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公开(公告)号：US20230152572A1
公开(公告)日：2023-05-18
申请号：US17916513
申请日：2021-05-28
Applicant: Robert Bosch GmbH
Inventor： Frank Schatz , Jochen Tomaschko , Kerrin Doessel , Timo Schary
CPC classification number: G02B26/0833 , B81B3/0072 , B81B2201/042 , B81B2203/0109 , B81B2203/0154
Abstract: A micromechanical device, in particular a micromirror device. The device has at least one first micromechanical component and one second micromechanical component. The first component and the second component are directly or indirectly joined to one another. The first micromechanical component has a first sub-body and at least one second sub-body. The first sub-body extends in a first plane and the second sub-body in a second plane different from the first plane. The first plane and the second plane extend parallel to one another and the first plane extends above the second plane. The second sub-body is arranged in a transitional region to the second micromechanical component. A second extent of the second sub-body in the longitudinal direction is greater than a first extent of the first sub-body in the longitudinal direction.
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公开(公告)号：US20210381850A1
公开(公告)日：2021-12-09
申请号：US17287027
申请日：2020-01-20
Applicant: Robert Bosch GmbH
Inventor： Christoph Schelling , Kerrin Doessel
Abstract: A method for operating a capacitive device. The method includes providing a pulsed readout signal having a pulse frequency at a readout signal channel, to which at least one capacitor unit of the capacitive device is electrically connected, and reading out the at least one capacitor unit of the capacitive device, which has a natural frequency with a natural frequency period duration tres, using the pulsed readout signal. Each voltage pulse of the pulsed readout signal is applied to the readout signal channel in n temporally offset voltage stages, n being a natural number greater than or equal to 2, and a time offset Δti is maintained between each two consecutively applied voltage stages in such a way that the following is true for at least one time offset Δti between the voltage stages: Δ t i = m * t res + t res n , m being a natural number greater than or equal to zero.
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公开(公告)号：US20210271073A1
公开(公告)日：2021-09-02
申请号：US17255233
申请日：2019-08-20
Applicant: Robert Bosch GmbH
Inventor： Alexander Eberspaecher , Frank Schatz , Janine Riedrich-Moeller , Joerg Muchow , Josip Mihaljevic , Kerrin Doessel , Ralf Boessendoerfer , Timo Schary
Abstract: A micromechanical component. The micromechanical component includes: a mount; a displaceable part; and a first serpentine spring and a second serpentine spring which is embodied mirror-symmetrically with respect to the first serpentine spring in terms of a first plane of symmetry; a first actuator device and a second actuator device being embodied in such a way that by way of the first actuator device and the second actuator device, periodic deformations, mirror-symmetrical in terms of the first plane of symmetry, of the first serpentine spring and of the second serpentine spring are excitable; the micromechanical component also encompassing a first torsion spring and a second torsion spring that each extend along a rotation axis; and the displaceable part being displaceable, at least by way of the periodic and mirror-symmetrical deformations of the first serpentine spring and of the second serpentine spring, around the rotation axis with respect to the mount.
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公开(公告)号：US20170352795A1
公开(公告)日：2017-12-07
申请号：US15594913
申请日：2017-05-15
Applicant: Robert Bosch GmbH
Inventor： Fabian Purkl , Kerrin Doessel , Thomas Buck
CPC classification number: H01L41/00 , G01H11/08 , H01L41/094 , H04R3/04 , H04R17/02 , H04R2410/03
Abstract: A sensor and/or transducer device having at least one bending structure including at least one piezoelectric layer in each case, using which an intermediate volume between at least two electrodes of the bending structure is at least partially filled in each case, the sensor and/or transducer device including an electronic unit, which is designed to apply at least one predefined or established actuator voltage between two of the electrodes at a time of the bending structure in such a way that a deformation of the bending structure triggered by an intrinsic stress gradient in the bending structure may be at least partially compensated for. A method for operating a sensor and/or transducer device having at least one bending structure, which includes at least one piezoelectric layer, and a method for calibrating a microphone having at least one bending structure, which includes at least one piezoelectric layer, are also described.
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Patent Agency Ranking
公开(公告)号：US11840445B2
公开(公告)日：2023-12-12
申请号：US17281508
申请日：2019-12-17
Applicant: Robert Bosch GmbH
Inventor： Christoph Hermes , Kerrin Doessel , Thomas Friedrich
CPC classification number: B81B3/001 , B81C1/00968 , B81B2203/0127 , B81B2203/04
Abstract: A MEMS sensor including a diaphragm, a base surface area of the diaphragm being delimited with the aid of a peripheral wall structure, and the base surface area including at least two subareas, of which at least one of the subareas is deflectably situated, and the at least two subareas being separated from one another with the aid of at least one separating structure or being delimited by the latter. The separating structure includes at least one fluid through-opening for the passage of fluid.
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公开(公告)号：US11733068B2
公开(公告)日：2023-08-22
申请号：US17287027
申请日：2020-01-20
Applicant: Robert Bosch GmbH
Inventor： Christoph Schelling , Kerrin Doessel
IPC: G01D5/24 , G01D3/036 , G01R27/26 , G01L9/12 , G01P15/125
CPC classification number: G01D5/24 , G01D3/036 , G01R27/2605 , G01L9/12 , G01P15/125
Abstract: A method for operating a capacitive device. The method includes providing a pulsed readout signal having a pulse frequency at a readout signal channel, to which at least one capacitor unit of the capacitive device is electrically connected, and reading out the at least one capacitor unit of the capacitive device, which has a natural frequency with a natural frequency period duration tres, using the pulsed readout signal. Each voltage pulse of the pulsed readout signal is applied to the readout signal channel in n temporally offset voltage stages, n being a natural number greater than or equal to 2, and a time offset Δti is maintained between each two consecutively applied voltage stages in such a way that the following is true for at least one time offset Δti between the voltage stages:
Δ
t
i
=
m
*
t
res
+
t
res
n
,
m being a natural number greater than or equal to zero.-
公开(公告)号：US20180192204A1
公开(公告)日：2018-07-05
申请号：US15861787
申请日：2018-01-04
Applicant: Robert Bosch GmbH
Inventor： Ahmad Mansour , Daniel Pantel , Fabian Purkl , Kerrin Doessel , Thomas Buck , Thomas Northemann
CPC classification number: H04R17/025 , B81B3/0051 , B81B3/0072 , B81B2201/0257 , B81B2201/032 , B81B2203/0118 , H04R17/005 , H04R31/006
Abstract: A micromechanical sound transducer system includes a substrate that includes (a) a cavity with a cavity edge area, (b) a front side, and (c) a rear side; a piezoelectric vibrating beam that is elastically suspended on the front side and that extends across the cavity; and, for the piezoelectric vibrating beam, a respective deflection limiting device that is on a front edge area of the respective vibrating beam and that is configured to limit a deflection of the respective vibrating beam to a limiting deflection by causing the respective front edge area of the respective vibrating beam to interact with the cavity edge area or an opposing front edge area of another vibrating beam.
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18.发明授权公开(公告)号：US10012828B2
公开(公告)日：2018-07-03
申请号：US15307433
申请日：2015-04-27
Applicant: Robert Bosch GmbH
Inventor： Frank Schatz , Friedjof Heuck , Kerrin Doessel , Stefan Pinter , Daniel Pantel , Franziska Rohlfing
CPC classification number: G02B26/0833 , B81B7/0067 , B81B2201/042 , G02B7/1821 , G02B26/101 , G02B27/0006
Abstract: An assembly body for micromirror chips that partly encloses an internal cavity, the assembly body including at two sides oriented away from one another, at least one respective partial outer wall that is fashioned transparent for a specified spectrum, and the assembly body having at least one first outer opening on which a first micromirror chip can be attached, and a second outer opening on which a second micromirror chip can be attached, in such a way that a light beam passing through the first partial outer wall is capable of being deflected by the first micromirror chip onto the second micromirror chip, and is capable of being deflected by the second micromirror chip through the second partial outer wall. A mirror device and a production method for a mirror device are also described.
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公开(公告)号：US20180062067A1
公开(公告)日：2018-03-01
申请号：US15665508
申请日：2017-08-01
Applicant: Robert Bosch GmbH
Inventor： Thomas Buck , Fabian Purkl , Kerrin Doessel
IPC: H01L41/09 , H01L41/047 , H01L41/053 , H01L41/113 , H01L41/332 , H01L41/29 , H04R17/02 , G01L1/16 , G01L9/00
CPC classification number: H01L41/094 , G01L1/16 , G01L9/008 , H01L41/047 , H01L41/053 , H01L41/1132 , H01L41/1136 , H01L41/1138 , H01L41/29 , H01L41/332 , H04R17/02 , H04R2201/003
Abstract: A micromechanical component having at least one electromechanical flexible structure, each of which includes a first piezoelectric layer, a first outer electrode situated on a first side of the first piezoelectric layer, a first intermediate electrode situated on a second side, oriented away from the first side, of the first piezoelectric layer, a second piezoelectric layer situated on a side of the first intermediate electrode oriented away from the first piezoelectric layer, and a second outer electrode situated on a side of the second piezoelectric layer oriented away from the first intermediate electrode, the at least one electromechanical flexible structure having in each case a second intermediate electrode that is situated on the side of the first intermediate electrode oriented away from the first piezoelectric layer, between the second piezoelectric layer and the first intermediate electrode.
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