公开(公告)号：US08969735B2

公开(公告)日：2015-03-03

申请号：US13802701

申请日：2013-03-13

Applicant: Palo Alto Research Center Incorporated

Inventor： Eugene M. Chow ,  Dirk DeBruyker

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H01L23/5387 ,  H01L23/49811 ,  H01L23/5385 ,  H01L2924/0002 ,  H05K1/0283 ,  H05K1/113 ,  H05K1/189 ,  H05K3/365 ,  H05K3/368 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/0397 ,  H01L2924/00

Abstract: A flexible metal interconnect structure for transmitting signals between IC devices in flexible electronic devices is formed between two compliant flexible material layers that are laminated together form a multi-layer flexible substrate. The interconnect structure is formed by two rows of spaced-apart conductive pads (metal islands) attached to the inside (facing) surfaces of the flexible material layers. Compliant micro-contact elements such as micro-springs provide sliding metal pressure contacts that maintain electrical connections between the islands during stretching of the composite sheet. Specifically, at least two micro-contact elements are attached to each metal island in one of the rows, with one element in sliding pressure contact with an associated first metal island in the opposing row and the second element in sliding pressure contact with an associated second metal island. The islands and sliding contacts can be patterned into high density traces that accommodate large strains.

Abstract translation: 用于在柔性电子器件中的IC器件之间传输信号的柔性金属互连结构形成在层压在一起形成多层柔性衬底的两个柔性柔性材料层之间。 互连结构由连接到柔性材料层的内侧（面向）表面的两排间隔开的导电焊盘（金属岛）形成。 合适的微接触元件例如微弹簧提供滑动金属压力接触件，其在拉伸复合片材期间保持岛之间的电连接。 具体地，至少两个微接触元件附接到行中的一个中的每个金属岛，其中一个元件与相对行中的相关联的第一金属岛滑动压力接触，并且第二元件与相关联的第二元件滑动压力接触 金属岛。 岛和滑动触点可以被图案化成适应大应变的高密度迹线。