公开(公告)号：US20150359093A1

公开(公告)日：2015-12-10

申请号：US14831235

申请日：2015-08-20

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Hiroaki FUJIWARA ,  Masao IMAI ,  Yuki KITAI

IPC: H05K1/03 ,  C08K5/06 ,  C08K5/03 ,  C08K5/3417 ,  C09D163/00 ,  C08J5/24

CPC classification number: H05K1/0373 ,  C08G59/4014 ,  C08J5/24 ,  C08J2363/00 ,  C08J2371/12 ,  C08K5/0025 ,  C08K5/0066 ,  C08K5/03 ,  C08K5/06 ,  C08K5/315 ,  C08K5/3417 ,  C08L63/00 ,  C08L71/12 ,  C08L79/04 ,  C09D163/00 ,  H05K1/0353 ,  H05K2201/012 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/31529 ,  C08L2666/14 ,  C08L2666/22

Abstract: It is an object of the present invention to provide an epoxy resin composition containing an epoxy compound, a low-molecular-weight phenol-modified polyphenylene ether and a cyanate compound as essential components, the epoxy resin composition having excellent dielectric characteristics and exhibiting high heat resistance while maintaining flame retardancy. To achieve this, the epoxy resin composition of the present invention is a thermosetting resin composition composed of a resin varnish containing (A) an epoxy compound having a number-average molecular weight of 1000 or less and containing at least two epoxy groups in the molecule without containing any halogen atoms, (B) a polyphenylene ether having a number-average molecular weight of 5000 or less, (C) a cyanate ester compound, (D) a curing catalyst and (E) a halogen flame retardant, all of the components (A) to (C) are dissolved in the resin varnish, while component (E) is dispersed without being dissolved in the resin varnish.

Abstract translation: 本发明的目的是提供一种含有环氧化合物，低分子量苯酚改性聚苯醚和氰酸酯化合物作为必要组分的环氧树脂组合物，该环氧树脂组合物具有优异的介电特性并表现出高热 阻力同时保持阻燃性。 为了实现这一点，本发明的环氧树脂组合物是由包含（A）数均分子量为1000以下且在分子中含有至少两个环氧基的环氧化合物的树脂清漆组成的热固性树脂组合物 不含任何卤素原子，（B）数均分子量为5000以下的聚苯醚，（C）氰酸酯化合物，（D）固化催化剂和（E）卤素阻燃剂，全部为 组分（A）至（C）溶解在树脂清漆中，而组分（E）分散而不溶解在树脂清漆中。