ASSEMBLY BODY FOR MICROMIRROR CHIPS, MIRROR DEVICE AND PRODUCTION METHOD FOR A MIRROR DEVICE
    1.
    发明申请
    ASSEMBLY BODY FOR MICROMIRROR CHIPS, MIRROR DEVICE AND PRODUCTION METHOD FOR A MIRROR DEVICE 有权
    用于微镜器件的组装体,镜子器件和用于镜子器件的制造方法

    公开(公告)号:US20170052364A1

    公开(公告)日:2017-02-23

    申请号:US15307433

    申请日:2015-04-27

    Abstract: An assembly body for micromirror chips that partly encloses an internal cavity, the assembly body including at two sides oriented away from one another, at least one respective partial outer wall that is fashioned transparent for a specified spectrum, and the assembly body having at least one first outer opening on which a first micromirror chip can be attached, and a second outer opening on which a second micromirror chip can be attached, in such a way that a light beam passing through the first partial outer wall is capable of being deflected by the first micromirror chip onto the second micromirror chip, and is capable of being deflected by the second micromirror chip through the second partial outer wall. A mirror device and a production method for a mirror device are also described.

    Abstract translation: 一种用于微镜芯片的组件主体,其部分地包围内部空腔,所述组件主体包括彼此远离的两个侧面,至少一个对于特定光谱为透明的相应部分外壁,并且所述组装体具有至少一个 可以安装有第一微反射镜芯片的第一外部开口和可以安装第二微反射镜芯片的第二外部开口,使得穿过第一部分外壁的光束能够被第一外部开口偏转 第一微镜芯片到第二微镜芯片上,并且能够被第二微镜芯片通过第二部分外壁偏转。 还描述了用于镜装置的镜装置和制造方法。

    Method and device for processing a signal

    公开(公告)号:US10389394B2

    公开(公告)日:2019-08-20

    申请号:US16040571

    申请日:2018-07-20

    Abstract: A method for processing a signal includes reading in a signal and filtering the signal using a first number of band-pass filters in order to obtain one band-pass filtered signal per band-pass filter. The first number of band-pass filters is configured to each allow distinct frequency ranges of the signal to pass. The method further includes calculating at least one signal parameter each from the plurality of band-pass filtered signals. The method further includes performing analog-to-digital conversion of the plurality of band-pass filtered signals or signals derived therefrom using a plurality of signal parameters such that a second number of analog-to-digital converters used to perform the analog-to-digital conversion is less than the first number of band-pass filters used to filter the signal.

    Method and Device for Processing a Signal
    4.
    发明申请

    公开(公告)号:US20190028130A1

    公开(公告)日:2019-01-24

    申请号:US16040571

    申请日:2018-07-20

    Abstract: A method for processing a signal includes reading in a signal and filtering the signal using a first number of band-pass filters in order to obtain one band-pass filtered signal per band-pass filter. The first number of band-pass filters is configured to each allow distinct frequency ranges of the signal to pass. The method further includes calculating at least one signal parameter each from the plurality of band-pass filtered signals. The method further includes performing analog-to-digital conversion of the plurality of band-pass filtered signals or signals derived therefrom using a plurality of signal parameters such that a second number of analog-to-digital converters used to perform the analog-to-digital conversion is less than the first number of band-pass filters used to filter the signal.

    MICROMECHANICAL SENSOR UNIT AND METHOD FOR MANUFACTURING A MICROMECHANICAL SENSOR UNIT

    公开(公告)号:US20210354981A1

    公开(公告)日:2021-11-18

    申请号:US17282331

    申请日:2019-12-17

    Abstract: A micromechanical sensor unit, including: a substrate and an edge layer, which is situated on the substrate and laterally frames an inner area above the substrate; at least one diaphragm, which spans the inner area and forms a covered cavity above the substrate; at least one support point, which is situated between the substrate and the diaphragm inside the cavity and attaches the diaphragm to the edge layer and/or to the at least one support point. The support point separates the diaphragm into at least one measuring area that is movable through force action and at least one reference area that is not movable through force action. The substrate and the diaphragm, inside the cavity, include electrodes, which face one another in the measuring area and the reference area.

    Micromechanical sensor unit and method for manufacturing a micromechanical sensor unit

    公开(公告)号:US11912565B2

    公开(公告)日:2024-02-27

    申请号:US17282331

    申请日:2019-12-17

    Abstract: A micromechanical sensor unit, including: a substrate and an edge layer, which is situated on the substrate and laterally frames an inner area above the substrate; at least one diaphragm, which spans the inner area and forms a covered cavity above the substrate; at least one support point, which is situated between the substrate and the diaphragm inside the cavity and attaches the diaphragm to the edge layer and/or to the at least one support point. The support point separates the diaphragm into at least one measuring area that is movable through force action and at least one reference area that is not movable through force action. The substrate and the diaphragm, inside the cavity, include electrodes, which face one another in the measuring area and the reference area.

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