公开(公告)号：US20250105193A1

公开(公告)日：2025-03-27

申请号：US18890118

申请日：2024-09-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jungmin Ko ,  Hyunhee Lee ,  Hojun Lee ,  Dongjoo Choi

IPC: H01L23/00 ,  H01L23/498 ,  H01L25/065 ,  H10B80/00

Abstract: A semiconductor package includes a first semiconductor chip including a first through-via and a first upper pad, a second semiconductor chip provided on the first semiconductor chip and including a second lower pad, and a bonding bump provided between the first semiconductor chip and the second semiconductor chip and connected to the first upper pad and the second lower pad. The bonding bump includes: a conductive pattern directly contacting the second lower pad and including nickel and a bonding structure directly contacting the conductive pattern and the first upper pad, wherein the bonding structure includes an intermetallic compound including copper and a solder material. A thickness of the bonding structure is from about 47% to about 54% of a sum of a thickness of the conductive pattern, a thickness of the bonding structure, and a thickness of the first upper pad.

公开(公告)号：US20250048627A1

公开(公告)日：2025-02-06

申请号：US18427977

申请日：2024-01-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyeok Heo ,  Kyoung-Ho Kim ,  Hojun Lee ,  Sungsu Moon ,  Sea Hoon Lee ,  Jaeduk Lee ,  Junhee Lim

IPC: H10B43/27 ,  H01L25/065 ,  H10B43/10 ,  H10B43/35 ,  H10B43/40 ,  H10B80/00

Abstract: Disclosed are semiconductor devices and electronic systems including the same. The semiconductor device includes a substrate that has a recess region, a gate electrode on a bottom surface of the recess region, a gate dielectric layer between the gate electrode and the bottom surface of the recess region, a plurality of shield electrodes on laterally opposite sides of the gate electrode and on inner sidewalls of the recess region, a plurality of dielectric patterns between the shield electrodes and the inner sidewalls of the recess region, a plurality of impurity regions in the substrate and on opposite sides of the shield electrodes, and a channel region in the substrate and below the bottom surface of the recess region.

公开(公告)号：US11475956B2

公开(公告)日：2022-10-18

申请号：US17234175

申请日：2021-04-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chaehoon Kim ,  Junyoung Ko ,  Sangwan Nam ,  Minjae Seo ,  Jiwon Seo ,  Hojun Lee

IPC: G11C16/08 ,  G11C16/20 ,  G11C16/16 ,  G11C16/04 ,  G11C16/30 ,  G11C16/34 ,  G11C16/26

Abstract: A method of operating a nonvolatile memory device which includes at least one memory block is provided. The method includes providing a plurality of word-lines with a voltage during a word-line set-up period, precharging a plurality of driving lines with a voltage during a word-line development period, detecting a voltage drop of a sensing node during a sensing period, and detecting leakage based on the voltage drop.

公开(公告)号：US20240219315A1

公开(公告)日：2024-07-04

申请号：US18493226

申请日：2023-10-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jangwoon Sung ,  Lei Tian ,  Hao Wang ,  Jiabei Zhu ,  Myungjun Lee ,  Wookrae Kim ,  Seungbeom Park ,  Junho Shin ,  Hojun Lee

IPC: G01N21/95 ,  G01N21/88 ,  G01N21/956

CPC classification number: G01N21/9501 ,  G01N21/8806 ,  G01N21/956

Abstract: A substrate inspection apparatus includes a light irradiator including an objective lens and a plurality of optical fibers. The objective lens is configured to irradiate light to an illumination area on a semiconductor substrate having a plurality of circuit pattern layers, the plurality of optical fibers are adjacent a periphery of the objective lens and are configured to irradiate the light to a peripheral area adjacent the illumination area. A light generator is configured to generate the light. The light generator is configured to change an irradiation angle of the light to selectively irradiate the light to one or more of the objective lens and the plurality of optical fibers. A light analyzer is configured to obtain images of the circuit pattern layers from the light reflected from the illumination area and the peripheral area. The light analyzer is configured to model each of the circuit pattern layers of the semiconductor substrate to obtain image models and to measure an overlay between the circuit pattern layers through the images and the image models.

公开(公告)号：US20170183401A1

公开(公告)日：2017-06-29

申请号：US15387198

申请日：2016-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hongseok Jo ,  Sang Yeul Han ,  Joo-Hye Song ,  Yuhoi Kang ,  Young Jun Koh ,  Sang Chul Park ,  Hojun Lee

IPC: C07K16/22

CPC classification number: C07K16/22 ,  A61K2039/505 ,  A61K2039/545 ,  C07K2317/20 ,  C07K2317/24 ,  C07K2317/34 ,  C07K2317/565 ,  C07K2317/622 ,  C07K2317/92

Abstract: Provided is a method of decreasing blood sugar level or preventing and/or treating a hyperglycemia-related disease, including administering an anti-Ang2 antibody or an antigen-biding fragment thereof to a subject in need thereof.

公开(公告)号：US20240418645A1

公开(公告)日：2024-12-19

申请号：US18408247

申请日：2024-01-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hojun Lee ,  Jangwoon Sung ,  Wookrae Kim ,  Hyungjin Kim ,  Seungbeom Park ,  Junho Shin ,  Myungjun Lee

IPC: G01N21/47 ,  H01L21/66 ,  G01N21/17

Abstract: An example semiconductor measurement apparatus includes a light source, a pattern generator, a stage, an image sensor, and a controller. The light source is configured to output light in a predetermined wavelength band. The pattern generator is configured to generate light including a speckle pattern by scattering the light output from the light source. The stage is disposed on a movement path of the light including the speckle pattern, and a sample reflecting the light including the speckle pattern is seated on the stage. The image sensor is configured to receive light reflected from the sample and generate an original image representing a diffractive pattern of light reflected from the sample. The controller is configured to generate a prediction image for estimating diffractive characteristics of light incident on the image sensor.

公开(公告)号：US11798626B2

公开(公告)日：2023-10-24

申请号：US17947320

申请日：2022-09-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chaehoon Kim ,  Junyoung Ko ,  Sangwan Nam ,  Minjae Seo ,  Jiwon Seo ,  Hojun Lee

IPC: G11C16/34 ,  G11C16/08 ,  G11C16/20 ,  G11C16/16 ,  G11C16/04 ,  G11C16/30 ,  G11C16/26

CPC classification number: G11C16/08 ,  G11C16/0425 ,  G11C16/16 ,  G11C16/20 ,  G11C16/26 ,  G11C16/30 ,  G11C16/3404

Abstract: A method of operating a nonvolatile memory device which includes at least one memory block is provided. The method includes providing a plurality of word-lines with a voltage during a word-line set-up period, precharging a plurality of driving lines with a voltage during a word-line development period, detecting a voltage drop of a sensing node during a sensing period, and detecting leakage based on the voltage drop.

公开(公告)号：US20170183399A1

公开(公告)日：2017-06-29

申请号：US15387282

申请日：2016-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yuhoi Kang ,  Hojun Lee ,  Hongseok Jo ,  Sang Chul Park ,  Sang Yeul Han

IPC: C07K16/18

CPC classification number: C07K16/18 ,  A61K2039/505 ,  C07K16/22 ,  C07K2317/21 ,  C07K2317/24 ,  C07K2317/565 ,  C07K2317/622 ,  C07K2317/74 ,  C07K2317/75 ,  C07K2317/92

Abstract: Provided is a method of potentiating immunity or preventing or treating an immune-related disease comprising administering an anti-Ang2 antibody or an antigen-binding fragment thereof to a subject in need thereof.