公开(公告)号：US11991824B2

公开(公告)日：2024-05-21

申请号：US17448893

申请日：2021-09-26

Applicant: Unimicron Technology Corp.

Inventor： Tzyy-Jang Tseng ,  Cheng-Ta Ko ,  Pu-Ju Lin ,  Chi-Hai Kuo ,  Shao-Chien Lee ,  Ming-Ru Chen ,  Cheng-Chung Lo

IPC: H05K1/02 ,  G02F1/1333 ,  G02F1/1368 ,  H05K1/03 ,  H05K1/11 ,  H05K3/00 ,  H10K59/12 ,  H10K59/123 ,  H10K59/124 ,  H10K59/131

CPC classification number: H05K1/115 ,  H05K1/0306 ,  H05K3/0067 ,  H05K3/0094

Abstract: A circuit board structure includes a first sub-circuit board, a second sub-circuit board, and a third sub-circuit board. The first sub-circuit board has an upper surface and a lower surface opposite to each other, and includes at least one first conductive through hole. The second sub-circuit board is disposed on the upper surface of the first sub-circuit board and includes at least one second conductive through hole. The third sub-circuit board is disposed on the lower surface of the first sub-circuit board and includes at least one third conductive through hole. At least two of the first conductive through hole, the second conductive through hole, and the third conductive through hole are alternately arranged in an axial direction perpendicular to an extending direction of the first sub-circuit board. The first, second and third sub-circuit boards are electrically connected to one another.

公开(公告)号：US11837591B2

公开(公告)日：2023-12-05

申请号：US17714121

申请日：2022-04-05

Applicant: Unimicron Technology Corp.

Inventor： Ming-Ru Chen ,  Tzyy-Jang Tseng ,  Cheng-Chung Lo

IPC: H01L25/16 ,  H01L33/62 ,  H01L33/56

CPC classification number: H01L25/167 ,  H01L33/62 ,  H01L33/56 ,  H01L2933/0066

Abstract: A manufacturing method of a light emitting diode (LED) package structure includes the following steps. A carrier is provided. A redistribution layer is formed on the carrier. A plurality of active devices are formed on the carrier. A plurality of LEDs are transferred on the redistribution layer. The LEDs and the active devices are respectively electrically connected to the redistribution layer. The active devices are adapted to drive the LEDs, respectively. A molding compound is formed on the redistribution layer to encapsulate the LEDs. The carrier is removed to expose a bottom surface of the redistribution layer.

公开(公告)号：US20210327861A1

公开(公告)日：2021-10-21

申请号：US16907183

申请日：2020-06-20

Applicant: Unimicron Technology Corp.

Inventor： Ming-Ru Chen ,  Tzyy-Jang Tseng ,  Cheng-Chung Lo

IPC: H01L25/16 ,  H01L33/62

Abstract: A manufacturing method of a light emitting diode (LED) package structure includes the following steps. A carrier is provided. A redistribution layer is formed on the carrier. A plurality of active devices are formed on the carrier. A plurality of LEDs are transferred on the redistribution layer. The LEDs and the active devices are respectively electrically connected to the redistribution layer. The active devices are adapted to drive the LEDs, respectively. A molding compound is formed on the redistribution layer to encapsulate the LEDs. The carrier is removed to expose a bottom surface of the redistribution layer.

公开(公告)号：US20180014409A1

公开(公告)日：2018-01-11

申请号：US15201622

申请日：2016-07-05

Applicant: Unimicron Technology Corp.

Inventor： Chien-Tsai Li ,  Chien-Te Wu ,  Cheng-Chung Lo

IPC: H05K3/40 ,  H01L21/683 ,  H05K3/22 ,  H05K3/46

CPC classification number: H05K3/4038 ,  H05K3/22 ,  H05K3/4644

Abstract: Provided is a manufacturing method of a circuit board structure including steps as below. A glass film is provided on an electrostatic chuck (E-chuck). A dicing process is performed, such that at least one slit is formed in the glass film. A plurality of first conductive vias are formed in the glass film. A first circuit layer is formed on the glass film. A polymer layer is formed on the first circuit layer. The polymer layer covers surfaces of the first circuit layer and the glass film. A plurality of second conductive vias are formed in the polymer layer. A second circuit layer is formed on the polymer layer, such that a first circuit board structure is formed. A singulation process is performed, such that the first circuit board structure is divided into a plurality of second circuit board structures.