars, each pillar having a tip and a base region at opposite ends, an electrical isolation layer surrounding at least part of the semiconductor pillars on side faces and at least one first electrical contact pad and at least one second electrical contact pad for energizing the semiconductor pillars, wherein a first portion of the semiconductor pillars are emitter pillars configured to generate radiation, wherein a second portion of the semiconductor pillars are non-radiating electrical contact pillars, wherein the contact pillars extend through the isolation layer such that all contact pads are located on the same side of the isolation layer, and wherein each contact pillars is coated with an electrically ohmically conductive outer layer.

公开(公告)号：US10811579B2

公开(公告)日：2020-10-20

申请号：US16073605

申请日：2017-01-26

Applicant: OSRAM OLED GmbH

Inventor： Dominik Scholz ,  Siegfried Herrmann

IPC: H01L33/62 ,  H01L21/56 ,  H01L33/48 ,  H01L23/00

Abstract: An optoelectronic component includes a light emitting semiconductor chip, including an emission side and comprising an underside, wherein the optoelectronic component is configured to emit light via the emission side, the optoelectronic component including an insulating layer, the light emitting semiconductor chip is embedded into the insulating layer, the light emitting semiconductor chip including two electrical contact locations, the contact locations face away from the emission side, a first and a second electrically conductive contact layer are provided, respectively, an electrically conductive contact layer electrically conductively connects to a contact location of the semiconductor chip, the electrically conductive contact layers are arranged in the insulating layer, the first electrically conductive contact layer adjoins a first side face of the optoelectronic component, and the second electrically conductive contact layer adjoins a second side face of the optoelectronic component.

公开(公告)号：US20200295244A1

公开(公告)日：2020-09-17

申请号：US16765192

申请日：2018-11-27

Applicant: OSRAM OLED GmbH

Inventor： Siegfried Herrmann ,  Michael Völkl

IPC: H01L33/58 ,  H01L33/62 ,  H01L33/50 ,  H01L33/56 ,  H01L25/075

Abstract: An optoelectronic component, having an optoelectronic semiconductor chip, includes a substrate, wherein at least two light-emitting sections are arranged laterally next to one another over an upper side of the substrate, the light-emitting sections are separately controllable, the light-emitting sections generate electromagnetic radiation from different spectral ranges, the light-emitting sections are formed by a layer sequence, an active region is formed inside the layer sequence, trenches are formed between the light-emitting sections, and the trenches fully divide the active region so that the light-emitting sections are separated from one another.

公开(公告)号：US10651356B2

公开(公告)日：2020-05-12

申请号：US15663984

申请日：2017-07-31

Applicant: OSRAM OLED GmbH

Inventor： Siegfried Herrmann

IPC: H01L33/60 ,  H01L25/075 ,  H01L33/62 ,  H01L33/38 ,  F21Y115/10

Abstract: A light-emitting component includes at least two radiation-emitting semiconductor chips of a first type configured to emit electromagnetic radiation during operation, and a light exit surface at a light exit side of the light-emitting component, wherein each of the radiation-emitting semiconductor chips of the first type includes a semiconductor layer sequence with a stacking direction, the stacking direction of each radiation-emitting semiconductor chip of the first type is parallel to the light exit surface of the component, and all the semiconductor chips of the first type are arranged directly below the light exit surface.

公开(公告)号：US11211533B2

公开(公告)日：2021-12-28

申请号：US16765192

申请日：2018-11-27

Applicant: OSRAM OLED GmbH

Inventor： Siegfried Herrmann ,  Michael Völkl

IPC: H01L33/58 ,  H01L25/075 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62

Abstract: An optoelectronic component, having an optoelectronic semiconductor chip, includes a substrate, wherein at least two light-emitting sections are arranged laterally next to one another over an upper side of the substrate, the light-emitting sections are separately controllable, the light-emitting sections generate electromagnetic radiation from different spectral ranges, the light-emitting sections are formed by a layer sequence, an active region is formed inside the layer sequence, trenches are formed between the light-emitting sections, and the trenches fully divide the active region so that the light-emitting sections are separated from one another.

公开(公告)号：US11038083B2

公开(公告)日：2021-06-15

申请号：US16323370

申请日：2017-08-04

Applicant: OSRAM OLED GmbH

Inventor： Frank Singer ,  Siegfried Herrmann

IPC: H01L33/24 ,  H01L33/08 ,  H01L33/38 ,  H01L33/40 ,  H01L33/44

Abstract: An optoelectronic semiconductor chip includes a plurality of core-shell rods that generate electromagnetic radiation spaced apart from each other; a first electrically conductive contact structure for n-side electrical contacting of the core-shell rods; and a second electrically conductive contact structure for p-side electrical contacting of the core-shell rods, wherein the first electrically conductive contact structure and the second electrically conductive contact structure overlap at least in sections in a vertical direction, the optoelectronic semiconductor chip is surface mountable on a mounting side, and at least a partial region of the two electrically conductive contact structures extends through a breakthrough through at least one layer of the optoelectronic semiconductor chip.