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    FILM PACKAGE
    15.
    发明申请
    FILM PACKAGE 有权

    公开(公告)号：US20250022998A1

    公开(公告)日：2025-01-16

    申请号：US18583947

    申请日：2024-02-22

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Seunghyun Cho ,  Jaemin Jung ,  Jeongkyu Ha

    IPC: H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  H01L33/48

    Abstract: A film package includes a film substrate, vias penetrating through the film substrate, interconnection patterns on the film substrate, and a semiconductor chip electrically connected to at least one of the interconnection patterns and to the vias, wherein the interconnection patterns include input patterns, first output patterns, and second output patterns, the film package includes input pads on a surface of the film substrate, and the input patterns extend from the input pads, the film package includes first output pads positioned toward a first edge of the film substrate on a first surface of the film substrate, and the first output patterns extend from the first output pads, and the film package includes second output pads positioned toward a second edge of the film substrate on a second surface of the film substrate opposite to the first surface, and the second output patterns extend from the second output pads.

    FILM PACKAGE AND DISPLAY MODULE INCLUDING SAME
    16.
    发明公开
    FILM PACKAGE AND DISPLAY MODULE INCLUDING SAME 审中-公开

    公开(公告)号：US20240204009A1

    公开(公告)日：2024-06-20

    申请号：US18237013

    申请日：2023-08-23

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Seunghyun Cho ,  Jaemin Jung ,  Jeongkyu Ha

    IPC: H01L27/12

    CPC classification number: H01L27/1244

    Abstract: A film package includes: a film substrate having a first side surface and a second side surface opposing each other in a first direction, each of the first side surface and the second side surface extending in a second direction perpendicular to the first direction; at least one semiconductor chip disposed on the film substrate and extending lengthwise in the first direction; input terminals arranged on the film substrate along the first side surface, output terminals arranged on the film substrate along the second side surface, and wirings formed on the film substrate and electrically connecting the input terminals and the output terminals to the at least one semiconductor chip; and a protective layer covering the wirings on the film substrate.

    CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
    18.
    发明公开
    CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME 审中-公开

    公开(公告)号：US20240096909A1

    公开(公告)日：2024-03-21

    申请号：US18200609

    申请日：2023-05-23

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Seunghyun Cho ,  Jaemin Jung ,  Jeongkyu Ha

    IPC: H01L27/12 ,  H05K7/20

    CPC classification number: H01L27/1244 ,  H05K7/20954

    Abstract: A chip on film (COF) package includes a film substrate including a base film having a mounting region, a main line pattern extending on the base film, and a branch line pattern extending on the base film and electrically connected to the main line pattern, a semiconductor chip vertically overlapping the mounting region, a first bump structure disposed between the semiconductor chip and the film substrate and electrically connected to the main line pattern, and a second bump structure disposed between the semiconductor chip and the film substrate and electrically connected to the branch line pattern, the branch line pattern extends so as not to overlap a first edge of the first bump structure facing a first edge of the mounting region and a first edge of the second bump structure facing the first edge of the mounting region.

    CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
    19.
    发明申请
    CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME 有权

    公开(公告)号：US20230036519A1

    公开(公告)日：2023-02-02

    申请号：US17679587

    申请日：2022-02-24

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Sanguk HAN ,  Jaemin Jung ,  Jeongkyu Ha ,  Kwanjai Lee

    IPC: G09G3/20

    Abstract: A chip on film package is provided. The chip on film package includes a film substrate with a base film, a conductive pad extending in a first direction on the base film, and a conductive line pattern extending from the conductive pad; a semiconductor chip provided on the film substrate; and a bump structure provided between the semiconductor chip and the conductive pad. A first peripheral wall and a second peripheral wall of the bump structure extend in the first direction and define a trench, a portion of the conductive pad is provided in the trench, and the conductive pad is spaced apart from at least one of the first peripheral wall and the second peripheral wall.

    CHIP-ON-FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
    20.
    发明申请
    CHIP-ON-FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME 有权

    公开(公告)号：US20220246530A1

    公开(公告)日：2022-08-04

    申请号：US17579635

    申请日：2022-01-20

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jaemin Jung ,  Jeongkyu Ha ,  Sanguk Han

    IPC: H01L23/538 ,  H01L25/18 ,  H05K1/18

    Abstract: A chip on film (COF) package includes a base film having an upper surface and a lower surface opposite to each other, a bridge film having an edge that overlaps the base film, and an upper surface and a lower surface opposite to each other, a display driver integrated circuit (IC) mounted on the upper surface of the base film, and a heat dissipation member arranged in correspondence with the display driver IC on the lower surface of the base film. The upper surface of the base film and the lower surface of the bridge film adhere to each other in their respective long axis directions, and a long axis length of the bridge film is greater than a long axis length of the base film.

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