EARBUD WITH TEMPERATURE SENSING
    13.
    发明公开

    公开(公告)号:US20230414174A1

    公开(公告)日:2023-12-28

    申请号:US17849941

    申请日:2022-06-27

    Abstract: An earbud with temperature sensing is provided, and the earbud includes a housing, a speaker and a first temperature sensor. The housing defines a first opening and a second opening. The speaker is disposed within the housing and oriented so that audio emitted by the speaker exits the housing through the first opening defined by the housing. The first temperature sensor is positioned along an interior surface of the housing and aligned with the second opening in the housing for non-contact temperature sensing. In response to the earbud being positioned for use within an ear of a user, the second opening aligns with an inner side of the tragus close to the ear canal, the cavum conchae, an inner edge of the antitragus, or the cheek close to the ear, such that the first temperature sensor detects a body temperature of the user through the second opening.

    EARPHONE WITH FORCE SENSOR
    16.
    发明申请

    公开(公告)号:US20210239544A1

    公开(公告)日:2021-08-05

    申请号:US17235664

    申请日:2021-04-20

    Abstract: There is provided a force sensor including a substrate and a polymer material layer. The substrate has a circuit layout that includes a first electrode and a second electrode configured to form a capacitor therebetween. The polymer material layer covers at least on a space between the first electrode and the second electrode, and is used to change capacitance of the capacitor while being pressed. The force sensor is arranged inside a stem of an earphone for detecting the user input.

    THERMOPILE MODULE
    18.
    发明申请

    公开(公告)号:US20250044157A1

    公开(公告)日:2025-02-06

    申请号:US18922683

    申请日:2024-10-22

    Abstract: An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.

    OPTICAL SENSOR ASSEMBLY
    20.
    发明申请

    公开(公告)号:US20210072073A1

    公开(公告)日:2021-03-11

    申请号:US16951065

    申请日:2020-11-18

    Abstract: An optical sensor assembly is provided. The optical sensor assembly includes a circuit board, an optical sensor positioned on the circuit board, and a front cover attached to the circuit board and covering the optical sensor. The front cover includes an optical element configured to guide or condense an incident light of a predetermined wavelength onto the optical sensor. The front cover is made of polypropylene or polyethylene. The predetermined wavelength is in a range from 8 micrometers to 12 micrometers.

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