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    WIRING SUBSTRATE
    2.
    发明公开
    WIRING SUBSTRATE 审中-公开

    公开(公告)号：US20240136294A1

    公开(公告)日：2024-04-25

    申请号：US18489952

    申请日：2023-10-18

    Applicant: IBIDEN CO., LTD.

    Inventor： Ikuya TERAUCHI ,  Shogo FUKUI ,  Ryo ANDO ,  Keisuke SHIMIZU

    IPC: H01L23/538 ,  H05K1/11

    CPC classification number: H01L23/5383 ,  H01L23/5386 ,  H05K1/116 ,  H05K2201/0939 ,  H05K2201/094

    Abstract: A wiring substrate includes first conductor pads formed on a surface of an insulating layer, second conductor pads formed on the surface of the insulating layer, a second insulating layer covering the surface of the insulating layer and first and second conductor pads, first via conductors formed in first via holes penetrating through the second insulating layer such that the first via conductors are formed on the first conductor pads, and second via conductors formed in second via holes penetrating through the second insulating layer such that the second via conductors are formed on the second conductor pads. The first and second conductor pads are formed such that an annular width amount of each second conductor pad is smaller than an annular width amount of each first conductor pad and that a haloing amount in each second conductor pad is smaller than a haloing amount in each first conductor pad.

    MAXIMIZING SURFACE AREA OF SURFACE MOUNT CONTACT PADS OF CIRCUIT BOARD ALSO HAVING VIA CONTACT PADS
    7.
    发明申请
    MAXIMIZING SURFACE AREA OF SURFACE MOUNT CONTACT PADS OF CIRCUIT BOARD ALSO HAVING VIA CONTACT PADS 有权
    最大化电路板表面安装接触垫的表面区域也具有通过接触垫

    公开(公告)号：US20160066424A1

    公开(公告)日：2016-03-03

    申请号：US14473509

    申请日：2014-08-29

    Applicant: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.

    Inventor： Eric R. Ao ,  Stephen J. Flint ,  Michael W.J. Hogan ,  Shannon D. McGale ,  Rodolfo B. Salinas

    IPC: H05K1/11 ,  H05K3/40 ,  H05K1/18

    CPC classification number: H05K1/113 ,  H05K1/111 ,  H05K1/116 ,  H05K1/181 ,  H05K3/3415 ,  H05K2201/0939 ,  H05K2201/09609 ,  Y02P70/611

    Abstract: A circuit board has a first side and a second side opposite thereto. The board includes vias extending through the substrate from the first side to the second side, and via contact pads on the second side, each of which surrounds a corresponding via. The board includes a pair of surface mount contact pads on the second side. Each surface mount contact pad has a surface area and edges, each of which can have a shape to maximize the surface area while maintaining predetermined minimum separation distances. Each edge except one or more edges that are opposite another surface mount contact pad have a curved shape, and each edge opposite another surface mount contact pad have a linear shape. Curved edges adjacently opposite corresponding via contact pads can have curved shapes can have concave shapes, and curved edges not adjacently opposite via contact pads can have convex shapes.

    Abstract translation: 电路板具有与其相对的第一侧和第二侧。 该板包括从第一侧延伸穿过基板的通孔到第二侧，以及通过第二侧上的接触焊盘，其中每一个围绕相应的通孔。 该板包括一对表面贴装接触垫在第二面。 每个表面安装接触垫具有表面积和边缘，每个表面区域和边缘可以具有使表面积最大化的形状，同时保持预定的最小间隔距离。 除了与另一表面安装接触垫相对的一个或多个边缘之外的每个边缘具有弯曲形状，并且与另一表面安装接触垫相对的每个边缘具有线性形状。 通过接触焊盘相对相对相对的弯曲边缘可以具有弯曲形状可以具有凹形形状，并且通过接触垫不相邻相对的弯曲边缘可以具有凸形形状。

    Orientation-independent device configuration and assembly
    8.
    发明授权
    Orientation-independent device configuration and assembly 有权
    独立于方向的设备配置和组装

    公开(公告)号：US09000598B1

    公开(公告)日：2015-04-07

    申请号：US14040552

    申请日：2013-09-27

    Applicant: David W. Hamby ,  Adam M. Scotch ,  Sridharan Venk ,  Alan Lenef

    Inventor： David W. Hamby ,  Adam M. Scotch ,  Sridharan Venk ,  Alan Lenef

    IPC: H01L23/48 ,  H01L33/62 ,  H01L23/00 ,  H01L33/38 ,  H05K1/11

    CPC classification number: H01L33/62 ,  H01L24/83 ,  H01L33/38 ,  H01L2924/12041 ,  H05K1/111 ,  H05K3/303 ,  H05K2201/0939 ,  H05K2201/09809 ,  H05K2201/10106 ,  H05K2203/048 ,  H05K2203/0776 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

    Abstract: The present disclosure is directed to orientation-independent device configuration and assembly. An electronic device may comprise conductive pads arranged concentrically on a surface of the device. The conductive pads on the device may mate with conductive pads in a device location in circuitry. Example conductive pads may include at least a first circular conductive pad and a second ring-shaped conductive pad arranged to concentrically surround the first conductive pad. The concentric arrangement of the conductive pads allows for orientation-independent placement of the device in the circuitry. In particular, the conductive pads of the device will mate correctly with the conductive pads of the circuitry regardless of variability in device orientation. In one embodiment, the device may also be configured for use with fluidic self-assembly (FSA). For example, a device housing may be manufactured with pockets that cause the device to attain neutral buoyancy during manufacture.

    Abstract translation: 本公开涉及定向无关的装置配置和组装。 电子设备可以包括同心地布置在设备的表面上的导电焊盘。 器件上的导电焊盘可与电路中的器件位置中的导电焊盘配合。 示例性导电焊盘可以包括至少第一圆形导电焊盘和布置成同心地围绕第一导电焊盘的第二环形导电焊盘。 导电焊盘的同心布置允许器件在电路中的定向无关放置。 特别地，器件的导电焊盘将正确地与电路的导电焊盘配合，而不管器件取向如何变化。 在一个实施例中，该装置还可以被配置为与流体自组装（FSA）一起使用。 例如，可以制造具有在制造期间使装置达到中性浮力的袋的装置壳体。

    CONDUCTIVITY INSPECTION METHOD OF PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD
    9.
    发明申请
    CONDUCTIVITY INSPECTION METHOD OF PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD 审中-公开
    印刷电路板的电导率检测方法和印刷电路板的制造方法

    公开(公告)号：US20150059162A1

    公开(公告)日：2015-03-05

    申请号：US14477178

    申请日：2014-09-04

    Applicant: Nitto Denko Corporation

    Inventor： Terukazu IHARA ,  Kouji ICHINOSE

    IPC: G01R31/28 ,  H05K3/40 ,  H05K3/10 ,  G01R27/08 ,  G01R1/073

    CPC classification number: H05K3/4038 ,  G01R31/2805 ,  G01R31/2813 ,  G11B5/455 ,  G11B5/484 ,  H05K1/0268 ,  H05K1/115 ,  H05K1/116 ,  H05K3/4685 ,  H05K2201/09381 ,  H05K2201/0939 ,  Y10T29/49004

    Abstract: First and second measurement probes come into contact with first and second electrode pads, respectively, and third and fourth measurement probes come into contact with the first and second electrode pads, respectively. A current flows in a current path including the first and second electrode pads and a plurality of lines through the first and second measurement probes. A value of the current in the current path is measured, and a value of a voltage between the third and fourth measurement probes is measured. Conductivity between the first and second electrode pads is inspected based on the measured value of the current and the measured value of the voltage.

    Abstract translation: 第一和第二测量探针分别与第一和第二电极焊盘接触，第三和第四测量探针分别与第一和第二电极焊盘接触。 A电流在包括第一和第二电极焊盘的电流路径和通过第一和第二测量探针的多条线路中流动。 测量当前路径中的电流值，并测量第三和第四测量探针之间的电压值。 基于电流的测量值和电压的测量值检查第一和第二电极焊盘之间的电导率。

    PRINTED CIRCUIT BOARD
    10.
    发明申请
    PRINTED CIRCUIT BOARD 审中-公开
    印刷电路板

    公开(公告)号：US20150041207A1

    公开(公告)日：2015-02-12

    申请号：US14255387

    申请日：2014-04-17

    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.

    Inventor： SHAO-YOU TANG ,  PO-CHUAN HSIEH

    IPC: H05K1/02

    CPC classification number: H05K1/0225 ,  H05K1/0222 ,  H05K1/025 ,  H05K1/113 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/0723 ,  H05K2201/0939 ,  H05K2201/09618 ,  H05K2201/09709

    Abstract: A printed circuit board (PCB) includes a ground layer, a first layer, a second layer, a connector footprint, and a pair of differential signal lines. The connector footprint comprises first and second bonding pads. The PCB defines a first signal via in a central portion of a space bound by the first bonding pad, and a second signal via in a central portion of a space bound by the second bonding pad. A number of first ground vias on the first bonding pad and a number of second ground vias on the second bonding pad are electrically connected to the ground layer. First annular slots surrounding corresponding first ground vias are defined in the ground layer. Second annular slots surrounding corresponding second ground vias are defined in the ground layer. Connection slots are defined in the ground layer and communicate between the first annular slots and the second annular slots.

    Abstract translation: 印刷电路板（PCB）包括接地层，第一层，第二层，连接器覆盖区和一对差分信号线。 连接器封装包括第一和第二焊盘。 PCB在由第一接合焊盘限定的空间的中心部分中限定第一信号通道，以及在由第二接合焊盘限定的空间的中心部分中的第二信号通道。 第一接合焊盘上的多个第一接地通孔和第二接合焊盘上的多个第二接地通孔电连接到接地层。 围绕对应的第一接地通孔的第一环形槽限定在接地层中。 围绕相应的第二接地通孔的第二环形槽限定在接地层中。 连接槽限定在接地层中，并在第一环形槽和第二环形槽之间连通。

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