公开(公告)号：US20220059439A1

公开(公告)日：2022-02-24

申请号：US17000146

申请日：2020-08-21

Applicant: Texas Instruments Incorporated

Inventor： Robert Allan Neidorff ,  Benjamin Cook ,  Stefan Herzer

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00

Abstract: A method includes performing a non-screen printing process that deposits solder on a lead frame or on conductive features of a semiconductor die or wafer, or on or in a conductive via of a laminate structure. The method further comprises engaging the semiconductor die to the lead frame, performing a thermal process that reflows the solder, performing a molding process that forms a package structure which encloses the semiconductor die and a portion of the lead frame, and separating a packaged electronic device from a remaining portion of the lead frame.

公开(公告)号：US20190334220A1

公开(公告)日：2019-10-31

申请号：US16393809

申请日：2019-04-24

Applicant: Texas Instruments Incorporated

Inventor： Hassan Omar Ali ,  Juan Alejandro Herbsommer ,  Benjamin Cook ,  Swaminathan Sankaran

IPC: H01P3/16 ,  H01Q13/00 ,  H01Q1/22 ,  H01P3/08 ,  H01P5/08 ,  H01L23/66 ,  H01L23/00 ,  H01L23/498

Abstract: A wave communication system includes an integrated circuit and a multilayered substrate. The multilayered substrate is electrically coupled to the integrated circuit. The multilayered substrate includes an antenna structure configured to transmit a circularly polarized wave in response to signals from the integrated circuit.

公开(公告)号：US10233074B2

公开(公告)日：2019-03-19

申请号：US15867563

申请日：2018-01-10

Applicant: Texas Instruments Incorporated

Inventor： Kurt Peter Wachtler ,  Makoto Yoshino ,  Ayumu Kuroda ,  Brian E. Goodlin ,  Karen Kirmse ,  Benjamin Cook ,  Genki Yano ,  Stuart Jacobsen

IPC: B81B7/00 ,  B81C1/00 ,  H01L23/31 ,  H01L23/495

Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

公开(公告)号：US20180162722A1

公开(公告)日：2018-06-14

申请号：US15372565

申请日：2016-12-08

Applicant: Texas Instruments Incorporated

Inventor： Barry Jon Male ,  Benjamin Cook ,  Robert Alan Neidorff ,  Steve Kummerl

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0048 ,  B81B7/0061 ,  B81B2201/0264 ,  B81C1/00325

Abstract: Disclosed examples include sensor apparatus and integrated circuits having a package structure with an internal cavity and an opening that connects of the cavity with an ambient condition of an exterior of the package structure, and an electronic sensor structure mechanically supported by wires in the cavity and including a sensing surface exposed to the cavity to sense the ambient condition of an exterior of the package structure.

公开(公告)号：US09929110B1

公开(公告)日：2018-03-27

申请号：US15395456

申请日：2016-12-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Barry Jon Male ,  Benjamin Cook ,  Robert Alan Neidorff ,  Steve Kummerl

IPC: H01L31/0232 ,  H01L23/66 ,  H01L23/31 ,  H01L21/56 ,  G02B27/09 ,  G02B3/08

CPC classification number: H01L23/66 ,  G02B3/08 ,  G02B19/0014 ,  G02B19/0076 ,  G02B27/0955 ,  G02B27/0977 ,  H01L21/56 ,  H01L23/3121 ,  H01L33/54

Abstract: A method of forming, and a resulting, an integrated circuit wave device. The method (i) affixes an integrated circuit die relative to a substrate; (ii) creates a form relative to the integrated circuit die and the substrate; and (iii) forms a wave shaping member having a shape conforming at least in part to a shape of the form.

公开(公告)号：US09896330B2

公开(公告)日：2018-02-20

申请号：US15134574

申请日：2016-04-21

Applicant: Texas Instruments Incorporated

Inventor： Kurt Peter Wachtler ,  Makoto Yoshino ,  Ayumu Kuroda ,  Brian E. Goodlin ,  Karen Kirmse ,  Benjamin Cook ,  Genki Yano ,  Stuart Jacobsen

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0048 ,  B81B7/0054 ,  B81B2207/012 ,  B81B2207/097 ,  B81B2207/99 ,  B81C1/00325 ,  B81C2203/0136 ,  B81C2203/0154 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49541 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

公开(公告)号：US20190144267A1

公开(公告)日：2019-05-16

申请号：US16247118

申请日：2019-01-14

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Barry Jon Male ,  Benjamin Cook ,  Robert Alan Neidorff ,  Steve Kummerl

IPC: B81B7/00 ,  B81C1/00

Abstract: Described examples include sensor apparatus and integrated circuits having a package structure with an internal cavity and an opening that connects of the cavity with an ambient condition of an exterior of the package structure, and an electronic sensor structure mechanically supported by wires in the cavity and including a sensing surface exposed to the cavity to sense the ambient condition of an exterior of the package structure.

公开(公告)号：US20190033400A1

公开(公告)日：2019-01-31

申请号：US15665282

申请日：2017-07-31

Applicant: Texas Instruments Incorporated

Inventor： Benjamin Cook ,  Juan Herbsommer

IPC: G01R33/032

Abstract: A magnetometer for measuring an external magnetic influence proximate the magnetometer. The magnetometer has: (i) a volumetric enclosure for storing an alkali metal; (2) a laser proximate the volumetric enclosure and having an axis in a first dimension and along which photons are directed toward a first surface of the volumetric enclosure; (3) a photodetector proximate a second surface of the volumetric enclosure and for receiving light emanating from the laser and passing through the volumetric enclosure, wherein the photodetector is for providing a photodetector signal in response to an intensity of light emanating from the laser and passing through the volumetric enclosure; and (4) at least one magnetic field reducer for providing a magnetic field in a second dimension orthogonal to the first dimension.

公开(公告)号：US10179730B2

公开(公告)日：2019-01-15

申请号：US15372565

申请日：2016-12-08

Applicant: Texas Instruments Incorporated

Inventor： Barry Jon Male ,  Benjamin Cook ,  Robert Alan Neidorff ,  Steve Kummerl

IPC: H01L21/56 ,  H01L21/02 ,  H01L21/00 ,  H01L31/0203 ,  H01L23/28 ,  B81B7/00 ,  B81C1/00

Abstract: Disclosed examples include sensor apparatus and integrated circuits having a package structure with an internal cavity and an opening that connects of the cavity with an ambient condition of an exterior of the package structure, and an electronic sensor structure mechanically supported by wires in the cavity and including a sensing surface exposed to the cavity to sense the ambient condition of an exterior of the package structure.

公开(公告)号：US20180190628A1

公开(公告)日：2018-07-05

申请号：US15395584

申请日：2016-12-30

Applicant: Texas Instruments Incorporated

Inventor： Barry Jon Male ,  Benjamin Cook ,  Robert Alan Neidorff ,  Steve Kummerl

IPC: H01L25/16 ,  H01L31/02 ,  H01L31/167 ,  H01L49/02 ,  H01L23/00 ,  H01L23/495

CPC classification number: H01L25/167 ,  H01F38/14 ,  H01L23/315 ,  H01L23/49 ,  H01L23/49575 ,  H01L24/08 ,  H01L24/48 ,  H01L24/85 ,  H01L28/10 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/101 ,  H01L31/103 ,  H01L31/1105 ,  H01L31/167 ,  H01L33/00 ,  H01L33/62 ,  H01L2224/08113 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2924/12041 ,  H01L2924/12043 ,  H04B10/803

Abstract: Disclosed examples include integrated circuits with a leadframe structure, a first circuit structure including a light source configured to generate a light signal along an optical path, a second circuit structure including a light sensor facing the optical path to receive the light signal, and a molded package structure enclosing portions of the leadframe structure, the molded package structure having a cavity defined by an interior surface of the molded package structure, the optical path extending in the cavity between the first and second circuit structures.