公开(公告)号：US20220087032A1

公开(公告)日：2022-03-17

申请号：US17426310

申请日：2019-12-24

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. ,  Fukuda Metal Foil & Powder Co., Ltd.

Inventor： Yuki KITAI ,  Takeshi OKAMOTO

IPC: H05K3/38 ,  H05K1/09

Abstract: A surface treated copper foil includes: a copper foil; a finely roughened particle treatment layer of copper on at least one surface of the copper foil, the finely roughened particle treatment layer including fine copper particles having a particle size of 40 to 200 nm; a heat resistance treatment layer containing nickel on the finely roughened particle treatment layer; a rust prevention treatment layer containing at least chromium on the heat resistance treatment layer; and a silane coupling agent treatment layer on the rust prevention treatment layer. An amount of nickel attached in the heat resistance treatment layer is 30 to 60 mg/m2.

公开(公告)号：US20210269595A1

公开(公告)日：2021-09-02

申请号：US17256382

申请日：2019-07-09

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Mikio SATO ,  Yuki KITAI ,  Yasunori HOSHINO ,  Masashi KODA ,  Atsushi WADA

IPC: C08G65/48 ,  C08J5/24 ,  C08F290/06 ,  H05K1/03

Abstract: An aspect of the present invention is a resin composition containing a compound (A) having at least one group represented by the following Formula (1) in a molecule and an acenaphthylene compound (B). In Formula (1), n represents 0 to 10, Z represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group.

公开(公告)号：US20200270411A1

公开(公告)日：2020-08-27

申请号：US16649920

申请日：2018-09-28

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Yuki KITAI ,  Mikio SATO ,  Yasunori HOSHINO ,  Masashi KODA ,  Takayoshi OZEKI ,  Hiroaki FUJIWARA

IPC: C08J5/24 ,  C08G65/48 ,  C08J3/24 ,  B32B15/08 ,  H05K1/03

Abstract: A prepreg includes a resin composition or a semi-cured product of the resin composition, and a glass cloth, wherein the resin composition contains a modified polyphenylene ether compound terminally modified with a substituent having an unsaturated carbon-carbon double bond, and a crosslinkable curing agent having an unsaturated carbon-carbon double bond in a molecule, a content of the modified polyphenylene ether compound is 40 to 90 mass % with respect to a total mass of the modified polyphenylene ether compound and the crosslinkable curing agent, a cured product of the resin composition has a relative permittivity of 2.6 to 3.8, the glass cloth has a relative permittivity of 4.7 or less and a dielectric loss tangent of 0.0033 or less, and a cured product of the prepreg has a relative permittivity of 2.7 to 3.8 and a dielectric loss tangent of 0.002 or less.

公开(公告)号：US20150359093A1

公开(公告)日：2015-12-10

申请号：US14831235

申请日：2015-08-20

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Hiroaki FUJIWARA ,  Masao IMAI ,  Yuki KITAI

IPC: H05K1/03 ,  C08K5/06 ,  C08K5/03 ,  C08K5/3417 ,  C09D163/00 ,  C08J5/24

CPC classification number: H05K1/0373 ,  C08G59/4014 ,  C08J5/24 ,  C08J2363/00 ,  C08J2371/12 ,  C08K5/0025 ,  C08K5/0066 ,  C08K5/03 ,  C08K5/06 ,  C08K5/315 ,  C08K5/3417 ,  C08L63/00 ,  C08L71/12 ,  C08L79/04 ,  C09D163/00 ,  H05K1/0353 ,  H05K2201/012 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/31529 ,  C08L2666/14 ,  C08L2666/22

Abstract: It is an object of the present invention to provide an epoxy resin composition containing an epoxy compound, a low-molecular-weight phenol-modified polyphenylene ether and a cyanate compound as essential components, the epoxy resin composition having excellent dielectric characteristics and exhibiting high heat resistance while maintaining flame retardancy. To achieve this, the epoxy resin composition of the present invention is a thermosetting resin composition composed of a resin varnish containing (A) an epoxy compound having a number-average molecular weight of 1000 or less and containing at least two epoxy groups in the molecule without containing any halogen atoms, (B) a polyphenylene ether having a number-average molecular weight of 5000 or less, (C) a cyanate ester compound, (D) a curing catalyst and (E) a halogen flame retardant, all of the components (A) to (C) are dissolved in the resin varnish, while component (E) is dispersed without being dissolved in the resin varnish.

Abstract translation: 本发明的目的是提供一种含有环氧化合物，低分子量苯酚改性聚苯醚和氰酸酯化合物作为必要组分的环氧树脂组合物，该环氧树脂组合物具有优异的介电特性并表现出高热 阻力同时保持阻燃性。 为了实现这一点，本发明的环氧树脂组合物是由包含（A）数均分子量为1000以下且在分子中含有至少两个环氧基的环氧化合物的树脂清漆组成的热固性树脂组合物 不含任何卤素原子，（B）数均分子量为5000以下的聚苯醚，（C）氰酸酯化合物，（D）固化催化剂和（E）卤素阻燃剂，全部为 组分（A）至（C）溶解在树脂清漆中，而组分（E）分散而不溶解在树脂清漆中。

公开(公告)号：US20230257578A1

公开(公告)日：2023-08-17

申请号：US18015864

申请日：2021-07-13

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Mikio SATO ,  Yuki KITAI ,  Yasunori HOSHINO

IPC: C08L71/12 ,  C08K3/38 ,  C08J5/24 ,  H05K1/03

CPC classification number: C08L71/123 ,  C08K3/38 ,  C08J5/244 ,  H05K1/0366 ,  C08K2003/385 ,  C08J2371/12 ,  C08J2453/02

Abstract: A resin composition includes: a polyphenylene ether compound; a curing agent reactable with the polyphenylene ether compound; and an inorganic filler including a boron nitride filler, wherein a particle size distribution of the inorganic filler, which is measured by a laser diffraction-based particle size distribution measuring method, has at least two peaks in a particle diameter range of 0.8 to 30.0 μm, the peaks including at least one peak in a particle diameter range of 0.8 to 5.0 μm and at least one peak in a particle diameter range of 5.0 to 30.0 μm.

公开(公告)号：US20230212392A1

公开(公告)日：2023-07-06

申请号：US17927795

申请日：2021-04-15

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Lin LIN ,  Yuki KITAI

IPC: C08L71/08 ,  C08K7/18 ,  C08K7/22 ,  C08J5/24 ,  C08J7/04 ,  H05K1/03

CPC classification number: C08L71/08 ,  C08K7/18 ,  C08K7/22 ,  C08J5/24 ,  C08J7/0427 ,  H05K1/0353 ,  C08L2207/53 ,  C08J2371/08

Abstract: A resin composition for wiring board material contains a thermosetting resin and a thermally expandable microcapsule, in which the relative dielectric constant (10 GHz) of a cured product of the resin composition is more than 1.0 and 2.2 or less.

公开(公告)号：US20220389189A1

公开(公告)日：2022-12-08

申请号：US17763105

申请日：2020-09-03

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Mikio SATO ,  Yuki KITAI ,  Yasunori HOSHINO

IPC: C08K3/38 ,  C08K5/3492 ,  C08K3/26 ,  C08K9/06 ,  C08K3/22 ,  C08J5/24 ,  H05K1/03

Abstract: An aspect of the present invention is a resin composition, which contains a polyphenylene ether compound, a curing agent, boron nitride, and an inorganic filler other than the boron nitride, in which the content of boron nitride is 15 to 70 parts by volume with respect to 100 parts by volume of the sum of the polyphenylene ether compound and the curing agent.

公开(公告)号：US20220275122A1

公开(公告)日：2022-09-01

申请号：US17632038

申请日：2020-07-30

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Masashi KODA ,  Yuki KITAI ,  Atsushi WADA ,  Yasunori HOSHINO

IPC: C08F212/08 ,  C08L25/10 ,  C08K3/36 ,  C08J5/24 ,  C08J5/18 ,  H05K1/03 ,  B32B5/02 ,  B32B5/26 ,  B32B15/20 ,  B32B15/14

Abstract: A resin composition is provided containing a polymer having a structural unit represented by the following Formula (1) in the molecule, and an inorganic filler, in which the inorganic filler contains silica in which a ratio of a number of Si atoms contained in silanol groups to a total number of Si atoms is 3% or less. In Formula (1), Z represents an arylene group, R1 to R3 each independently represent a hydrogen atom or an alkyl group, and R4 to R6 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.

公开(公告)号：US20220220272A1

公开(公告)日：2022-07-14

申请号：US17609695

申请日：2020-05-14

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Yuki KITAI ,  Masashi KODA ,  Yasunori HOSHINO ,  Atsushi WADA ,  Mikio SATO

IPC: C08J7/06 ,  H05K1/03 ,  H05K3/02

Abstract: A copper clad laminate includes: an insulating layer containing a cured product of a resin composition; and a surface treated copper foil on one surface or both surfaces of the insulating layer, the resin composition containing a polymer, and the surface treated copper foil including a finely roughened particle treatment layer of copper on at least one surface side of a copper foil, the finely roughened particle treatment layer being formed of fine copper particles having a particle size of 40 to 200 nm, a heat resistance treatment layer containing nickel provided on the finely roughened particle treatment layer, a rust prevention treatment layer containing at least chromium provided on the heat resistance treatment layer, a silane coupling agent layer provided on the rust prevention treatment layer, and an amount of nickel attached in the heat resistance treatment layer being 30 to 60 mg/m2.

公开(公告)号：US20210246251A1

公开(公告)日：2021-08-12

申请号：US17050671

申请日：2019-04-22

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Mikio SATO ,  Hiroaki FUJIWARA ,  Yuki KITAI ,  Masashi KODA ,  Yasunori HOSHINO ,  Takayoshi OZEKI

IPC: C08F290/06 ,  C08J5/24 ,  B32B15/08 ,  B32B27/28 ,  H05K1/03

Abstract: A resin composition is provided and contains a compound (A) having at least one group represented by the following Formula (1) in a molecule, a crosslinking type curing agent (B), and an azo compound (C) that has an azo group in a molecule and has no heteroatom other than a nitrogen atom constituting the azo group. In Formula (1), n represents 0 to 10, Z represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group.