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公开(公告)号:US10279591B2
公开(公告)日:2019-05-07
申请号:US15924725
申请日:2018-03-19
Applicant: SII Printek Inc.
Inventor: Hitoshi Nakayama , Takeshi Sugiyama , Daichi Nishikawa , Eriko Maeda
IPC: B41J2/16 , B41J2/14 , C23C18/16 , C23C18/32 , C23C18/42 , G03F7/16 , H01L41/047 , H01L41/09 , H01L41/29 , H01L41/187
Abstract: A discharge channel and a non-discharge channel are formed to have a similar shape, that is, to include extension portions and raise-and-cut portions continuing from end portions of both the extension portions, respectively. Then, imparting of a catalyst, washing of an unnecessary catalyst, plating, and the like are performed on a target surface, as a plating step. In an embodiment, an electrode clearance groove is formed after the plating step. Since channel grooves for the discharge channel and the non-discharge channel have a similar shape, it is possible to cause a water flow to uniformly flow in the channels when washing is performed, and thus to avoid an occurrence of a situation in which a lump is formed in the channel groove by plating.
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公开(公告)号:US10195849B2
公开(公告)日:2019-02-05
申请号:US15924707
申请日:2018-03-19
Applicant: SII Printek Inc.
Inventor: Hitoshi Nakayama , Takeshi Sugiyama , Daichi Nishikawa , Eriko Maeda
Abstract: Channel grooves for a discharge channel and a non-discharge channel are formed in the surface of an actuator plate by cutting. The discharge channel includes an extension portion and a raise-and-cut portion, and the non-discharge channel also includes an extension portion and a raise-and-cut portion. In an embodiment, an electrode clearance groove is formed in advance by cutting with a dicing blade or the like. After the electrode clearance groove is formed, an electrode is formed by plating. Since plating is performed after the electrode clearance groove is formed, a clearance groove electrode is integrally formed with an AP-side common pad in the electrode clearance groove, and thus the clearance groove electrode and the AP-side common pad are short-circuited. Thus, an electrode separation portion is formed by cutting a short-circuited portion of the clearance groove electrode and the AP-side common pad through cutting or irradiation with laser.
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公开(公告)号:US09802406B2
公开(公告)日:2017-10-31
申请号:US15380306
申请日:2016-12-15
Applicant: SII Printek Inc.
Inventor: Daichi Nishikawa
IPC: B41J2/14
CPC classification number: B41J2/14209 , B41J2/14072 , B41J2/14201 , B41J2002/14491 , B41J2202/18
Abstract: The present invention relates to a liquid jet device comprising an actuator plate on which injection channels and non-injection channels are arranged side by side, a cover plate laminated on a surface of the actuator plate and including slits communicating into the injection channels, common electrodes and individual electrodes formed on inner surfaces of the injection channels and the non-injection channels, and common wires and individual wires formed on surfaces of bank portions of the actuator plate, and common pad portions and individual pad portions connected to the common wires and the individual wires, and connected to flexible boards in protruding end portions are formed in a portion of a back surface of the cover plate outside the slits.
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公开(公告)号:US09365038B2
公开(公告)日:2016-06-14
申请号:US14534826
申请日:2014-11-06
Applicant: SII PRINTEK INC.
Inventor: Daichi Nishikawa , Yuzuru Kubota
IPC: B41J2/14
CPC classification number: B41J2/14209 , B41J2002/14491 , B41J2202/18
Abstract: A liquid jet head includes a head chip and a circuit board connected to the head chip. The head chip includes common terminals arranged in a reference direction. The circuit board includes shared terminals, an upper common wiring, and a through electrode. The shared terminals are provided on a lower surface of the circuit board on the head chip side and are electrically connected to the common terminals. The upper common wiring extends in the reference direction and is provided on a top surface of the circuit board opposite to the head chip. The through electrode electrically connects each of the shared terminals to the upper common wiring.
Abstract translation: 液体喷射头包括头部芯片和连接到头部芯片的电路板。 头芯片包括沿参考方向布置的公共端子。 电路板包括共用端子,上部公共布线和贯通电极。 共享端子设置在头芯片侧的电路板的下表面上并且电连接到公共端子。 上部公共布线在参考方向上延伸并且设置在电路板的与头部芯片相对的顶表面上。 贯通电极将每个共用端子电连接到上部公共布线。
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