Parallel thermoelectric heat exchange systems
    12.
    发明授权
    Parallel thermoelectric heat exchange systems 有权
    平行热电换热系统

    公开(公告)号:US08991194B2

    公开(公告)日:2015-03-31

    申请号:US13867589

    申请日:2013-04-22

    Abstract: Embodiments of the present disclosure relate to controlling multiple Thermoelectric Coolers (TECs) to maintain a set point temperature of a chamber. In one embodiment, a controller receives temperature data corresponding to a temperature of the chamber. Based on the temperature data, the controller selectively controls two or more subsets of the TECs to maintain the temperature of the chamber at a desired set point temperature. In this manner, the controller is enabled to control the TECs such that the TECs operate to efficiently maintain the temperature of the chamber at the set point temperature. In another embodiment, the controller selects one or more control schemes enabled by the controller based on temperature data and a desired performance profile. The controller then independently controls one or more subsets of the TECs according to the selected control scheme(s).

    Abstract translation: 本公开的实施例涉及控制多个热电冷却器(TEC)以保持室的设定点温度。 在一个实施例中,控制器接收对应于室的温度的温度数据。 基于温度数据,控制器选择性地控制TEC的两个或多个子集以将腔室的温度保持在期望的设定点温度。 以这种方式,控制器能够控制TEC,使得TEC操作以有效地将室的温度保持在设定点温度。 在另一个实施例中,控制器基于温度数据和期望的性能轮廓来选择由控制器启用的一个或多个控制方案。 然后,控制器根据所选择的控制方案独立地控制TEC的一个或多个子集。

    Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance
    13.
    发明授权
    Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance 有权
    热电换热器组件包括保护散热盖和最佳热界面电阻

    公开(公告)号:US08893513B2

    公开(公告)日:2014-11-25

    申请号:US13888847

    申请日:2013-05-07

    Abstract: A thermoelectric heat exchanger component includes a circuit board and multiple thermoelectric devices attached to the circuit board. Heights of at least two of the thermoelectric devices are different due to, for example, tolerances in a manufacturing process for the thermoelectric devices. The thermoelectric heat exchanger component also includes a first heat spreading lid over a first surface of the thermoelectric devices and a second heat spreading lid over a second surface of the thermoelectric devices. A thermal interface material is present between each one of the thermoelectric devices and the first and second heat spreading lids. The first heat spreading lid and the second heat spreading lid are oriented such that the thickness of the thermal interface material, and thus a thermal interface resistance, is optimized for the thermoelectric devices.

    Abstract translation: 热电换热器部件包括电路板和附接到电路板的多个热电装置。 至少两个热电装置的高度由于例如热电装置的制造工艺中的公差而不同。 热电换热器部件还包括热电装置的第一表面上的第一散热盖和热电装置的第二表面上的第二散热盖。 在每个热电器件和第一和第二散热盖之间存在热界面材料。 第一散热盖和第二散热盖被定向成使得热界面材料的厚度以及因此的热界面电阻被优化用于热电装置。

    TWO-PHASE HEAT EXCHANGER MOUNTING
    14.
    发明申请
    TWO-PHASE HEAT EXCHANGER MOUNTING 有权
    两相热交换器安装

    公开(公告)号:US20130291563A1

    公开(公告)日:2013-11-07

    申请号:US13888833

    申请日:2013-05-07

    Abstract: Embodiments of the present disclosure relate to controlling multiple Thermoelectric Coolers (TECs) to maintain a set point temperature of a chamber. In one embodiment, a controller receives temperature data corresponding to a temperature of the chamber. Based on the temperature data, the controller selectively controls two or more subsets of the TECs to maintain the temperature of the chamber at a desired set point temperature. In this manner, the controller is enabled to control the TECs such that the TECs operate to efficiently maintain the temperature of the chamber at the set point temperature. In another embodiment, the controller selects one or more control schemes enabled by the controller based on temperature data and a desired performance profile. The controller then independently controls one or more subsets of the TECs according to the selected control scheme(s).

    Abstract translation: 本公开的实施例涉及控制多个热电冷却器(TEC)以保持室的设定点温度。 在一个实施例中,控制器接收对应于室的温度的温度数据。 基于温度数据,控制器选择性地控制TEC的两个或多个子集以将腔室的温度保持在期望的设定点温度。 以这种方式,控制器能够控制TEC,使得TEC操作以有效地将室的温度保持在设定点温度。 在另一个实施例中,控制器基于温度数据和期望的性能轮廓来选择由控制器启用的一个或多个控制方案。 然后,控制器根据所选择的控制方案独立地控制TEC的一个或多个子集。

    CARTRIDGE FOR MULTIPLE THERMOELECTRIC MODULES
    15.
    发明申请
    CARTRIDGE FOR MULTIPLE THERMOELECTRIC MODULES 审中-公开
    多个热电模块的盒子

    公开(公告)号:US20130291560A1

    公开(公告)日:2013-11-07

    申请号:US13867567

    申请日:2013-04-22

    Abstract: Embodiments of the present disclosure relate to controlling multiple Thermoelectric Coolers (TECs) to maintain a set point temperature of a chamber. In one embodiment, a controller receives temperature data corresponding to a temperature of the chamber. Based on the temperature data, the controller selectively controls two or more subsets of the TECs to maintain the temperature of the chamber at a desired set point temperature. In this manner, the controller is enabled to control the TECs such that the TECs operate to efficiently maintain the temperature of the chamber at the set point temperature. In another embodiment, the controller selects one or more control schemes enabled by the controller based on temperature data and a desired performance profile. The controller then independently controls one or more subsets of the TECs according to the selected control scheme(s).

    Abstract translation: 本公开的实施例涉及控制多个热电冷却器(TEC)以保持室的设定点温度。 在一个实施例中,控制器接收对应于室的温度的温度数据。 基于温度数据,控制器选择性地控制TEC的两个或多个子集以将腔室的温度保持在期望的设定点温度。 以这种方式,控制器能够控制TEC,使得TEC操作以有效地将室的温度保持在设定点温度。 在另一个实施例中,控制器基于温度数据和期望的性能轮廓来选择由控制器启用的一个或多个控制方案。 然后,控制器根据所选择的控制方案独立地控制TEC的一个或多个子集。

    THERMOELECTRIC HEAT EXCHANGER COMPONENT INCLUDING PROTECTIVE HEAT SPREADING LID AND OPTIMAL THERMAL INTERFACE RESISTANCE
    16.
    发明申请
    THERMOELECTRIC HEAT EXCHANGER COMPONENT INCLUDING PROTECTIVE HEAT SPREADING LID AND OPTIMAL THERMAL INTERFACE RESISTANCE 有权
    热电换热器组件包括保护热传递盖和最佳的热接触电阻

    公开(公告)号:US20130291559A1

    公开(公告)日:2013-11-07

    申请号:US13888847

    申请日:2013-05-07

    Abstract: Embodiments of a thermoelectric heat exchanger component having a heat spreading lid that optimizes thermal interface resistance between the heat spreading lid and multiple thermoelectric devices and methods of fabrication thereof are disclosed. In one embodiment, a thermoelectric heat exchanger component includes a circuit board and multiple thermoelectric devices attached to the circuit board. Heights of at least two of the thermoelectric devices are different due to, for example, tolerances in a manufacturing process for the thermoelectric devices. The thermoelectric heat exchanger component also includes a heat spreading lid over the thermoelectric devices and a thermal interface material between the thermoelectric devices and the heat spreading lid. An orientation (i.e., a tilt) of the heat spreading lid is such that a thickness of the thermal interface material, and thus a thermal interface resistance, is optimized for the thermoelectric devices.

    Abstract translation: 公开了一种具有散热盖的散热盖的优化热传导盖和多个热电元件之间的热界面电阻的热电换热器部件的实施例及其制造方法。 在一个实施例中,热电换热器部件包括电路板和附接到电路板的多个热电装置。 至少两个热电装置的高度由于例如热电装置的制造工艺中的公差而不同。 热电换热器部件还包括热电装置上的散热盖和热电装置与散热盖之间的热界面材料。 散热盖的取向(即,倾斜)使得热界面材料的厚度以及因此的热界面电阻被优化用于热电装置。

    SYSTEMS AND METHODS FOR MITIGATING HEAT REJECTION LIMITATIONS OF A THERMOELECTRIC MODULE
    17.
    发明申请
    SYSTEMS AND METHODS FOR MITIGATING HEAT REJECTION LIMITATIONS OF A THERMOELECTRIC MODULE 审中-公开
    减少热电模块热限制的系统和方法

    公开(公告)号:US20160018141A1

    公开(公告)日:2016-01-21

    申请号:US14849232

    申请日:2015-09-09

    CPC classification number: F25B21/04 F25B2321/0212 H01L35/02

    Abstract: Systems and methods for mitigating heat rejection limitations of a thermoelectric module are disclosed. In some embodiments, a method of operating a thermoelectric module includes providing a first amount of power to the thermoelectric module and determining that a temperature of a hot side of the thermoelectric module is above a first threshold. The method also includes, in response to determining that the temperature of the hot side is above the first threshold, providing a second amount of power to the thermoelectric module that is less than the first amount of power. The method also includes determining that the temperature of the hot side of the thermoelectric module is below a second threshold and providing a third amount of power to the thermoelectric module. In some embodiments, this mitigates heat rejection limitations of the thermoelectric module, especially when the hot side of the thermoelectric module is passively cooled.

    Abstract translation: 公开了一种用于减轻热电模块的排热限制的系统和方法。 在一些实施例中,操作热电模块的方法包括向热电模块提供第一量的功率并且确定热电模块的热侧的温度高于第一阈值。 该方法还包括响应于确定热侧的温度高于第一阈值,向热电模块提供小于第一功率量的第二量的功率。 该方法还包括确定热电模块的热侧的温度低于第二阈值并且向热电模块提供第三量的功率。 在一些实施例中,这减轻了热电模块的排热限制,特别是当热电模块的热侧被动冷却时。

    THERMOELECTRIC HEAT PUMP WITH A SURROUND AND SPACER (SAS) STRUCTURE
    18.
    发明申请
    THERMOELECTRIC HEAT PUMP WITH A SURROUND AND SPACER (SAS) STRUCTURE 有权
    具有环绕和间隔(SAS)结构的热电加热泵

    公开(公告)号:US20150116943A1

    公开(公告)日:2015-04-30

    申请号:US14525843

    申请日:2014-10-28

    Abstract: A heat pump includes a SAS structure with a wall defining a first open side and a second open side. The heat pump also includes an interconnect board, enclosed within the SAS structure including openings. Thermoelectric modules are mounted on the interconnect board at the locations defined by the openings. The heat pump additionally includes a hot-side heat spreader that is in thermal contact with the first side of each thermoelectric module and a cold-side heat spreader that is in thermal contact with the second side of each thermoelectric module. The periphery of the hot-side heat spreader mechanically contacts the wall of the SAS structure at the first open side, and the periphery of the cold-side heat spreader mechanically contacts the wall of the SAS structure at the second open side such that any compression force applied to the heat pump is absorbed by the SAS structure.

    Abstract translation: 热泵包括具有限定第一开口侧和第二开放侧的壁的SAS结构。 热泵还包括封装在包括开口的SAS结构内的互连板。 热电模块在由开口限定的位置处安装在互连板上。 热泵还包括与每个热电模块的第一侧热接触的热侧散热器和与每个热电模块的第二侧热接触的冷侧散热器。 热侧散热器的周边在第一开口侧机械地接触SAS结构的壁,并且冷侧散热器的周边在第二开放侧机械地接触SAS结构的壁,使得任何压缩 施加到热泵的力被SAS结构所吸收。

    PARALLEL THERMOELECTRIC HEAT EXCHANGE SYSTEMS
    19.
    发明申请
    PARALLEL THERMOELECTRIC HEAT EXCHANGE SYSTEMS 有权
    并联热电交换系统

    公开(公告)号:US20130291561A1

    公开(公告)日:2013-11-07

    申请号:US13867589

    申请日:2013-04-22

    Abstract: Embodiments of the present disclosure relate to controlling multiple Thermoelectric Coolers (TECs) to maintain a set point temperature of a chamber. In one embodiment, a controller receives temperature data corresponding to a temperature of the chamber. Based on the temperature data, the controller selectively controls two or more subsets of the TECs to maintain the temperature of the chamber at a desired set point temperature. In this manner, the controller is enabled to control the TECs such that the TECs operate to efficiently maintain the temperature of the chamber at the set point temperature. In another embodiment, the controller selects one or more control schemes enabled by the controller based on temperature data and a desired performance profile. The controller then independently controls one or more subsets of the TECs according to the selected control scheme(s).

    Abstract translation: 本公开的实施例涉及控制多个热电冷却器(TEC)以保持室的设定点温度。 在一个实施例中,控制器接收对应于室的温度的温度数据。 基于温度数据,控制器选择性地控制TEC的两个或多个子集以将腔室的温度保持在期望的设定点温度。 以这种方式,控制器能够控制TEC,使得TEC操作以有效地将室的温度保持在设定点温度。 在另一个实施例中,控制器基于温度数据和期望的性能轮廓来选择由控制器启用的一个或多个控制方案。 然后,控制器根据所选择的控制方案独立地控制TEC的一个或多个子集。

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