Light-Emitting Semiconductor Chip and Display Device

    公开(公告)号:US20200273907A1

    公开(公告)日:2020-08-27

    申请号:US16633826

    申请日:2018-07-31

    Abstract: A light-emitting semiconductor chip and a display device are disclosed. In an embodiment a light-emitting semiconductor chip includes an emission surface formed with a plurality of first emission regions and second emission regions, wherein the first emission regions and the second emission regions are configured to emit light of a predeterminable color location, wherein the first and second emission regions are separately controllable from each other, wherein the first emission regions and second emission regions are arranged next to one another in a first plane, wherein all second emission regions form at least a part of an outer edge of the emission surface, and wherein the first emission regions have a smaller extent than the second emission regions along at least one direction lying in the first plane.

    OPTOELECTRONIC ASSEMBLY, METHOD AND MOLDED PART

    公开(公告)号:US20210091283A1

    公开(公告)日:2021-03-25

    申请号:US16975088

    申请日:2019-02-22

    Abstract: An optoelectronic assembly comprises at least two electrical contacts on a surface of an optoelectronic component for supplying electrical energy for generating electromagnetic radiation, and at least two meander-shaped contact lugs, each of which comprises a first and a second section. The first section in each case of the at least two meander-shaped contact lugs is coupled to one of the at least two electrical contacts. The second section in each case of the at least two meander-shaped contact lugs comprises a fastening element which is designed to go into a mechanical linkage to a fiber structure of a carrier and to create an electrical connection to the first section.

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