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1.发明申请公开(公告)号：US20230031493A1
公开(公告)日：2023-02-02
申请号：US17960794
申请日：2022-10-05
Applicant: OSRAM OLED GmbH
Inventor： Markus PINDL , Thomas SCHWARZ , Frank SINGER , Sandra SOBCZYK
IPC: H01L33/54 , H01L33/00 , H01L31/0203 , H01L31/0232 , H01L31/18 , H01L33/50
Abstract: The invention relates to a method for producing a plurality of optoelectronic semiconductor components, including the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.
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公开(公告)号：US20200219436A1
公开(公告)日：2020-07-09
申请号：US16648812
申请日：2018-09-20
Applicant: OSRAM OLED GmbH
Inventor： Frank SINGER , Thomas SCHWARZ , Thorsten Frank BAUMHEINRICH , Hubert HALBRITTER
IPC: G09G3/32
Abstract: An arrangement includes a semiconductor chip with a first and second electrode. The arrangement also includes a control unit for adjusting a current for operating the semiconductor chip, a first LED voltage input coupled to the first electrode, and a reference voltage input coupled to the second electrode. The arrangement further includes an LED data input coupled to the control unit, by which a data parameter representative of a current for operating the semiconductor chip is provided. The arrangement additionally includes a cycle input coupled to the control unit, by which a reference cycle signal is provided which is representative of an operating phase of the arrangement. The control unit includes a memory arranged to record the data parameter as a memory value depending on the reference cycle signal. The control unit is configured to adjust the current depending on the memory value.
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3.发明申请公开(公告)号：US20210175397A1
公开(公告)日：2021-06-10
申请号：US17181458
申请日：2021-02-22
Applicant: OSRAM OLED GmbH
Inventor： Markus PINDL , Thomas SCHWARZ , Frank SINGER , Sandra SOBCZYK
IPC: H01L33/54 , H01L33/50 , H01L33/00 , H01L31/18 , H01L31/0232 , H01L31/0203 , H01L33/48 , H01L21/56 , H01L33/56
Abstract: The invention relates to a method for producing a plurality of optoelectronic semiconductor components, including the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.
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公开(公告)号：US20200273842A1
公开(公告)日：2020-08-27
申请号：US16753638
申请日：2018-09-21
Applicant: OSRAM OLED GmbH
Inventor： Peter BRICK , Hubert HALBRITTER , Mikko PERAELAE , Joachim REILL , Frank SINGER
Abstract: An optoelectronic module is provided with: a carrier with a main plane of extension, a first emission region with a plurality of emitters of a first type, which are configured to emit light of at least one predeterminable first color location during operation of the optoelectronic module, a second emission region with a plurality of emitters of a second type, which are configured to emit light of at least one predeterminable second color location during operation of the optoelectronic module, and a third emission region with a plurality of emitters of a third type, which are configured to emit light of at least one predeterminable third color location during operation of the optoelectronic module, wherein the emission regions are arranged spaced apart from each other on the carrier. In addition, a display element with a plurality of optoelectronic modules is specified.
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5.发明申请公开(公告)号：US20200266321A1
公开(公告)日：2020-08-20
申请号：US16866890
申请日：2020-05-05
Applicant: OSRAM OLED GmbH
Inventor： Markus PINDL , Thomas SCHWARZ , Frank SINGER , Sandra SOBCZYK
IPC: H01L33/54 , H01L33/50 , H01L31/18 , H01L31/0232 , H01L31/0203 , H01L33/00
Abstract: The invention relates to a method for producing a plurality of optoelectronic semiconductor components, comprising the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.
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Patent Agency Ranking
公开(公告)号：US20240088622A1
公开(公告)日：2024-03-14
申请号：US18515928
申请日：2023-11-21
Applicant: OSRAM OLED GmbH
Inventor： Jörg Erich SORG , Harald KÖNIG , Alfred LELL , Florian PESKOLLER , Karsten AUEN , Roland SCHULZ , Herbert BRUNNER , Frank SINGER , Roland HÜTTINGER
IPC: H01S5/028 , H01S5/02253 , H01S5/02326 , H01S5/0236
CPC classification number: H01S5/028 , H01S5/02253 , H01S5/02326 , H01S5/0236 , H01S5/0087
Abstract: In one embodiment the semiconductor laser comprises a carrier and an edge-emitting laser diode which is mounted on the carrier and which comprises an active zone for generating a laser radiation and a facet with a radiation exit region. The semiconductor laser further comprises a protective cover, preferably a lens for collimation of the laser radiation. The protective cover is fastened to the facet and to a side surface of the carrier by means of an adhesive. A mean distance between a light entrance side of the protective cover and the facet is at most 60 μm. The semiconductor laser is configured to be operated in a normal atmosphere without additional gas-tight encapsulation.
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公开(公告)号：US20230068945A1
公开(公告)日：2023-03-02
申请号：US17971156
申请日：2022-10-21
Applicant: OSRAM OLED GmbH
Inventor： Jörg Erich SORG , Harald KÖNIG , Alfred LELL , Florian PESKOLLER , Karsten AUEN , Roland SCHULZ , Herbert BRUNNER , Frank SINGER , Roland HÜTTINGER
IPC: H01S5/028 , H01S5/0236 , H01S5/02253 , H01S5/02326
Abstract: In one embodiment the semiconductor laser comprises a carrier and an edge-emitting laser diode which is mounted on the carrier and which comprises an active zone for generating a laser radiation and a facet with a radiation exit region. The semiconductor laser further comprises a protective cover, preferably a lens for collimation of the laser radiation. The protective cover is fastened to the facet and to a side surface of the carrier by means of an adhesive. A mean distance between a light entrance side of the protective cover and the facet is at most 60 μm. The semiconductor laser is configured to be operated in a normal atmosphere without additional gas-tight encapsulation.
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公开(公告)号：US20210285607A1
公开(公告)日：2021-09-16
申请号：US17259064
申请日：2019-07-10
Applicant: OSRAM OLED GmbH
Inventor： Frank SINGER , Ralph BERTRAM , Andreas DOBNER , Andreas WALDSCHIK
IPC: F21S4/20 , F21V9/30 , H01L25/075 , H01L33/54 , B29C48/30 , B29C48/154 , B29C48/06
Abstract: A placement device for placing optoelectronic components on electrical lines includes a holding device for holding at least one electric line extending in a longitudinal direction, and an application device for arranging optoelectronic components on the at least one electrical line.
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公开(公告)号：US20210020620A1
公开(公告)日：2021-01-21
申请号：US16979887
申请日：2019-03-13
Applicant: Osram OLED GmbH
Inventor： Britta GOEOETZ , Frank SINGER
IPC: H01L25/16 , H01L25/075 , H01L33/62 , H01L33/50 , F21S41/141
Abstract: Optoelectronic components are described that may include a plurality of light-emitting regions arranged on a carrier substrate. Microwires may project relative to a main surface of the carrier substrate. A plurality of microwires may be arranged between each pair of adjacent light-emitting regions. The light-emitting regions may each be surrounded by rows of microwires.
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公开(公告)号：US20200313399A1
公开(公告)日：2020-10-01
申请号：US16754723
申请日：2018-10-08
Applicant: OSRAM OLED GmbH
Inventor： Jörg Erich SORG , Harald KÖNIG , Alfred LELL , Florian PESKOLLER , Karsten AUEN , Roland SCHULZ , Herbert BRUNNER , Frank SINGER , Roland HÜTTINGER
Abstract: In one embodiment the semiconductor laser (1) comprises a carrier (2) and an edge-emitting laser diode (3) which is mounted on the carrier (2) and which comprises an active zone (33) for generating a laser radiation (L) and a facet (30) with a radiation exit region (31). The semiconductor laser (1) further comprises a protective cover (4), preferably a lens for collimation of the laser radiation (L). The protective cover (4) is fastened to the facet (30) and to a side surface (20) of the carrier (2) by means of an adhesive (5). A mean distance between a light entrance side (41) of the protective cover (4) and the facet (30) is at most 60 μm. The semiconductor laser (1) is configured to be operated in a normal atmosphere without additional gas-tight encapsulation.
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