公开(公告)号：US20160381796A1

公开(公告)日：2016-12-29

申请号：US15096993

申请日：2016-04-12

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Sung-Uk LEE ,  Il-Jong SEO ,  Jae-Hoon CHOI ,  Yong-Ho BAEK

IPC: H05K1/11 ,  H05K3/06

CPC classification number: H05K1/115 ,  H05K3/067 ,  H05K3/4647 ,  H05K3/4682 ,  H05K3/4697 ,  H05K2201/0361 ,  H05K2201/09854 ,  H05K2203/0369 ,  H05K2203/0376 ,  H05K2203/0384

Abstract: A printed circuit board and a method of manufacturing a printed circuit board are provided. The printed circuit board includes an insulating layer, a circuit layer embedded in the insulating layer, a solder resist layer disposed on one surface of the insulating layer, the solder resist layer having a cavity of a through-hole shape to expose a part of the circuit layer from the insulating layer, and a metal post embedded in the solder resist layer and exposed to outside via an opening of the solder resist layer, and the metal post includes a first post metal layer, a post barrier layer, and a second post metal layer disposed in that order.

Abstract translation: 提供印刷电路板和制造印刷电路板的方法。 印刷电路板包括绝缘层，嵌入绝缘层中的电路层，设置在绝缘层的一个表面上的阻焊层，阻焊层具有通孔形状的空腔，以暴露部分 电路层，以及嵌入到阻焊层中并经由阻焊层的开口暴露于外部的金属柱，金属柱包括第一后​​金属层，后阻挡层和第二柱 金属层。

公开(公告)号：US20160374197A1

公开(公告)日：2016-12-22

申请号：US15139698

申请日：2016-04-27

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae-Ean LEE ,  Jee-Soo MOK ,  Young-Gwan KO ,  Soon-Oh JUNG ,  Kyung-Hwan KO ,  Yong-Ho BAEK

IPC: H05K1/02 ,  H05K3/46 ,  H05K1/18 ,  H05K3/18 ,  H05K3/40 ,  H05K1/11 ,  H05K3/06

CPC classification number: H05K1/0298 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H05K1/111 ,  H05K1/113 ,  H05K1/183 ,  H05K3/06 ,  H05K3/061 ,  H05K3/188 ,  H05K3/40 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4697 ,  H05K2201/09036 ,  H05K2203/308

Abstract: A printed circuit board includes: an insulating layer including a cavity formed therein, the cavity being recessed into the insulating layer from a top surface of the insulating layer; a first circuit layer formed inside the insulating layer such that a portion of the first circuit layer is disposed within the cavity; a second circuit layer disposed above the insulating layer; a first surface-treated layer disposed above the portion of the first circuit layer disposed within the cavity; and a second surface-treated layer disposed above the second circuit layer.

Abstract translation: 印刷电路板包括：绝缘层，其包括形成在其中的空腔，所述空腔从绝缘层的顶表面凹入绝缘层; 形成在所述绝缘层内的第一电路层，使得所述第一电路层的一部分设置在所述空腔内; 设置在所述绝缘层上方的第二电路层; 第一表面处理层，设置在设置在腔内的第一电路层的部分之上; 以及设置在第二电路层上方的第二表面处理层。

公开(公告)号：US20160372411A1

公开(公告)日：2016-12-22

申请号：US15079074

申请日：2016-03-24

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Yong-Ho BAEK

IPC: H01L23/498 ,  H01L21/52 ,  H01L21/56 ,  H01L21/48

Abstract: A semiconductor package and a method of manufacturing a semiconductor package are disclosed. The semiconductor package including a first substrate including a first cavity, a cavity mold configured to be inserted into the first cavity and including a second cavity, an electronic component inserted in the second cavity, and a second substrate formed on a surface of the first substrate, a surface of the cavity mold and a surface of the electronic component.

Abstract translation: 公开了半导体封装和制造半导体封装的方法。 该半导体封装包括第一衬底，该第一衬底包括第一腔体，构造成插入到第一腔体中并包括第二空腔的腔模，插入第二空腔中的电子部件和形成在第一衬底的表面上的第二衬底 ，空腔模具的表面和电子部件的表面。