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公开(公告)号：US20230097139A1
公开(公告)日：2023-03-30
申请号：US17902359
申请日：2022-09-02
Applicant: TDK CORPORATION
Inventor： Kosuke YAZAWA , Masatsugu YAMAMOTO , Yosuke KOBAYASHI
Abstract: An electronic component with a metal terminal includes a plurality of electronic components each including an element body and a pair of external electrodes provided on each of a pair of end surfaces facing each other in an X direction in the element body, and disposed in a Y direction, and a pair of plate-shaped metal terminals each including a plurality of joint portions to which external electrodes of the plurality of electronic components are joined, and a leg portion provided to protrude further than the electronic component in a Z direction, wherein a portion of the metal terminal that extends in the Y direction to straddle the plurality of joint portions is an easily deformable portion made of a second metal material having a Young's modulus smaller than that of a first metal material constituting the other portion.
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公开(公告)号：US20200294719A1
公开(公告)日：2020-09-17
申请号：US16816856
申请日：2020-03-12
Applicant: TDK Corporation
Inventor： Akihiro MASUDA , Norihisa ANDO , Shinya ITO , Kosuke YAZAWA , Yoshiki SATOU , Katsumi KOBAYASHI
Abstract: An electronic component has capacitor chips where terminal electrodes are formed on both end surfaces, individual metal terminals connected to the terminal electrodes, an insulation case accommodating the capacitor chips, and a connecting portion interconnecting a plurality of the insulation cases.
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公开(公告)号：US20190080841A1
公开(公告)日：2019-03-14
申请号：US16121719
申请日：2018-09-05
Applicant: TDK CORPORATION
Inventor： Norihisa ANDO , Kenichi INOUE , Sunao MASUDA , Masahiro MORI , Kayou MATSUNAGA , Kosuke YAZAWA
CPC classification number: H01G2/065 , H01G4/01 , H01G4/12 , H01G4/232 , H01G4/248 , H01G4/30 , H01G4/38 , H05K3/341 , H05K2201/10431
Abstract: A method of manufacturing an electronic device includes preparing a chip component with a terminal electrode. A terminal plate is prepared. A connection member is placed between an end surface of the terminal electrode and an inner surface of the terminal plate. The terminal plate and the terminal electrode are joined using the connection member by bringing a press head into contact with an outer surface of the terminal plate and pressing and heating the terminal plate against the terminal electrode.
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公开(公告)号：US20180286584A1
公开(公告)日：2018-10-04
申请号：US15928752
申请日：2018-03-22
Applicant: TDK CORPORATION
Inventor： Norihisa ANDO , Katsumi KOBAYASHI , Sunao MASUDA , Masahiro MORI , Kayou MATSUNAGA , Kosuke YAZAWA
CPC classification number: H01G4/1227 , H01G2/06 , H01G2/065 , H01G4/005 , H01G4/12 , H01G4/232 , H01G4/2325 , H01G4/30
Abstract: A ceramic electronic device includes a chip component and a pair of metal terminals. The component includes a rectangular-parallelepiped element body having dielectrics and internal electrodes and a pair of terminal electrodes covering end surfaces of the body and a part of side surfaces of the body. The pair of metal terminals respectively has an engagement arm portion configured to hold the component. The terminal electrode includes first and second side surfaces. The first side surface has a predetermined side-surface electrode thickness. The second side surface is disposed farther from the end surface of the body than the first side surface and has the side-surface electrode thickness which is smaller than that of the first side surface. The arm portion contacts with the component at a position that is farther from the end surface of the body than the first side surface.
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公开(公告)号：US20180182553A1
公开(公告)日：2018-06-28
申请号：US15854523
申请日：2017-12-26
Applicant: TDK CORPORATION
Inventor： Kosuke YAZAWA , Norihisa ANDO , Masahiro MORI , Sunao MASUDA , Kayou MATSUNAGA
CPC classification number: H01G4/248 , H01G4/1227 , H01G4/224 , H01G4/2325 , H01G4/30 , H01G4/38
Abstract: A ceramic electronic device includes a chip component, a pair of metal terminal portions, and a case. The metal terminal portion includes a terminal connection portion and a mount portion. The terminal connection portion faces a chip end surface and is connected with a terminal electrode. The mount portion is electrically connected with the terminal connection portion, extends toward a center substantially vertically to the chip end surface, and faces the chip component with a predetermined space. The case has a pair of case end walls sandwiching the pair of metal terminal portions from both sides and holding the chip component between the pair of metal terminal portions.
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Patent Agency Ranking
公开(公告)号：US20210375553A1
公开(公告)日：2021-12-02
申请号：US17228822
申请日：2021-04-13
Applicant: TDK CORPORATION
Inventor： Akihiro MASUDA , Shinya ITO , Norihisa ANDO , Kosuke YAZAWA , Yoshiki SATOU , Katsumi KOBAYASHI , Toshihiro IGUCHI , Kenya TAMAKI , Shinya SAITO
Abstract: An electronic device includes first and second capacitors, a case, a coil, and first to fourth conductive terminals. The first capacitor includes first and second terminal electrodes. The second capacitor includes third and fourth terminal electrodes. The case includes an accommodation recess for accommodating the first and second capacitors. The coil is separated from the first and second capacitors by a part of the case and disposed outside the accommodation recess. The first terminal is connected to the first electrode and partly disposed on a mounting-side bottom surface of the case. The second terminal is connected to one end of the coil and the second electrode and partly disposed on the surface. The third terminal is connected to the other end of the coil and the third electrode and partly disposed on the surface. The fourth terminal is connected to the fourth electrode and partly disposed on the surface.
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公开(公告)号：US20210202170A1
公开(公告)日：2021-07-01
申请号：US17130552
申请日：2020-12-22
Applicant: TDK CORPORATION
Inventor： Kosuke YAZAWA
IPC: H01G4/228
Abstract: An electronic component device includes an electronic component, a pair of metal terminals, a bonding member, and an expansion member having thermal expansibility. The electronic component includes an element body and a pair of external electrodes. The element body has a pair of end faces opposed to each other. The pair of external electrodes is disposed on the pair of end faces. The pair of metal terminals is electrically connected to the pair of external electrodes. The bonding member bonds one of the pair of external electrodes to one of the pair of metal terminals. The bonding member electrically connects the one of the pair of external electrodes to the one of the pair of metal terminals. The one of the pair of metal terminals includes an opposing face. The opposing face is a flat face.
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公开(公告)号：US20190304690A1
公开(公告)日：2019-10-03
申请号：US16367937
申请日：2019-03-28
Applicant: TDK CORPORATION
Inventor： Norihisa ANDO , Sunao MASUDA , Masahiro MORI , Kayou MATSUNAGA , Kosuke YAZAWA
Abstract: An electronic device includes a chip component and a metal terminal. The chip component includes a terminal electrode formed on an element body. The metal terminal is connectable with the terminal electrode of the chip component. The metal terminal includes a terminal body and a pair of holding pieces. The terminal body faces an end surface of the terminal electrode of the chip component. The pair of holding pieces is formed on the terminal body and sandwiches the chip component. A width, a protrusion length, or a protrusion area of one of the pair of holding pieces is different from that of the other holding piece.
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公开(公告)号：US20190164694A1
公开(公告)日：2019-05-30
申请号：US16162580
申请日：2018-10-17
Applicant: TDK CORPORATION
Inventor： Norihisa ANDO , Sunao MASUDA , Masahiro MORI , Kayou MATSUNAGA , Kosuke YAZAWA
Abstract: A ceramic electronic device includes a chip component, a metal terminal, and a conductive connection member. The component includes a terminal electrode surface on which a terminal electrode is formed. The metal terminal includes an opposing surface to the electrode surface. The connection member contains at least Sn and Sb and connects the terminal electrode surface and the opposing surface. The connection member includes a first part and a second part. In the first part, a distance between the terminal electrode surface and the opposing surface is a first distance, and Sb/Sn is a first value. In the second part, a distance between the terminal electrode surface and the opposing surface is a second distance being smaller than the first distance, and Sb/Sn is a second value being larger than the first value.
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公开(公告)号：US20180211783A1
公开(公告)日：2018-07-26
申请号：US15819674
申请日：2017-11-21
Applicant: TDK CORPORATION
Inventor： Norihisa ANDO , Katsumi KOBAYASHI , Sunao MASUDA , Masahiro MORI , Kayou MATSUNAGA , Kosuke YAZAWA
CPC classification number: H01G4/248 , H01G2/06 , H01G4/008 , H01G4/12 , H01G4/232 , H01G4/30 , H01G4/38
Abstract: A ceramic electronic device includes multiple chip components and a pair of metal terminal portions. The chip components consist of a pair of chip end surfaces and four chip side surfaces. Terminal electrodes are formed on the pair of chip end surfaces. The pair of metal terminal portions is arranged correspondingly with the pair of chip end surfaces. Each of the pair of metal terminal portions includes an electrode face portion, a pair of engagement arm portions, and a mount portion. The electrode face portion faces the chip end surface. The pair of engagement arm portions sandwich and hold the chip component. The mount portion extends from one of terminal second sides toward the chip component and is partially substantially vertical to the electrode face portion. The electrode face portion has a slit.
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