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公开(公告)号:US20250149252A1
公开(公告)日:2025-05-08
申请号:US18837696
申请日:2022-12-02
Applicant: TDK Corporation
Inventor: Daiki ISHII , Mitsuhiro TOMIKAWA , Kenichi YOSHIDA , Takashi KARIYA , Yasunori HARADA , Yoshiaki HAYAMIZU , Miyu HASEGAWA
Abstract: To provide a thin film capacitor having a pair of terminal electrodes capable of being disposed on the same plane. A thin film capacitor includes a metal foil having a roughened surface, a dielectric film covering the roughened surface of the metal foil and having an opening partially exposing the metal foil therethrough, an electrode layer contacting the metal foil through the opening, and an electrode layer contacting the dielectric film without contacting the metal foil. An upper surface position of the electrode layer is equal to or lower in height than that of the electrode layer.
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公开(公告)号:US20220059753A1
公开(公告)日:2022-02-24
申请号:US17274897
申请日:2019-09-11
Applicant: TDK Corporation , TOKYO INSTITUTE OF TECHNOLOGY
Inventor: Yusuke SATO , Mirai ISHIDA , Wakiko SATO , Hiroshi FUNAKUBO , Takao SHIMIZU , Miyu HASEGAWA , Keisuke ISHIHAMA
IPC: H01L41/187 , H01L41/08 , H01L41/316 , H01L41/319 , C04B35/475 , G11B5/127 , G01C19/5607 , G01L1/16 , B41J2/14
Abstract: Provided is a dielectric thin film including a metal oxide. The metal oxide includes bismuth, sodium, barium, and titanium, at least a part of the metal oxide is a tetragonal crystal having a perovskite structure, and a (100) plane of at least a part of the tetragonal crystal is oriented in a normal direction do of a surface of the dielectric thin film 3.
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公开(公告)号:US20250069814A1
公开(公告)日:2025-02-27
申请号:US18841735
申请日:2023-01-26
Applicant: TDK CORPORATION
Inventor: Miyu HASEGAWA , Daiki ISHII
Abstract: To provide a thin film capacitor having a large capacitance. A thin film capacitor includes a metal foil having roughened main surfaces, a dielectric film covering the main surfaces, an electrode layer contacting the metal foil through an opening formed in the dielectric film and having a surface formed as a metal terminal, an electrode layer contacting the dielectric film without contacting the metal foil and having a surface formed as a metal terminal, and an electrode layer contacting the dielectric film without contacting the metal foil. The electrode layers include a conductive polymer layer contacting the dielectric film.
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