公开(公告)号：US10160856B2

公开(公告)日：2018-12-25

申请号：US15533549

申请日：2015-12-11

Applicant: SHOWA DENKO K.K.

Inventor： Hiromi Otake ,  Aoi Nakano ,  Chika Yamashita ,  Yoshitaka Ishibashi ,  Hiroshi Uchida

IPC: C08L61/14 ,  C08L35/00 ,  C08L61/16 ,  C08K3/00 ,  C08F290/14 ,  C08K5/14 ,  C08K5/3415

Abstract: Provided is a thermosetting resin composition which exhibits excellent workability, and which is capable of obtaining, as a result of being cured, a highly reliable cured product (molded article) exhibiting excellent heat resistance and mechanical strength. This thermosetting resin composition includes: a polyalkenyl phenol resin (A); an aromatic polymaleimide compound (B); and a polymerization initiator (C). The polyalkenyl phenol resin (A) has, in a molecule thereof, at least one aromatic ring unit (a1) which has a phenolic hydroxyl group having a 2-alkenyl group bonded thereto, and at least one aromatic ring unit (a2) having a phenolic hydroxyl group which does not have a 2-alkenyl group bonded thereto. Each of the aromatic ring units is bonded by a linking group having a main chain which is not formed by an aromatic ring. When m represents the number of the aromatic ring units (a1), and n represents the number of the aromatic ring units (a2), the ratio of m to (m+n) is 40-90%. The polyalkenyl phenol resin (A) is included in an amount at which the amount of 2-alkenyl groups becomes 0.4-1.5 mol per mol of maleimide groups in the aromatic polymaleimide compound (B).

公开(公告)号：US09845404B2

公开(公告)日：2017-12-19

申请号：US15032388

申请日：2014-10-28

Applicant: SHOWA DENKO K.K.

Inventor： Hiroshi Uchida ,  Shoichiro Wakabayashi ,  Jun Dou ,  Takahiko Ono ,  Masumi Kuritani

IPC: C09D11/52 ,  C09D11/037 ,  C09D11/10 ,  H01B1/02 ,  H01B1/22 ,  H05K1/09 ,  H05K3/12 ,  B41F15/00

CPC classification number: C09D11/52 ,  B41F15/00 ,  C09D11/037 ,  C09D11/10 ,  H01B1/02 ,  H01B1/22 ,  H05K1/092 ,  H05K3/1216 ,  H05K3/1291 ,  H05K2201/0245

Abstract: Provided are a conductive composition for thin film printing and a method for forming a thin film conductive pattern, which can easily performing thin film printing, and can capable of improve conductivity by thermal sintering at a comparatively low temperature of 300° C. or less or by photo irradiation. A conductive composition comprises metal particles, a binder resin, and a solvent, the content of an organic compound in the solvent being 5 to 98% by mass, the organic compound comprising a hydrocarbon group having a bridged cyclic structure and a hydroxyl group, the content of metal particles being 15 to 60% by mass, the metal particles containing 20% by mass or more of flat metal particles, the content of the binder resin being 0.5 to 10 parts by mass relative to 100 parts by mass of the metal particles, and the viscosity at 25° C. being 1.0×103 to 2×105 mPa·s. The composition is printed in a pattern having any selected shape on a substrate, by screen printing, and the pattern is subjected to thermal sintering at a temperature of 300° C. or less and/or subjecting the pattern to pulsed light irradiation.

公开(公告)号：US09701874B2

公开(公告)日：2017-07-11

申请号：US14781746

申请日：2014-03-27

Applicant: SHOWA DENKO K.K.

Inventor： Hiroshi Uchida ,  Yoshitaka Ishibashi

IPC: C09J9/02 ,  C09J133/14 ,  C09J163/10 ,  H01B1/22 ,  C09D133/06 ,  C09J7/00 ,  C08K3/08 ,  C08K7/18

CPC classification number: C09J9/02 ,  C08K3/08 ,  C08K7/18 ,  C08K2003/0806 ,  C08K2003/0831 ,  C08K2003/085 ,  C08K2003/0862 ,  C09D133/068 ,  C09J7/00 ,  C09J7/10 ,  C09J133/14 ,  C09J163/10 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01B1/22

Abstract: [Problem] To provide: a conductive adhesive which contains an epoxy (meth)acrylate resin and which can form a bonded zone that is not susceptible to being deteriorated by halogen; an anisotropic conductive film; and electronic devices using both. [Solution] A conductive adhesive and an anisotropic conductive film which each contain a conductive filler and a binder resin, wherein: the binder resin comprises an epoxy (meth)acrylate resin that is a product of addition reaction of (meth)acrylic acid and an epoxy compound having a sum of total chlorine atom concentration and total bromine atom concentration of 300 mass ppm or less, preferably 50 mass ppm or less; and the conductive filler is dispersed in the binder resin which comprises such an epoxy (meth)acrylate resin. The epoxy (meth)acrylate resin is preferably prepared by subjecting a starting compound (substrate) having a carbon-carbon double bond to epoxidation of the double bond with an oxidizing agent consisting of hydrogen peroxide, and then subjecting the obtained epoxy compound to addition reaction with (meth)acrylic acid.

公开(公告)号：US20140308460A1

公开(公告)日：2014-10-16

申请号：US14359598

申请日：2012-11-26

Applicant: SHOWA DENKO K.K.

Inventor： Hiroshi Uchida

IPC: H05K3/10

CPC classification number: H05K3/105 ,  H05K3/12 ,  H05K3/281 ,  H05K3/386 ,  H05K2203/1545

Abstract: Provided is a conductive pattern formation method capable of improving conductivity of a conductive pattern. An ink layer 12 is formed by printing a composition (ink) containing metal oxide particles and a reducing agent, and/or metal particles, on a surface of a substrate 10 and the ink layer 12 is heated by photo irradiation or microwave irradiation so that conductivity is expressed on the heated portion and the ink layer 12 is converted into a conductive layer 14. Metal particles and/or metal oxide particles are heated quickly in a short time and air bubbles are generated during photo irradiation or microwave irradiation and voids are generated inside the conductive layer 14, and thus the conductive layer 14 is pressurized by an appropriate pressing machine 16 to crush the voids to improve conductivity of the conductive layer 14 before obtaining a conductive pattern 18. When the conductive layer 14 is pressurized, an insulating protection film 20 can simultaneously be pressure-sealed on the surface of the substrate on which the conductive layer 14 is formed.

Abstract translation: 提供能够提高导电图案的导电性的导电图案形成方法。 通过在基板10的表面上印刷含有金属氧化物颗粒和还原剂的组合物（和墨水）和/或金属颗粒来形成油墨层12，并通过光照射或微波照射来加热油墨层12，使得 电导率表示在加热部分上，并且油墨层12转变为导电层14.金属颗粒和/或金属氧化物颗粒在短时间内被快速加热，并且在光照射或微波照射期间产生气泡并产生空隙 在导电层14的内部，并且因此导电层14被适当的压制机16加压，以在获得导电图案18之前粉碎空隙以改善导电层14的导电性。当导电层14被加压时，绝缘保护 膜20可以同时被压密封在其上形成有导电层14的基板的表面上。

公开(公告)号：US11247271B2

公开(公告)日：2022-02-15

申请号：US15764423

申请日：2016-09-27

Applicant: SHOWA DENKO K.K.

Inventor： Masanao Hara ,  Shigeru Yamaki ,  Hiroshi Uchida

IPC: B22F9/24 ,  B82Y40/00 ,  B22F1/00 ,  H01B1/02 ,  G06F3/041

Abstract: A method for producing metal nanowire of small diameter and long length. In the method for producing a metal nanowire, a first solution containing an ionic derivative and a polyol as a solvent are kept at 80-200° C., and a second solution containing a metal salt and a polyol as a solvent is supplied into the first solution so that the ratio between the number of moles of metal atoms in the metal salt supplied in one minute and the total number of moles of halogen atoms in the ionic derivative in the first solution (the number of moles of metal atoms in the metal salt supplied in one minute/the total number of moles of halogen atoms in the ionic derivative) is less than 10. It is preferable that the ionic derivative is a quaternary ammonium halide and the metal salt is silver nitrate.

公开(公告)号：US09318243B2

公开(公告)日：2016-04-19

申请号：US14359958

申请日：2012-11-26

Applicant: SHOWA DENKO K.K.

Inventor： Hiroshi Uchida

IPC: C09D11/52 ,  H01B1/22 ,  H01B13/00 ,  H05K1/09 ,  H05K3/12 ,  C09D11/037 ,  C09D17/00

CPC classification number: H01B13/003 ,  C09D11/037 ,  C09D11/52 ,  C09D17/00 ,  H01B1/22 ,  H05K1/095 ,  H05K3/1283 ,  H05K2201/0218 ,  H05K2201/0257

Abstract: Provided are a conductive pattern forming method and a composition for forming a conductive pattern by photo irradiation or microwave heating, capable of increasing the conductivity of the conductive pattern. A conductive pattern is formed by preparing a composition for forming a conductive pattern comprising, copper particles each having a copper oxide thin film on the entirety or a part of the surface thereof, copper oxide particles, a reducing agent such as a polyhydric alcohol, a carboxylic acid, or a polyalkylene glycol, and a binder resin; forming a printed pattern having any selected shape on a substrate using this composition for forming a conductive pattern; and subjecting the printed pattern to photo irradiation or microwave heating to generate a sintered body of copper.

Abstract translation: 提供一种导电图案形成方法和通过光照射或微波加热形成导电图案的组合物，其能够增加导电图案的导电性。 通过制备形成导电图案的组合物形成导电图案，所述组合物包括在其整个或部分表面上各自具有氧化铜薄膜的铜颗粒，氧化铜颗粒，还原剂如多元醇， 羧酸或聚亚烷基二醇，和粘合剂树脂; 使用该用于形成导电图案的组合物在基板上形成具有任何选定形状的印刷图案; 并对印刷图案进行光照射或微波加热以产生铜烧结体。

公开(公告)号：US20150225857A1

公开(公告)日：2015-08-13

申请号：US14405662

申请日：2013-05-31

Applicant: SHOWA DENKO K.K.

Inventor： Hiroshi Uchida ,  Kenji Shinozaki

IPC: C23C30/00

CPC classification number: C23C30/00 ,  B41M3/006 ,  H05K1/036 ,  H05K1/0373 ,  H05K1/0393 ,  H05K1/095 ,  H05K3/1283 ,  H05K2201/0195 ,  Y10T428/24942

Abstract: A coating layer 12 is formed on a base film 10 by heat resistant resin having a Tg (glass transition temperature) of 120° C. or more, and more preferably 200° C. or more, and a functional thin film 14 is produced by printing ink composite including conductive particles on a surface of the coating layer 12 and thereby forming an ink layer. This functional thin film 14 is sintered by heating performed by photo irradiation, and a conductive layer is formed thereby.

Abstract translation: 通过Tg（玻璃化转变温度）为120℃以上，更优选为200℃以上的耐热性树脂，在基膜10上形成涂层12，通过以下方式制造功能性薄膜14： 包含导电粒子的印刷油墨复合物在涂层12的表面上形成油墨层。 通过光照射进行加热烧结该功能性薄膜14，由此形成导电层。

公开(公告)号：US11358927B2

公开(公告)日：2022-06-14

申请号：US17049792

申请日：2019-04-25

Applicant: SHOWA DENKO K.K.

Inventor： Yasuyuki Ueda ,  Akira Shibuya ,  Hideo Miyata ,  Hiroshi Uchida

IPC: C07C231/06 ,  B01J31/02

Abstract: A method of producing an N,N-disubstituted amide of the present invention is a method of reacting a nitrile with an alcohol in the presence of a catalyst, wherein the nitrile is a compound represented by R1CN (R1 represents an alkyl group having 10 or less carbon atoms or an aryl group having 10 or less carbon atoms), wherein the alcohol is a compound represented by R2OH (R2 represents an alkyl group having 10 or less carbon atoms), wherein the catalyst is a metal salt represented by MXn (M represents a metal cation having an oxidation number of n, X represents a monovalent anion including a substituted sulfonyl group represented by —S(═O)2—R3 (R3 represents a hydrocarbon group having 10 or less carbon atoms or a group in which some or all of hydrogen atoms in the hydrocarbon group are substituted with fluorine atoms), and n represents an integer of 1 to 4), a substituent bonded to a carbon atom in a carbonyl group of the N,N-disubstituted amide is R1, and two substituents bonded to nitrogen atoms in an amide group are both R2.

公开(公告)号：US10470301B2

公开(公告)日：2019-11-05

申请号：US14786812

申请日：2014-04-17

Applicant: SHOWA DENKO K.K.

Inventor： Hiroshi Uchida ,  Kenji Shinozaki ,  Eri Okazaki ,  Hideki Ohata ,  Yasunao Miyamura

IPC: H05K1/09 ,  H05K3/12 ,  H05K1/02 ,  H01L51/00 ,  G06F3/041 ,  H05K3/10

Abstract: Provided are a conductive pattern manufacturing method and a conductive pattern formed substrate, capable of easily achieving a narrow pitch. A metal nanowire layer 12 is formed on the entirety of a part of at least one of the main faces of a substrate 10, pulsed light is irradiated thereto through a mask 14 provided with a light transmission portion 14a formed in a predetermined pattern, and the metal nanowires in the metal nanowire layer 12 at the region having the above predetermined pattern were sintered, to thereby obtain conductivity at the predetermined patterned region. Accordingly, a substrate provided with a conductive pattern having any selected pattern can be produced by simple steps.

公开(公告)号：US20150056382A1

公开(公告)日：2015-02-26

申请号：US14396853

申请日：2013-04-26

Applicant: OSAKA UNIVERSITY ,  SHOWA DENKO K. K.

Inventor： Katsuaki Suganuma ,  Kuniaki Ohtsuka ,  Koichiro Murahashi ,  Yasutaka Takemura ,  Hiroshi Uchida

IPC: H01B1/22 ,  C09D11/03 ,  H01B13/00 ,  C09D11/52

CPC classification number: H01B1/22 ,  C09D11/03 ,  C09D11/52 ,  H01B13/0016 ,  H01B13/003 ,  H01B13/0036 ,  H05K1/097 ,  H05K3/1283 ,  H05K2201/0108 ,  H05K2201/026 ,  H05K2203/107

Abstract: Provided is a transparent conductive ink which contains metal nanowires and/or metal nanotubes as a conductive component and can form a coating film which has good conductivity and a high light transmittance property, and also provided is a transparent conductive pattern forming method wherein this transparent conductive ink is used for forming a transparent conductive pattern by simple production steps, to thereby suppress the production cost and environmental load. At least one of metal nanowires and metal nanotubes are dispersed in a dispersion medium containing a shape-holding material which contains an organic compound having a molecular weight in the range of 150 to 500 and which has a viscosity of 1.0×103 to 2.0×106 mPa·s at 25° C., to prepare a transparent conductive ink. A transparent conductive pattern is formed by printing a pattern having an arbitrary shape on a substrate using this transparent conductive ink, subjecting the pattern to a heating treatment to dry the pattern, and subjecting the pattern which has been dried to pulsed light irradiation.

Abstract translation: 提供一种透明导电油墨，其含有金属纳米线和/或金属纳米管作为导电成分，并且可以形成具有良好导电性和高透光性的涂膜，并且还提供了一种透明导电图案形成方法，其中该透明导电 油墨用于通过简单的生产步骤形成透明导电图案，从而抑制生产成本和环境负荷。 将金属纳米线和金属纳米管中的至少一种分散在含有形状保持材料的分散介质中，所述形状保持材料含有分子量为150〜500的有机化合物，其粘度为1.0×10 3〜2.0×10 6 mPa·s，在25℃下制备透明导电油墨。 通过使用该透明导电油墨在基板上印刷任意形状的图案，对图案进行加热处理以干燥图案，对经过干燥的图案进行脉冲光照射，形成透明导电图案。