Digital Holography Microscope (DHM), and Inspection Method and Semiconductor Manufacturing Method Using the DHM

    公开(公告)号:US20220276607A1

    公开(公告)日:2022-09-01

    申请号:US17716257

    申请日:2022-04-08

    Abstract: A low-cost digital holography microscope (DHM) that is capable of performing inspection at high speed while accurately inspecting an inspection object at high resolution, an inspection method using the DHM, and a method of manufacturing a semiconductor device by using the DHM are provided. The DHM includes: a light source configured to generate and output light; a beam splitter configured to cause the light to be incident on an inspection object and output reflected light from the inspection object; and a detector configured to detect the reflected light, wherein, when the reflected light includes interference light, the detector generates a hologram of the interference light, and wherein no lens is present in a path from the light source to the detector.

    Wafer inspection apparatus
    14.
    发明授权

    公开(公告)号:US11264256B2

    公开(公告)日:2022-03-01

    申请号:US16849631

    申请日:2020-04-15

    Abstract: Provided is a wafer inspection apparatus including a monochromator that extracts monochromatic light, a collimator that outputs the monochromatic light as parallel light, a first polarization assembly that polarizes the parallel light and radiates the polarized light to a wafer, an imaging optical system that condenses light reflected from the wafer, a spectroscope that splits the condensed light into a plurality of spectrums, a first lens that condenses the plurality of spectrums, a second polarization assembly that outputs the plurality of spectrums as a plurality of polarized lights having different diffraction orders and a difference of 90°, a second lens that condenses the plurality of polarized lights, a third polarization assembly that outputs common polarized light based on the plurality of polarized interfering with each other, a camera that generates a phase difference image based on the common polarized light, and a signal processor that analyzes the phase difference image.

    Semiconductor measurement apparatus

    公开(公告)号:US12222282B2

    公开(公告)日:2025-02-11

    申请号:US18082040

    申请日:2022-12-15

    Abstract: A semiconductor measurement apparatus includes an illumination unit configured to provide illumination light including linearly polarized light beams having different wavelengths, an optical unit including an objective lens configured to allow the illumination light to be incident on a sample, the optical unit being configured to transmit reflection light generated when the illumination light is reflected from the sample, a self-interference generator configured to self-interfere the reflection light transmitted from the optical unit and transmit the reflection light to a first image sensor, for each wavelength, and a controller. The controller is configured to process a measurement image output by the image sensor to divide the measurement image into a first image representing an intensity ratio of a polarization component of the reflection light and a second image representing a phase difference of the polarization component of the reflection light, for each wavelength.

    SEMICONDUCTOR MEASUREMENT APPARATUS
    17.
    发明公开

    公开(公告)号:US20240288265A1

    公开(公告)日:2024-08-29

    申请号:US18372391

    申请日:2023-09-25

    CPC classification number: G01B11/02 G01B2210/56

    Abstract: Provided is a semiconductor measurement apparatus that includes: a lighting unit comprising a light source, and a light modulator configured to decompose a light output by the light source into a plurality of wavelength bands and generate an output light of at least two selected wavelength bands; a first optical unit comprising an illumination polarizing element disposed in a path of the output light; a second optical unit comprising a beam splitter, an objective lens configured to allow light having passed through the first optical unit to be incident onto a sample, and a self-interference generator disposed on a path of a reflected light; a sensor configured to output an original image representing an interference pattern of light having passed through the self-interference generator; and a controller configured to process the original image and determine a selected critical dimension of a structure included in the sample.

    SUBSTRATE INSPECTION APPARATUS AND SUBSTRATE INSPECTION METHOD

    公开(公告)号:US20240219315A1

    公开(公告)日:2024-07-04

    申请号:US18493226

    申请日:2023-10-24

    CPC classification number: G01N21/9501 G01N21/8806 G01N21/956

    Abstract: A substrate inspection apparatus includes a light irradiator including an objective lens and a plurality of optical fibers. The objective lens is configured to irradiate light to an illumination area on a semiconductor substrate having a plurality of circuit pattern layers, the plurality of optical fibers are adjacent a periphery of the objective lens and are configured to irradiate the light to a peripheral area adjacent the illumination area. A light generator is configured to generate the light. The light generator is configured to change an irradiation angle of the light to selectively irradiate the light to one or more of the objective lens and the plurality of optical fibers. A light analyzer is configured to obtain images of the circuit pattern layers from the light reflected from the illumination area and the peripheral area. The light analyzer is configured to model each of the circuit pattern layers of the semiconductor substrate to obtain image models and to measure an overlay between the circuit pattern layers through the images and the image models.

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