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公开(公告)号：US20230034900A1
公开(公告)日：2023-02-02
申请号：US17858761
申请日：2022-07-06
Applicant: TDK CORPORATION
Inventor： Toshihiro IGUCHI , Norihisa ANDO , Kenya TAMAKI , Hisashi KOBAYASHI
Abstract: A ceramic electronic device comprises an element body including a ceramic layer and an internal electrode layer, and an external electrode electrically connected to at least one end of the internal electrode layer. The element body includes an interface part at least at a part of a boundary between the external electrode and the ceramic layer. The interface part includes an oxide containing aluminium and an oxide containing boron.
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公开(公告)号：US20220230776A1
公开(公告)日：2022-07-21
申请号：US17557824
申请日：2021-12-21
Applicant: TDK CORPORATION
Inventor： Toshihiro IGUCHI , Tetsuhiro TAKAHASHI , Hiroki AKIBA , Ryota NOMURA
IPC: H01B3/12 , H01G4/12 , C04B35/495
Abstract: In order to provide a dielectric composition having high relative permittivity at a wide range of temperatures, the main component of a dielectric composition includes strontium and tantalum.
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公开(公告)号：US20220194859A1
公开(公告)日：2022-06-23
申请号：US17551633
申请日：2021-12-15
Applicant: TDK CORPORATION
Inventor： Dan SAKURAI , Yasuhiro ITO , Nobuto MORIGASAKI , Toshihiko KANEKO , Toshihiro IGUCHI
IPC: C04B35/47
Abstract: A dielectric ceramic composition contains dielectric particles containing a main component represented by a composition formula (Ba1-x-ySrxCay)m(Ti1-zZrz)O3 and grain boundaries present between the dielectric particles. The values of m, x, y, and z in the composition formula are all molar ratios. In the composition formula, 0.9≤m≤1.4, 0≤x
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公开(公告)号：US20220122776A1
公开(公告)日：2022-04-21
申请号：US17463964
申请日：2021-09-01
Applicant: TDK CORPORATION
Inventor： Toshihiro IGUCHI
IPC: H01G4/248
Abstract: An electronic component includes an element body including a side surface and an end surface adjacent to each other, and an external electrode disposed on the side surface and the end surface. The external electrode includes a metal layer disposed on the side surface and the end surface and made of sintered copper, a conductive resin layer that is disposed on the metal layer in such a manner that a partial region of the metal layer is exposed and contains a plurality of copper particles and a resin, and a plating layer disposed on the partial region of the metal layer and the conductive resin layer. The conductive resin includes a first portion located on the side surface. The plating layer includes a second portion located on the side surface. A thickness of the first portion is smaller than a thickness of the second portion.
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公开(公告)号：US20210375547A1
公开(公告)日：2021-12-02
申请号：US17229393
申请日：2021-04-13
Applicant: TDK CORPORATION
Inventor： Shinya SAITO , Kenya TAMAKI , Norihisa ANDO , Shinya ITO , Akihiro MASUDA , Kosuke YAZAWA , Yoshiki SATOU , Katsumi KOBAYASHI , Toshihiro IGUCHI
Abstract: An electronic device includes chip components, a case, conductive terminals, and a fuse. The chip components each include a terminal electrode. The case includes accommodation recesses for accommodating the chip components. The conductive terminals are fixed to the case and respectively connected to the terminal electrodes of the chip components. The fuse electrically connects the chip components.
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Patent Agency Ranking
公开(公告)号：US20240321520A1
公开(公告)日：2024-09-26
申请号：US18603515
申请日：2024-03-13
Applicant: TDK CORPORATION
Inventor： Toshihiro IGUCHI , Tomohisa FUKUOKA
CPC classification number: H01G4/2325 , H01G4/30
Abstract: An electronic component structure includes: a first electronic component; a second electronic component; a low melting point layer located between the first electronic component and the second electronic component and containing a first metal material having a melting point of 300° C. or lower; and a high melting point layer located between the first electronic component and the second electronic component and containing a second metal material having a melting point of 400° C. or higher. In the electronic component structure, the first electronic component and the second electronic component are connected to each other by a multilayer connection portion formed by overlapping the low melting point layer and the high melting point layer.
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公开(公告)号：US20240120152A1
公开(公告)日：2024-04-11
申请号：US18464439
申请日：2023-09-11
Applicant: TDK CORPORATION
Inventor： Toshihiro IGUCHI , Daisuke YOSHIDA
Abstract: An electronic device includes an element body. The element body includes at least two internal electrode layers and a dielectric layer laminated between the internal electrode layers. Ni oxide particles exist at a boundary between the internal electrode layers and the dielectric layer. The dielectric layer is in contact with the internal electrode layers at first and second boundaries. The dielectric layer includes a first dielectric large particle and a second dielectric large particle. The first dielectric large particle is in contact with at least one of the Ni oxide particles existing at the first boundary and in contact with one of the internal electrode layers at the second boundary. The second dielectric large particle is in contact with at least one of the internal electrode layers at the first boundary and in contact with at least one of the Ni oxide particles existing at the second boundary.
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公开(公告)号：US20230386699A1
公开(公告)日：2023-11-30
申请号：US18308294
申请日：2023-04-27
Applicant: TDK CORPORATION
Inventor： Toshihiro IGUCHI , Kenichiro MASUDA
IPC: H01B3/10
CPC classification number: H01B3/10
Abstract: A dielectric composition includes main phases having a tungsten bronze structure and grain boundaries existing between the main phases. At least one or more rare earth elements selected from La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, and Dy is RE. A concentration ratio of RE in central portions of the main phases to RE in peripheral portions of the main phases is 0.2 or less.
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公开(公告)号：US20230253154A1
公开(公告)日：2023-08-10
申请号：US17982635
申请日：2022-11-08
Applicant: TDK Corporation
Inventor： Tetsuhiro TAKAHASHI , Toshihiro IGUCHI , Tomoko SUZUKI
IPC: H01G4/12 , C04B35/495
CPC classification number: H01G4/1254 , C04B35/495 , C04B2235/3206 , C04B2235/3232 , C04B2235/3255 , C04B2235/3256 , C04B2235/3244 , C04B2235/3262 , C04B2235/3418 , C04B2235/96
Abstract: Provided is a dielectric composition containing: a main component expressed by {BaxSr(1-x)}mTa4O12; and a first subcomponent, m satisfying a relationship of 1.95≤m≤2.40. The first subcomponent includes silicon and magnesium. When the amount of the main component contained in the dielectric composition is set to 100 parts by mole, the amount of silicon contained in the dielectric composition is 7.5 to 15.0 parts by mole in terms of SiO2, and the amount of magnesium contained in the dielectric composition is 5.0 to 22.5 parts by mole in terms of MgO.
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公开(公告)号：US20230073043A1
公开(公告)日：2023-03-09
申请号：US17899797
申请日：2022-08-31
Applicant: TDK CORPORATION
Inventor： Hisashi KOBAYASHI , Norihisa ANDO , Toshihiro IGUCHI , Kenya TAMAKI
Abstract: An electronic component with a metal terminal includes an electronic component having an element body, and external electrodes respectively provided on end surfaces facing each other in an X direction in the element body; and plate-shaped metal terminals having joint portions joined to the external electrodes, and leg portions provided to protrude beyond the electronic component in a Z direction. The leg portion of the metal terminal has an extending part continuously extending in the Z direction from the joint portion, a first bent part bent from a tip of the extending part to the electronic component side at a first angle formed to be an acute angle with respect to the extending part, and a second bent part bent from a tip of the first bent part at a second angle larger than the first angle with respect to the extending part.
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