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公开(公告)号：US20240294731A1
公开(公告)日：2024-09-05
申请号：US18575176
申请日：2022-07-27
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Qing WANG , Qianfa LIU , Dongliang LIU , Jinchao DONG , Songgang CHAI , Yongjing XU , Yanhua ZHANG
IPC: C08K3/36 , C08J5/24 , C08L63/00 , C09J163/00
CPC classification number: C08K3/36 , C08J5/247 , C08L63/00 , C09J163/00 , C08J2363/00 , C08J2371/12 , C08J2433/24 , C08J2461/06 , C08J2467/00 , C08K2201/005
Abstract: A resin composition and the use thereof. The resin composition comprises the following components, in percentages by weight: 40-70% of a crosslinkable and curable resin and 30-60% of a filler. The filler is silicon dioxide prepared by means of an organosilicone hydrolysis method; the average particle size D50 of the silicon dioxide is 0.1-3 μm; and the particle size ratio D100:D10 of the silicon dioxide is less than or equal to 2.5. By means of the composition, a prepared adhesive film and resin-coated copper foil have a higher elongation rate, a higher peel strength, low CTE, low Df, better drilling processability and higher electrical strength. A finer line processing capability can be achieved, which can be applied to a printed circuit board material of a multilayer laminate, in particular a printed circuit board material of a multilayer laminate of thin lines.
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公开(公告)号：US20230045615A1
公开(公告)日：2023-02-09
申请号：US17787424
申请日：2020-03-31
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Yong CHEN , Yongjing XU , Guofang TANG
IPC: C08G59/42 , C08K3/22 , C08K3/36 , C08K3/32 , C08K5/5313 , C08K5/5377 , C08K5/5419 , C08J5/24 , B32B7/12 , B32B15/20 , B32B15/14
Abstract: Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.
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13.发明申请公开(公告)号：US20180371232A1
公开(公告)日：2018-12-27
申请号：US15736998
申请日：2017-03-29
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Long XI , Jiang LI , Yongjing XU
Abstract: The present invention relates to a halogen-free flame retardant resin composition, a prepreg and a copper clad laminate prepared therefrom. The composition of the present invention comprises, based on the weight parts of solid components, (A) from 5 to 80 parts by weight of alkylphenol epoxy resin, (B) from 10 to 80 parts by weight of benzoxazine resin, (C) from 2 to 30 parts by weight of styrene maleic anhydride resin, (D) from 1 to 30 parts by weight of a flame retardant, and (E) from 0.5 to 100 parts by weight of an acidic filler having a pH of 2-6. The present invention further provides a prepreg and a copper clad laminate prepared from the halogen-free flame retardant resin composition. While ensuring a higher glass transition temperature and excellent moisture heat resistance, the halogen-free flame retardant resin composition of the present invention effectively improves the dielectric properties and the peel strength stability of the resin composition, and provides the prepregs and copper clad laminates with excellent comprehensive performances.
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14.发明申请公开(公告)号：US20180220530A1
公开(公告)日：2018-08-02
申请号：US15744244
申请日：2016-03-02
Applicant: Shengyi Technology Co., Ltd.
Inventor： Guangbing CHEN , Xianping ZENG , Chiji GUAN , Yongjing XU
IPC: H05K1/03 , C08L71/12 , C08L83/04 , C08K5/00 , C08K5/5313
Abstract: The present invention relates to a polyphenyl ether resin composition and a use thereof in a high-frequency circuit substrate. The polyphenyl ether resin composition comprises a vinyl-modified polyphenyl ether resin and an organic silicon resin containing unsaturated double bonds and having a three-dimensional net structure. The high-frequency circuit substrate of the present invention has the advantages of a low dielectric constant, a low dielectric loss, high heat resistance, low water absorption, a high interlayer adhesive force and a high bending strength, and is very suitable as a circuit substrate of high-speed electronic equipment.
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15.发明申请公开(公告)号：US20180112133A1
公开(公告)日：2018-04-26
申请号：US15475471
申请日：2017-03-31
Applicant: Shengyi Technology Co., Ltd.
Inventor： Yongzhen WANG , Yueshan HE , Zhongqiang YANG , Yongjing XU
CPC classification number: C09K21/12 , B32B15/092 , B32B27/20 , B32B37/06 , B32B2305/076 , B32B2307/3065 , B32B2383/00 , C07F9/659 , C08J5/24 , C08J2363/00 , C08J2363/04 , C08K3/22 , C08K3/36 , C08K5/5399 , C08K5/5406 , C08K5/5442 , C08K2003/2206 , C08K2003/2227 , C08L27/02 , C08L2201/02 , D06M15/673 , C08L63/00
Abstract: The present invention provides a siloxane-modified cyclotriphosphazene halogen-free flame retardant, and a preparation method and a use thereof. The siloxane-modified cyclotriphosphazene halogen-free flame retardant has the structural formula as shown in Formula I. In the siloxane-modified cyclotriphosphazene halogen-free flame retardant of the present invention, three kinds of structures of siloxane, aryl phosphorus oxygen compound and cyclotriphosphazene are built in one molecular formula, which combines the advantages of three structures, improves the compatibility between the flame retardant and resins, has a high flame retardant efficiency and a better char formation and can greatly increase the flame retardancy and stability of resin cured products.
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Patent Agency Ranking
16.发明申请公开(公告)号：US20180086895A1
公开(公告)日：2018-03-29
申请号：US15515230
申请日：2016-09-14
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Jiang YOU , Tianhui HUANG , Yongjing XU , Zhongqiang YANG
CPC classification number: C08K3/32 , B32B15/092 , B32B27/38 , C08G59/1477 , C08G59/3236 , C08G59/4014 , C08J5/24 , C08J2363/00 , C08K5/49 , C08L63/00 , C08L79/04 , C08L2201/02 , C08L2203/206 , H05K1/024 , H05K1/0346 , H05K1/0373 , H05K3/38 , H05K2201/012
Abstract: The present invention provides a halogen-free thermosetting resin composition, a prepreg, a laminate and a printed circuit board comprising the same. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 30 to 60 parts by weight of a halogen-free thermosetting resin, (B) from 10 to 35 parts by weight of a phenolic curing agent, and (C) a phosphorus-containing flame retardant. The prepregs, laminates and printed circuit boards prepared from the halogen-free thermosetting resin composition of the present invention have excellent dimensional stability and dielectric properties, high adhesive force, high heat resistance, low water absorption and better processability, and can achieve halogen-free flame retardancy and reach UL94 V-0.
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17.发明申请公开(公告)号：US20170342301A1
公开(公告)日：2017-11-30
申请号：US15537519
申请日：2015-05-27
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Zengbiao HUANG , Huayang DENG , Yongjing XU
IPC: C09J163/00 , C09J9/02 , C09J11/06 , C09J11/04 , C01B13/00
CPC classification number: C09J163/00 , C01B13/00 , C08G59/223 , C08G59/504 , C09J9/02 , C09J11/04 , C09J11/06 , C08K3/10
Abstract: The present invention provides a degradable and recyclable epoxy conductive adhesive, which comprises the following raw materials in percentage by weight: 15% to 30% of epoxy resin, 1% to 10% of a curing agent, 0.1% to 2% of a reaction diluent and 15% to 85% of a conductive filler, wherein the curing agent comprises a breakable molecular structure. According to the epoxy conductive adhesive of the present invention, after the epoxy resin in the conductive adhesive is cured by using the recyclable and degradable epoxy resin curing agent of a specific molecular structure, the conductive adhesive can be degraded in normal pressure, mild and specific conditions, the process is simple and the operation is convenient, no contamination is brought to the environment, the recycling cost is largely reduced, and the recycling of the conductive adhesive has enormous economic and environmental advantages. By using the recyclable and degradable epoxy resin curing agent of a specific molecular structure, the shear strength of the conductive adhesive is greatly increased, and the reliability and the service life of the conductive adhesive are largely improved.
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公开(公告)号：US20240287282A1
公开(公告)日：2024-08-29
申请号：US18575212
申请日：2022-07-27
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Naidong SHE , Qianfa LIU , Zengbiao HUANG , Yongjing XU , Songgang CHAI , Yanhua ZHANG
CPC classification number: C08K3/36 , C08J5/244 , C08J5/249 , C09D7/61 , C09D7/68 , C09D7/69 , C09J7/30 , C09J11/04 , C08J2363/00 , C08K2201/005 , C09J2400/166 , C09J2463/00 , H05K1/0366
Abstract: The present invention provides a resin composition and an application thereof, the resin composition comprising the following components by weight percentage: 15-39% cross-linkable curable resin and 61-85% filler, the filler being silicon dioxide prepared by means of organosilicon hydrolysis, the average particle diameter D50 of the silicon dioxide being 0.1-3 μm, the ratio of D100:D10 thereof being less than or equal to 2.5, and the purity of the silicon dioxide being greater than 99.9%. The resin composition of the present invention can make prepared adhesive films and resin-coated copper foils have relatively high tensile strength and peel strength, relatively good drilling processability, controllable fluidity, good filling ability, and higher electric strength, and can achieve finer line processing ability; it is a printed circuit board material applicable to multilayer laminates, especially a printed circuit board material for multilayer laminates of thin lines.
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19.发明申请公开(公告)号：US20220135788A1
公开(公告)日：2022-05-05
申请号：US17437564
申请日：2019-04-08
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Liexiang HE , Yaode ZENG , Zhongqiang YANG , Yu YANG , Hualin PAN , Yongjing XU
Abstract: The present disclosure provides a resin composition, as well as a prepreg, a laminate and a printed circuit board containing the same. The resin composition comprises 48-54 parts by weight of a halogen-free epoxy resin, 16-31 parts by weight of a compound represented by Formula (I), wherein n is 2-15; Ac represents an acetyl group; and 15-32 parts by weight of a cyanate ester resin. The prepreg, laminate and printed circuit board prepared from the resin composition have a low coefficient of thermal expansion.
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公开(公告)号：US20210307164A1
公开(公告)日：2021-09-30
申请号：US17162122
申请日：2021-01-29
Applicant: Shengyi Technology Co., Ltd.
Inventor： Weifeng YIN , Cui HUO , Rui LIU , Yongjing XU , Shanyin YAN
IPC: H05K1/03 , C09J153/02 , C09J179/08 , C09J171/12 , C09J11/06
Abstract: The present application provides a circuit material and a circuit board containing the same. The circuit material comprises a conductive metal layer and a dielectric substrate layer, and an adhesive layer arranged therebetween, wherein the adhesive layer is made of a material which comprises an adhesive composition comprising a resin component and a non-resin component, wherein the resin component is composed of unsaturated polyphenylene ether resin, SBS resin and maleimide resin; and the non-resin component comprises an initiator; and the adhesive layer is obtained by applying the adhesive composition dissolved in a solvent onto the surface of the conductive metal layer or the dielectric substrate layer in the form of a solution, or by applying to a release material and removing the release material after partially curing or completely curing.
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