公开(公告)号：US10217628B2

公开(公告)日：2019-02-26

申请号：US15454154

申请日：2017-03-09

Applicant: Tokyo Electron Limited

Inventor： Yoshifumi Amano ,  Satoshi Morita ,  Ryoji Ikebe ,  Isamu Miyamoto

IPC: B08B3/08 ,  H01L21/02 ,  H01L21/67 ,  G03B13/32 ,  G03B17/08

Abstract: Imaging can be performed well even when an imaging device is disposed at a position facing a peripheral portion of a substrate. A substrate processing apparatus 16 which performs a processing of removing a film on a peripheral portion of a substrate W includes a rotating/holding unit 210 configured to hold and rotate the substrate; a first processing liquid supply unit 250A configured to supply a first processing liquid for removing the film onto the peripheral portion of the substrate while the substrate is being rotated in a first rotational direction R1 by the rotating/holding unit; and an imaging unit 270 provided at a position in front of an arrival region 902 of the first processing liquid on the substrate with respect to the first rotational direction R1, and configured to image the peripheral portion of the substrate.

公开(公告)号：US20190043742A1

公开(公告)日：2019-02-07

申请号：US16154936

申请日：2018-10-09

Applicant: Tokyo Electron Limited

Inventor： Yoshifumi Amano ,  Satoshi Morita ,  Ryoji Ikebe ,  Isamu Miyamoto

IPC: H01L21/67 ,  H01L21/66 ,  H01L21/68

Abstract: A measurement processing process S103 of measuring a cut width of a film based on an image obtained by imaging, with an imaging unit 270, a peripheral portion of a substrate which is processed based on a substrate processing recipe; a creation process S602 of creating a management list in which a set value of the cut width of the film, a measurement value of the cut width of the film measured through the measurement processing process and time information at which the measurement result is obtained are correlated; an analysis process S603 (S606) of analyzing a state of the processed substrate based on the created management list; and a notification process S605 (S608, S609) of making a preset notification to a user based on an analysis result obtained through the analysis process are provided.

公开(公告)号：US20170287750A1

公开(公告)日：2017-10-05

申请号：US15454346

申请日：2017-03-09

Applicant: Tokyo Electron Limited

Inventor： Yoshifumi Amano ,  Satoshi Morita ,  Ryoji Ikebe ,  Isamu Miyamoto

IPC: H01L21/67 ,  H01L21/66

CPC classification number: H01L21/67253 ,  H01L21/67028 ,  H01L21/67132 ,  H01L21/67259 ,  H01L21/67288 ,  H01L21/681 ,  H01L22/12 ,  H01L22/20

Abstract: A measurement processing process S103 of measuring a cut width of a film based on an image obtained by imaging, with an imaging unit 270, a peripheral portion of a substrate which is processed based on a substrate processing recipe; a creation process S602 of creating a management list in which a set value of the cut width of the film, a measurement value of the cut width of the film measured through the measurement processing process and time information at which the measurement result is obtained are correlated; an analysis process S603 (S606) of analyzing a state of the processed substrate based on the created management list; and a notification process S605 (S608, S609) of making a preset notification to a user based on an analysis result obtained through the analysis process are provided.