公开(公告)号：US20240196517A1

公开(公告)日：2024-06-13

申请号：US18585714

申请日：2024-02-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngsun JO ,  Dohoon KIM ,  Sangyong KIM ,  Bongkyu MIN ,  Seoyoung PARK ,  Yunoh CHI

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/14

CPC classification number: H05K1/0219 ,  H05K1/116 ,  H05K1/14 ,  H05K2201/0939 ,  H05K2201/10378

Abstract: Disclosed is an electronic device. The electronic device includes: a housing, a first board and a second board disposed in an interior of the housing, and an interposer electrically connecting the first board and the second board, the interposer includes a first part that defines an outer surface thereof, and a second part that defines an inner surface thereof, vias included in the first part are all ground vias and are spaced apart from each other by a first interval, and the vias included in the second part include signal vias, and ground vias, the number of which is less than that of the signal vias, and may be spaced apart from each other by a second interval that is larger than or equal to the first interval.

公开(公告)号：US20240107726A1

公开(公告)日：2024-03-28

申请号：US18514331

申请日：2023-11-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyelim YUN ,  Bongkyu MIN ,  Dohoon KIM ,  Taewoo KIM ,  Jinyong PARK ,  Jungje BANG ,  Hyeongju LEE

IPC: H05K9/00 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K7/14

CPC classification number: H05K9/0032 ,  H05K1/115 ,  H05K1/144 ,  H05K1/181 ,  H05K7/1427 ,  H05K2201/10371 ,  H05K2201/10378

Abstract: An example electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.

公开(公告)号：US20200337188A1

公开(公告)日：2020-10-22

申请号：US16921801

申请日：2020-07-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyelim YUN ,  Bongkyu MIN ,  Dohoon KIM ,  Taewoo KIM ,  Jinyong PARK ,  Jungje BANG ,  Hyeongju LEE

IPC: H05K9/00 ,  H05K1/18 ,  H05K1/11 ,  H05K7/14 ,  H05K1/14

Abstract: Disclosed is an electronic device. The electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.