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公开(公告)号：US20220153989A1
公开(公告)日：2022-05-19
申请号：US17437555
申请日：2019-04-08
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Liexiang HE , Yongnian QI , Xianping ZENG , Zhongqiang YANG , Hualin PAN
Abstract: The present disclosure discloses a resin composition, and a prepreg, a laminate and a printed circuit board containing the same. The resin composition comprises 100 parts by weight of a halogen-free epoxy resin, 11-37 parts by weight of an active ester resin, and 40-66 parts by weight of a compound represented by Formula (I), wherein n is 2-15; Ac represents an acetyl group. The prepreg, laminate and printed circuit board prepared from such resin composition have a low dielectric loss factor, good flame retardancy, and also have high interlaminar adhesion and a low CTE.
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12.发明申请公开(公告)号：US20200157332A1
公开(公告)日：2020-05-21
申请号：US16632584
申请日：2017-10-19
Applicant: Shengyi Technology Co., Ltd.
Inventor： Chiji GUAN , Xianping ZENG , Guangbing CHEN , Haosheng XU
IPC: C08L25/08 , C08J5/24 , C08L83/04 , C09D183/04 , H05K1/02 , C09D125/08 , B32B5/02 , B32B5/26 , H05K1/03 , C08G77/00
Abstract: A thermosetting resin composition and a prepreg and a metal foil-covered laminate made using same, the thermosetting resin composition comprising component (A): a solvent-soluble polyfunctional vinyl aromatic copolymer, the copolymer being a poly-functional vinyl aromatic copolymer having a stoctoal unit derived from monomers comprising divinyl aromatic compound (a) and ethyl vinyl aromatic compound (b); and component (B): a vinyl-containing organic silicone resin. The prepreg and metal foil-covered laminate made from the thermosetting resin composition have good toughness, and maintain a high glass transition temperature, a low water absorption, dielectric properties and humidity resistance, being suitable for the field of high-frequency and high-speed printed circuit boards and the processing of multilayer printed circuit boards.
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公开(公告)号：US20180037736A1
公开(公告)日：2018-02-08
申请号：US15555212
申请日：2015-09-18
Applicant: Shengyi Technology Co., Ltd.
Inventor： Xianping ZENG , Guangbing CHEN , Chiji GUAN , Wenhua YANG
CPC classification number: C08L71/126 , B32B15/08 , B32B15/085 , B32B15/20 , B32B27/08 , C08F279/02 , C08F290/062 , C08J5/24 , C08J2309/06 , C08J2325/10 , C08J2347/00 , C08J2371/02 , C08J2371/12 , C08J2409/00 , C08J2409/06 , C08J2425/10 , C08J2447/00 , C08J2471/02 , C08L9/06 , C08L25/10 , C08L47/00 , C08L51/08 , C08L71/12 , C08L2201/02 , C08K5/14 , C08K3/36 , C08K5/3415 , C08F220/40
Abstract: The present invention relates to the technical field of copper clad laminates and relates to a resin composition and a pre-preg and a laminate using the composition. The resin composition comprises: (A) a prepolymer of vinyl thermosetting polyphenylene ether and a bifunctional maleimide or a multifunctional maleimide; and, (B) a polyolefin resin. The present invention, by employing the prepolymer of vinyl thermosetting polyphenylene ether and the bifunctional maleimide or the multifunctional maleimide, solves the problem of incompatibility of the bifunctional maleimide or the multifunctional maleimide with the vinyl thermosetting polyphenylene ether and the polyolefin resin. An aqueous glue solution so mixed is uniform and consistent, the prepreg has a uniform expression, and a substrate resin area is free of a phase-separation problem. In addition, the maleimide employed is either the bifunctional maleimide or the multifunctional maleimide, relative to a monofunctional maleimide, a substrate so prepared is provided with increased heat resistance, a reduced thermal expansion coefficient, extended thermal stratification time, and increased thermal decomposition temperature.
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公开(公告)号：US20160007452A1
公开(公告)日：2016-01-07
申请号：US14647412
申请日：2014-02-19
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Shanyin YAN , Xianping ZENG , Yongjing XU , Zhongqiang YANG , Xiaosheng SU , Li Luo
CPC classification number: H05K1/0306 , C03C25/16 , C03C25/30 , C03C25/326 , C03C25/36 , C08J5/24 , C08J2323/20 , C08J2363/00 , C08J2371/12 , C08J2379/04 , H05K1/0366 , H05K1/0393 , H05K3/0011 , H05K3/0085 , H05K2201/029
Abstract: The present invention relates to a process for preparing a bonding sheet for composing circuit substrate, comprising pre-treating glass fabrics with a pre-treating varnish having a same or close dielectric constant (DK) to glass fabrics being used. The present invention further relates to bonding sheets prepared by the process, as well as circuit substrate. The process for preparing circuit substrate of the invention, which has a lower cost, does not need to upgrade or adjust the equipment. The circuit substrates prepared thereby have less warp-wise and weft-wise difference in dielectric constant, and thus can effectively solve the problem of signal time delay.
Abstract translation: 本发明涉及一种制备用于构成电路基板的接合片的方法，包括用玻璃织物预处理玻璃织物与具有相同或接近介电常数（DK）的预处理清漆。 本发明还涉及通过该方法制备的粘合片以及电路基片。 本发明的具有较低成本的电路基板的制造方法不需要升级或调整设备。 由此制备的电路基板在介电常数方面具有较少的经向和纬向差异，因此可以有效地解决信号时间延迟的问题。
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公开(公告)号：US20150313012A1
公开(公告)日：2015-10-29
申请号：US14647672
申请日：2013-01-21
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Guangbing CHEN , Xianping ZENG
CPC classification number: H05K1/0366 , B32B15/14 , B32B15/20 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2305/076 , B32B2307/204 , B32B2307/3065 , B32B2457/08 , C08G65/485 , C08G77/20 , C08J5/24 , C08K5/3417 , C08K5/53 , C08K5/5425 , C08K5/549 , C08L71/00 , C08L71/12 , C08L71/126 , C08L83/04 , H05K1/0373 , H05K3/022 , H05K2201/012 , H05K2201/0209
Abstract: Disclosed in the present invention is a resin composition, comprising a modified polyphenylene ether resin and an organic silicon compound containing unsaturated double bonds. Also disclosed is a method for preparing a high-frequency circuit substrate using the resin composition as described above and a high-frequency circuit substrate obtained by the preparation method. The high-frequency circuit substrate of the present invention has a high glass transition temperature, a high thermal decomposition temperature, a high interlayer adhesive force, a low dielectric constant and a low dielectric loss tangent, and is very suitable as a circuit substrate in a high-frequency electronic device.
Abstract translation: 在本发明中公开了一种树脂组合物，其包含改性聚苯醚树脂和含有不饱和双键的有机硅化合物。 还公开了使用上述树脂组合物制备高频电路基板的方法和通过该制备方法获得的高频电路基板。 本发明的高频电路基板具有高玻璃化转变温度，高热分解温度，高层间粘合力，低介电常数和低介电损耗角正切，并且非常适合作为电路基板 高频电子设备。
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Patent Agency Ranking
16.发明公开公开(公告)号：US20230257583A1
公开(公告)日：2023-08-17
申请号：US18009156
申请日：2021-03-19
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Guangbing CHEN , Xianping ZENG
CPC classification number: C08L83/04 , C08J5/18 , C08J5/244 , C08K5/0066 , C08L71/12 , C08J2371/12 , C08J2383/07 , C08L2201/02 , C08L2203/20
Abstract: A resin composition, and a resin film, a prepreg, a laminated board, a copper-clad board, and a printed circuit board which comprise same. The resin composition comprises a combination of thermosetting polyphenylene ether resin, vinyl organic silicon resin, and a fully hydrogenated elastomeric polymer; and based on 100 parts by weight of the sum of the addition amounts of the thermosetting polyphenylene ether resin, the vinyl organic silicon resin, and the fully hydrogenated elastomeric polymer, the addition amount of the fully hydrogenated elastomer polymer is 20-50 parts by weight. The copper-clad board prepared from the resin composition has the characteristics of low dielectric constant, low dielectric loss, excellent thermal-oxidative aging resistance, high glass transition temperature, high heat resistance, high peel strength, low water absorption rate, and the like, and can be applied to scenes such as automobile radars in worse use environments.
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17.发明申请公开(公告)号：US20210070980A1
公开(公告)日：2021-03-11
申请号：US16632005
申请日：2017-10-19
Applicant: Shengyi Technology Co., Ltd.
Inventor： Xianping ZENG , Chiji GUAN , Guangbing CHEN , Haosheng XU
Abstract: Thermosetting resin composition, prepreg and metal foil clad laminate made therefrom. The thermosetting resin composition comprises (A): a solvent-soluble multifunctional vinyl aromatic copolymer, wherein same is a multifunctional vinyl aromatic copolymer having structural units from monomers comprising a divinyl aromatic compound (a) and ethyl vinyl aromatic compound (b); and (B), wherein same is selected from olefin resins having a number-average molecular weight of 500-10,000 and containing 10%-50% by weight of a styrene structure, and the molecules thereof contain a 1,2-addition butadiene structure. The prepreg and copper foil clad laminate made from the thermosetting resin composition of the present invention have a good toughness, and maintain a high glass transition temperature, a low water absorption, excellent dielectric properties and damp heat resistance thereof, and are suitable for use in the field of high frequency and high speed printed circuit boards, and are also suitable for processing multilayer printed circuit boards.
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公开(公告)号：US20200087507A1
公开(公告)日：2020-03-19
申请号：US15744686
申请日：2017-08-14
Applicant: Shengyi Technology Co., Ltd.
Inventor： Xianping ZENG , Liexiang HE
Abstract: The present disclosure relates to a halogen-free epoxy resin composition and a prepreg and a laminate using the same. The halogen-free epoxy resin composition comprises: (A) a halogen-free epoxy resin; (B) an active ester resin; and (C) a reactive phosphorous-containing flame retardant. The prepreg and laminate made from the halogen-free epoxy resin composition have the advantages of high inter-laminar adhesive force, low coefficient of thermal expansion and high heat-humidity resistance, and can achieve the halogen-free flame retardant purpose.
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19.发明申请公开(公告)号：US20190002689A1
公开(公告)日：2019-01-03
申请号：US15744579
申请日：2016-04-08
Applicant: Shengyi Technology Co., Ltd.
Inventor： Guangbing CHEN , Xianping ZENG
CPC classification number: C08L71/126 , B32B27/00 , B32B27/285 , B32B2305/076 , C08J5/24 , C08J2325/10 , C08J2371/12 , C08J2409/00 , C08J2409/06 , C08J2425/10 , C08J2447/00 , C08J2471/12 , C08L9/06 , C08L25/10 , C08L71/12 , C08L2312/02 , H05K1/034 , H05K1/0366 , H05K1/0373 , H05K2201/012 , H05K2201/0129 , H05K2201/015 , C08L9/00
Abstract: Provided are a polyphenyl ether resin composition and a prepreg and a laminated board containing same. The polyphenyl ether resin composition comprises the following components: (1) a tetrafunctional or higher multifunctional acrylate-modified thermosetting polyphenyl ether resin; and (2) a vinyl eresin cross-linking agent, the weight of the vinyl resin cross-linking agent being 40-100 parts by weight based on 100 parts by weight of the tetrafunctional or higher multifunctional acrylate-modified thermosetting polyphenyl ether resin. The modified thermosetting polyphenyl ether resin, due to containing a tetrafunctional or higher multifunctional acrylate active group, can cross-link more vinyl resin cross-linking agents. Not only the prepared high-speed electronic circuit substrate has low dielectric constant and dielectric loss, but also double bonds in side chains of the vinyl resin cross-linking agent are reacted completely in a resin curing system, so that the high-speed electronic circuit substrate has a better thermo-oxidative aging resistance.
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20.发明申请公开(公告)号：US20180215971A1
公开(公告)日：2018-08-02
申请号：US15744446
申请日：2016-03-02
Applicant: Shengyi Technology Co., Ltd.
Inventor： Guangbing CHEN , Xianping ZENG , Chiji GUAN
CPC classification number: C09J171/12 , C08G65/485 , C08G77/20 , C08J5/24 , C08J2371/12 , C08J2483/07 , C08L71/126 , C09J11/04 , C09J11/06 , H05K1/0237 , H05K1/0353 , H05K1/0366 , H05K1/0373 , H05K2201/012 , H05K2201/0162 , C08L83/04 , C08K5/14
Abstract: The present invention relates to a polyphenyl ether resin composition and a use thereof in a high-frequency circuit substrate. The polyphenyl ether resin composition comprises a vinyl-modified polyphenyl ether resin and an organic silicon resin containing unsaturated double bonds and having a three-dimensional net structure. The high-frequency circuit substrate of the present invention has a high glass-transition temperature, a high thermal decomposition temperature, a high interlayer adhesive force, a low dielectric constant and a low dielectric loss tangent, and is very suitable as a circuit substrate of high-speed electronic equipment.
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