公开(公告)号：US20210375553A1

公开(公告)日：2021-12-02

申请号：US17228822

申请日：2021-04-13

Applicant: TDK CORPORATION

Inventor： Akihiro MASUDA ,  Shinya ITO ,  Norihisa ANDO ,  Kosuke YAZAWA ,  Yoshiki SATOU ,  Katsumi KOBAYASHI ,  Toshihiro IGUCHI ,  Kenya TAMAKI ,  Shinya SAITO

IPC: H01G4/40 ,  H01G4/228 ,  H01G4/224 ,  H01G4/38 ,  H01F27/28

Abstract: An electronic device includes first and second capacitors, a case, a coil, and first to fourth conductive terminals. The first capacitor includes first and second terminal electrodes. The second capacitor includes third and fourth terminal electrodes. The case includes an accommodation recess for accommodating the first and second capacitors. The coil is separated from the first and second capacitors by a part of the case and disposed outside the accommodation recess. The first terminal is connected to the first electrode and partly disposed on a mounting-side bottom surface of the case. The second terminal is connected to one end of the coil and the second electrode and partly disposed on the surface. The third terminal is connected to the other end of the coil and the third electrode and partly disposed on the surface. The fourth terminal is connected to the fourth electrode and partly disposed on the surface.

公开(公告)号：US20210050135A1

公开(公告)日：2021-02-18

申请号：US17088638

申请日：2020-11-04

Applicant: TDK CORPORATION

Inventor： Katsumi KOBAYASHI ,  Kouyu OHI

IPC: H01F17/04 ,  H01F27/29 ,  H01F27/28

Abstract: A coil device comprising, the core body having a coil core part and a core bottom face, and a coil part forming spiral conductive pathway around the coil core part. A metal electrode is formed at the core bottom face, and the wire ends which are the conductive pathway of the coil part are formed at the metal electrode, and a part of the surface of the metal electrode is covered by the conductive resin electrode.

公开(公告)号：US20180211783A1

公开(公告)日：2018-07-26

申请号：US15819674

申请日：2017-11-21

Applicant: TDK CORPORATION

Inventor： Norihisa ANDO ,  Katsumi KOBAYASHI ,  Sunao MASUDA ,  Masahiro MORI ,  Kayou MATSUNAGA ,  Kosuke YAZAWA

IPC: H01G4/248 ,  H01G4/38 ,  H01G4/30 ,  H01G4/232

CPC classification number: H01G4/248 ,  H01G2/06 ,  H01G4/008 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H01G4/38

Abstract: A ceramic electronic device includes multiple chip components and a pair of metal terminal portions. The chip components consist of a pair of chip end surfaces and four chip side surfaces. Terminal electrodes are formed on the pair of chip end surfaces. The pair of metal terminal portions is arranged correspondingly with the pair of chip end surfaces. Each of the pair of metal terminal portions includes an electrode face portion, a pair of engagement arm portions, and a mount portion. The electrode face portion faces the chip end surface. The pair of engagement arm portions sandwich and hold the chip component. The mount portion extends from one of terminal second sides toward the chip component and is partially substantially vertical to the electrode face portion. The electrode face portion has a slit.

公开(公告)号：US20200294719A1

公开(公告)日：2020-09-17

申请号：US16816856

申请日：2020-03-12

Applicant: TDK Corporation

Inventor： Akihiro MASUDA ,  Norihisa ANDO ,  Shinya ITO ,  Kosuke YAZAWA ,  Yoshiki SATOU ,  Katsumi KOBAYASHI

IPC: H01G4/228 ,  H01G4/12 ,  H01G4/30 ,  H01G4/005 ,  H01G2/06

Abstract: An electronic component has capacitor chips where terminal electrodes are formed on both end surfaces, individual metal terminals connected to the terminal electrodes, an insulation case accommodating the capacitor chips, and a connecting portion interconnecting a plurality of the insulation cases.

公开(公告)号：US20180286584A1

公开(公告)日：2018-10-04

申请号：US15928752

申请日：2018-03-22

Applicant: TDK CORPORATION

Inventor： Norihisa ANDO ,  Katsumi KOBAYASHI ,  Sunao MASUDA ,  Masahiro MORI ,  Kayou MATSUNAGA ,  Kosuke YAZAWA

IPC: H01G4/12 ,  H01G4/005 ,  H01G4/232 ,  H01G2/06

CPC classification number: H01G4/1227 ,  H01G2/06 ,  H01G2/065 ,  H01G4/005 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/30

Abstract: A ceramic electronic device includes a chip component and a pair of metal terminals. The component includes a rectangular-parallelepiped element body having dielectrics and internal electrodes and a pair of terminal electrodes covering end surfaces of the body and a part of side surfaces of the body. The pair of metal terminals respectively has an engagement arm portion configured to hold the component. The terminal electrode includes first and second side surfaces. The first side surface has a predetermined side-surface electrode thickness. The second side surface is disposed farther from the end surface of the body than the first side surface and has the side-surface electrode thickness which is smaller than that of the first side surface. The arm portion contacts with the component at a position that is farther from the end surface of the body than the first side surface.

公开(公告)号：US20170309392A1

公开(公告)日：2017-10-26

申请号：US15471594

申请日：2017-03-28

Applicant: TDK CORPORATION

Inventor： Katsumi KOBAYASHI ,  Yoshiyuki TAKANASHI

IPC: H01F27/29 ,  H01F27/28

CPC classification number: H01F27/292 ,  H01F3/14 ,  H01F27/263 ,  H01F27/2823 ,  H01F27/2828

Abstract: A coil device includes an inner core having a winding core and a pair of flanges, a wire, an outer core arranged outside the inner core, a first terminal with a first wirebound having a first wirebound bottom arranged axially on a core end surface of the outer core and connected to a first end of the wire, and a second terminal with a second wirebound having a second wirebound bottom arranged on the core end surface and connected to a second end of the wire. The first wirebound has a first wire fixing portion bending from the first wirebound bottom toward a first rotating direction and fixing the first end. The second wirebound has a second wire fixing portion bending from the second wirebound bottom toward the same rotating direction as the first rotating direction and fixing the second end.

公开(公告)号：US20170263368A1

公开(公告)日：2017-09-14

申请号：US15447975

申请日：2017-03-02

Applicant: TDK CORPORATION

Inventor： Katsumi KOBAYASHI

IPC: H01F27/02 ,  H01F27/28 ,  H01F27/32

CPC classification number: H01F27/022 ,  H01F5/02 ,  H01F27/2823 ,  H01F27/325 ,  H01F41/005 ,  H01Q7/06

Abstract: A coil device has a potting resin 60. The potting resin 60 surrounds a bobbin 20 with a coil portion 12. The coil portion 12 is housed in a housing concave portion 42 of an outer case 40. Oblique plate legs 50 arranged obliquely are arranged between an outer peripheral wall 24 of the bobbin 20 and a bottom wall of the housing concave portion 42.

公开(公告)号：US20170186539A1

公开(公告)日：2017-06-29

申请号：US15391312

申请日：2016-12-27

Applicant: TDK CORPORATION

Inventor： Sunao MASUDA ,  Katsumi KOBAYASHI ,  Masahiro MORI ,  Kayou MATSUNAGA ,  Norihisa ANDO

IPC: H01G4/248 ,  H01G4/232 ,  H01G4/30

CPC classification number: H01G4/248 ,  H01G2/06 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/30

Abstract: An electronic device includes a chip component with a terminal electrode formed on an end surface of a ceramic element body including an internal electrode and an external terminal electrically connected to the terminal electrode. The external terminal includes a terminal electrode connection part arranged to face the terminal electrode and a mounting connection part connectable to a mounting surface. The terminal electrode connection part includes a multilayer structure of a first metal connected to the terminal electrode, a second metal arranged outside the first metal, and a third metal arranged outside the second metal. A thermal expansion coefficient of the external terminal is smaller than that of the ceramic element body.

公开(公告)号：US20210375547A1

公开(公告)日：2021-12-02

申请号：US17229393

申请日：2021-04-13

Applicant: TDK CORPORATION

Inventor： Shinya SAITO ,  Kenya TAMAKI ,  Norihisa ANDO ,  Shinya ITO ,  Akihiro MASUDA ,  Kosuke YAZAWA ,  Yoshiki SATOU ,  Katsumi KOBAYASHI ,  Toshihiro IGUCHI

IPC: H01G4/224 ,  H01G4/232 ,  H01G4/38 ,  H01H85/175 ,  H01H85/08 ,  H01G2/06

Abstract: An electronic device includes chip components, a case, conductive terminals, and a fuse. The chip components each include a terminal electrode. The case includes accommodation recesses for accommodating the chip components. The conductive terminals are fixed to the case and respectively connected to the terminal electrodes of the chip components. The fuse electrically connects the chip components.

公开(公告)号：US20210043382A1

公开(公告)日：2021-02-11

申请号：US16988819

申请日：2020-08-10

Applicant: TDK CORPORATION

Inventor： Akihiro MASUDA ,  Norihisa ANDO ,  Shinya ITO ,  Kosuke YAZAWA ,  Yoshiki SATOU ,  Katsumi KOBAYASHI

IPC: H01G4/228 ,  H01G4/224

Abstract: A conductive terminal includes an inner electrode part, an opening edge electrode part, and a lateral electrode part. The inner electrode part is connectable to a terminal electrode of a chip component by being inserted along an inner wall of an accommodation recess of a case. The opening edge electrode part is formed continuously to the inner electrode part. The lateral electrode part is formed continuously to the opening edge electrode part along an outer surface of the case. The inner electrode part includes a base part, a curved part, and a continuous boundary part. The base part continues to the opening edge electrode part. The curved part is formed near a tip of the base part and protrudes away from the lateral electrode part. The continuous boundary part is formed between the base part and the curved part and continuously connects them.