公开(公告)号：US20180233553A1

公开(公告)日：2018-08-16

申请号：US15891637

申请日：2018-02-08

Applicant: TDK CORPORATION

Inventor： Mitsuhiro TOMIKAWA ,  Koichi TSUNODA ,  Kazuhiro YOSHIKAWA ,  Kenichi YOSHIDA

IPC: H01L49/02 ,  H01G4/30 ,  H01G4/33 ,  H01G4/228

Abstract: An electronic component embedded substrate includes: a substrate that includes an insulating layer and has a first principal surface and a second principal surface on the opposite side of the first principal surface; and an electronic component that is embedded in the substrate and has a plurality of first terminals provided close to the first principal surface, a plurality of second terminals provided close to the second principal surface, and a capacity part provided between the plurality of first terminals and the plurality of second terminals. The electronic component is configured such that at least a part of the second terminals is embedded in the insulating layer. An insulating member is provided between the neighboring second terminals to be in contact with both of the neighboring second terminals. The insulating member and the insulating layer are formed of materials whose thermal expansion coefficients are different from each other.

公开(公告)号：US20180102218A1

公开(公告)日：2018-04-12

申请号：US15725654

申请日：2017-10-05

Applicant: TDK CORPORATION

Inventor： Kenichi YOSHIDA ,  Kazuhiro YOSHIKAWA ,  Michihiro KUMAGAE ,  Norihiko MATSUZAKA ,  Junki NAKAMOTO

IPC: H01G4/30 ,  H01G4/232 ,  H01L23/522 ,  H01L27/01 ,  H01L49/02 ,  H01G4/33

CPC classification number: H01G4/30 ,  H01G4/232 ,  H01G4/306 ,  H01G4/33 ,  H01L23/5223 ,  H01L27/016 ,  H01L28/40 ,  H01L28/91 ,  H01L2224/05001 ,  H01L2224/05027

Abstract: A thin-film capacitor includes electrode layers stacked in a stacking direction; dielectric layers stacked between the electrode layers; an opening portion that includes a side surface penetrating at least a part of the electrode layers and at least a part of the dielectric layers in the stacking direction from a top side and a bottom surface exposing one of the electrode layers; and a wiring portion disposed in the opening portion to be separated from the side surface of the opening portion, and electrically connected to the electrode layer exposed from the bottom surface of the opening portion. The dielectric layer that is stacked immediately on the electrode layer exposed from the bottom surface of the opening portion among the dielectric layers includes an extension portion extending in the opening portion from the side surface of the opening portion to the wiring portion side.

公开(公告)号：US20140054770A1

公开(公告)日：2014-02-27

申请号：US13960330

申请日：2013-08-06

Applicant: TDK CORPORATION

Inventor： Kenichi YOSHIDA ,  Makoto ORIKASA ,  Hideyuki SEIKE ,  Yuhei HORIKAWA ,  Hisayuki ABE

IPC: H01L23/00

CPC classification number: H01L24/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/03462 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05571 ,  H01L2224/05655 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13006 ,  H01L2224/13017 ,  H01L2224/13022 ,  H01L2224/13076 ,  H01L2224/13111 ,  H01L2924/00014 ,  H01L2224/05572 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/05552

Abstract: A preferred terminal structure comprises a base material; an electrode formed on the base material; an insulating covering layer formed on the base material and on the electrode and having an opening exposing at least part of the electrode; an under bump metal layer containing Ni, formed in a region in the opening on the electrode so that an upper surface of the metal layer is at a position lower than an upper surface of the insulating covering layer in a peripheral edge portion of the opening; and a dome-shaped bump containing Sn and Ti, formed in a region in the opening on the under bump metal layer, wherein an end portion of a boundary between the under bump metal layer and the bump is in contact with an inner wall of the opening portion in the insulating covering layer.

Abstract translation: 优选的端子结构包括基材; 形成在基材上的电极; 绝缘覆盖层，形成在所述基底材料上和所述电极上，并且具有暴露所述电极的至少一部分的开口; 在所述电极的开口部的区域形成含有Ni的下凸块金属层，使得所述金属层的上表面位于比所述开口的周缘部的所述绝缘覆盖层的上表面低的位置; 以及形成在下凸块金属层的开口部的区域中的包含Sn和Ti的圆顶状的凸部，其中，下凸块状金属层与凸块之间的边界的端部与内凸块 绝缘覆盖层的开口部。

公开(公告)号：US20140054767A1

公开(公告)日：2014-02-27

申请号：US13960173

申请日：2013-08-06

Applicant: TDK CORPORATION

Inventor： Kenichi YOSHIDA ,  Makoto ORIKASA ,  Hideyuki SEIKE ,  Yuhei HORIKAWA ,  Hisayuki ABE

IPC: H01L23/00

CPC classification number: H01L24/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/05655 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13005 ,  H01L2224/13006 ,  H01L2224/13023 ,  H01L2224/13111 ,  H01L2924/00014 ,  H01L2224/05552

Abstract: The present invention relates to a terminal structure comprising; a base material 10; an external electrode 20 formed on the base material; an insulating coating layer 30 formed on the base material and on the electrode and having an opening exposing at least part of the electrode; an under-bump metal layer 70 filling the opening and covering part of the insulating coating layer; and a dome-shaped bump 85 covering the under-bump metal layer, wherein in a cross section along a lamination direction, the under-bump metal layer has a convex shape toward the bump, and the thickness Tu0 of the under-bump metal layer at a center of the opening is equal to or greater than the thickness Tu1 of the under-bump metal layer at an end portion of the opening.

Abstract translation: 本发明涉及一种终端结构，包括： 基材10; 形成在基材上的外部电极20; 绝缘涂层30，形成在基材和电极上，并具有露出电极的至少一部分的开口; 填充绝缘涂层的开口和覆盖部分的凸块下金属层70; 以及覆盖凸块下金属层的圆顶状凸起85，其中沿着层叠方向的截面中，凸块下金属层朝向凸块呈凸形，凸块下金属层的厚度Tu0 在开口的中心处等于或大于开口端部处的凸块下金属层的厚度Tu1。

公开(公告)号：US20130126208A1

公开(公告)日：2013-05-23

申请号：US13678033

申请日：2012-11-15

Applicant: TDK CORPORATION

Inventor： Kenichi YOSHIDA ,  Yuhei HORIKAWA ,  Makoto ORIKASA ,  Hideyuki SEIKE

IPC: H01B1/02

CPC classification number: H01B1/02 ,  H01L2224/85444

Abstract: A coating is provided to a conductor, and has a layered structure of a palladium layer. The palladium layer is amorphous and contains phosphorus in a concentration ranging from 7.3% by mass to 11.0% by mass.

Abstract translation: 向导体提供涂层，并且具有钯层的层状结构。 钯层为无定形，含有浓度为7.3质量％〜11.0质量％的磷。

公开(公告)号：US20250149252A1

公开(公告)日：2025-05-08

申请号：US18837696

申请日：2022-12-02

Applicant: TDK Corporation

Inventor： Daiki ISHII ,  Mitsuhiro TOMIKAWA ,  Kenichi YOSHIDA ,  Takashi KARIYA ,  Yasunori HARADA ,  Yoshiaki HAYAMIZU ,  Miyu HASEGAWA

IPC: H01G4/33 ,  H01G4/008 ,  H01L23/00 ,  H05K1/11 ,  H05K1/18

Abstract: To provide a thin film capacitor having a pair of terminal electrodes capable of being disposed on the same plane. A thin film capacitor includes a metal foil having a roughened surface, a dielectric film covering the roughened surface of the metal foil and having an opening partially exposing the metal foil therethrough, an electrode layer contacting the metal foil through the opening, and an electrode layer contacting the dielectric film without contacting the metal foil. An upper surface position of the electrode layer is equal to or lower in height than that of the electrode layer.

公开(公告)号：US20250120104A1

公开(公告)日：2025-04-10

申请号：US18836446

申请日：2022-12-02

Applicant: TDK Corporation

Inventor： Yasunori HARADA ,  Yoshiaki HAYAMIZU ,  Daiki ISHII ,  Mitsuhiro TOMIKAWA ,  Kenichi YOSHIDA

IPC: H10D1/68

Abstract: To provide a thin film capacitor having a pair of terminal electrodes capable of being disposed on the same plane. A thin film capacitor 1 includes a metal foil having a non-roughened center portion and a roughened upper surface, a dielectric film covering the roughened upper surface of the metal foil, an electrode layer contacting the non-roughened center portion of the metal foil through an opening formed in the dielectric film, and an electrode layer contacting the dielectric film without contacting the metal foil. A thickness of the center portion of the metal foil at a position overlapping the electrode layer is larger than a thickness thereof at a position overlapping the electrode layer.

公开(公告)号：US20230371175A1

公开(公告)日：2023-11-16

申请号：US18044869

申请日：2021-09-13

Applicant: TDK Corporation

Inventor： Yu FUKAE ,  Tomoya HANAI ,  Yusuke OBA ,  Kenichi YOSHIDA ,  Katsuharu YASUDA ,  Takashi OHTSUKA

IPC: H05K1/02 ,  H05K1/05

CPC classification number: H05K1/0298 ,  H05K1/05 ,  H05K2201/0338 ,  H05K2201/09409

Abstract: To prevent interfacial peeling due to the stress of an insulating layer in a capacitor-inductor integrated electronic component having three or more conductor layers. An electronic component includes: a conductor layer M1 including a conductor pattern constituting an inductor; a conductor pattern overlapping a part of the conductor pattern through a dielectric film; an insulating layer covering the conductor layer M1 and conductor pattern; a conductor layer M2 provided on the insulating layer and including a conductor pattern constituting the inductor; and an insulating layer covering the conductor layer M2. The conductor layer M2 is formed to be branching from or independently of the conductor pattern and further includes a dummy pattern overlapping the conductor pattern. This prevents the stress of the insulating layer from being directly applied to the conductor pattern to thereby prevent peeling at the interface between the conductor layer M1 and the dielectric film.

公开(公告)号：US20230268120A1

公开(公告)日：2023-08-24

申请号：US18012530

申请日：2020-12-24

Applicant: TDK Corporation

Inventor： Daiki ISHII ,  Yoshihiko YANO ,  Yuki YAMASHITA ,  Kenichi YOSHIDA ,  Tetsuhiro TAKAHASHI

IPC: H01G4/005 ,  H01G4/33 ,  H05K1/18

CPC classification number: H01G4/005 ,  H01G4/33 ,  H05K1/18 ,  H05K2201/10015

Abstract: A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; a second electrode layer contacting the dielectric film without contacting the metal foil; and an insulating member separating the first and second electrode layers. The insulating member has a tapered shape in cross section. With the above configuration, both the first and second electrode layers can be disposed on the upper surface of the metal foil. In addition, since the insulating member has a tapered shape in cross section, adhesion performance of the insulating member can be enhanced, thus making it possible to prevent short-circuit between the first and second electrode layers.

公开(公告)号：US20210305231A1

公开(公告)日：2021-09-30

申请号：US17206656

申请日：2021-03-19

Applicant: TDK CORPORATION

Inventor： Yusuke OBA ,  Kenichi YOSHIDA ,  Takashi OHTSUKA ,  Yuichiro OKUYAMA ,  Tomoya HANAI ,  Yu FUKAE

IPC: H01L27/01 ,  H01L21/78 ,  H01L21/70

Abstract: Disclosed herein is an electronic component that includes a substrate, a functional layer formed on the substrate and having a plurality of alternately stacked conductor layers and insulating layers, and a plurality of terminal electrodes provided on an uppermost one of the insulating layers. The uppermost one of the insulating layers has a substantially rectangular planar shape and has a protruding part protruding in a planar direction from at least one side in a plan view.