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    Micro-transfer printing with volatile adhesive layer
    11.
    发明授权
    Micro-transfer printing with volatile adhesive layer 有权

    公开(公告)号：US10157880B2

    公开(公告)日：2018-12-18

    申请号：US15718636

    申请日：2017-09-28

    Applicant: X-Celeprint Limited

    Inventor： Salvatore Bonafede ,  Matthew Meitl ,  Ronald S. Cok

    IPC: H01L23/52 ,  H01L23/00 ,  H01L21/683 ,  H01L33/62 ,  H01L33/00 ,  H01L21/67

    Abstract: A method of making a micro-transfer printed structure includes providing a destination substrate and a source substrate having one or more micro-transfer printable components. A layer of volatile adhesive is formed over the destination substrate and one or more components are micro-transfer printed from the source substrate onto the volatile adhesive layer at a non-evaporable temperature of the volatile adhesive layer. The volatile adhesive layer is then heated to an evaporation temperature to evaporate at least a portion of the volatile adhesive after micro-transfer printing. In certain embodiments, a micro-transfer printed structure includes a destination substrate having one or more metal contacts and one or more micro-transfer printable components having one or more component contacts disposed on the destination substrate with the metal contact aligned with the component contact. The metal contact can form an intermetallic bond with the component contact.

    Micro-transfer printable electronic component
    12.
    发明授权
    Micro-transfer printable electronic component 有权

    公开(公告)号：US10153256B2

    公开(公告)日：2018-12-11

    申请号：US15373865

    申请日：2016-12-09

    Applicant: X-Celeprint Limited

    Inventor： Ronald S. Cok ,  Christopher Bower ,  Matthew Meitl ,  Carl Prevatte, Jr.

    IPC: H01L25/075 ,  H01L25/16 ,  H01L23/00 ,  H01L33/62 ,  H01L25/00 ,  H01L23/498

    Abstract: A micro-transfer printable electronic component includes one or more electronic components, such as integrated circuits or LEDs. Each electronic component has device electrical contacts for providing electrical power to the electronic component and a post side. A plurality of electrical conductors includes at least one electrical conductor electrically connected to each of the device electrical contacts. One or more electrically conductive connection posts protrude beyond the post side. Each connection post is electrically connected to at least one of the electrical conductors. Additional connection posts can form electrical jumpers that electrically connect electrical conductors on a destination substrate to which the printable electronic component is micro-transfer printed. The printable electronic component can be a full-color pixel in a display.

    Printable inorganic semiconductor structures
    13.
    发明授权
    Printable inorganic semiconductor structures 有权

    公开(公告)号：US10109764B2

    公开(公告)日：2018-10-23

    申请号：US15705785

    申请日：2017-09-15

    Applicant: X-Celeprint Limited

    Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Carl Prevatte ,  Salvatore Bonafede

    IPC: H01L33/00 ,  H01L21/00 ,  H01L21/30 ,  H01L21/46 ,  H01L21/683 ,  H01L33/44 ,  H01L33/36 ,  H01L33/62

    Abstract: The present invention provides structures and methods that enable the construction of micro-LED chiplets formed on a sapphire substrate that can be micro-transfer printed. Such printed structures enable low-cost, high-performance arrays of electrically connected micro-LEDs useful, for example, in display systems. Furthermore, in an embodiment, the electrical contacts for printed LEDs are electrically interconnected in a single set of process steps. In certain embodiments, formation of the printable micro devices begins while the semiconductor structure remains on a substrate. After partially forming the printable micro devices, a handle substrate is attached to the system opposite the substrate such that the system is secured to the handle substrate. The substrate may then be removed and formation of the semiconductor structures is completed. Upon completion, the printable micro devices may be micro transfer printed to a destination substrate.

    SYSTEMS AND METHODS FOR CONTROLLING RELEASE OF TRANSFERABLE SEMICONDUCTOR STRUCTURES
    16.
    发明申请
    SYSTEMS AND METHODS FOR CONTROLLING RELEASE OF TRANSFERABLE SEMICONDUCTOR STRUCTURES 审中-公开

    公开(公告)号：US20180204772A1

    公开(公告)日：2018-07-19

    申请号：US15910809

    申请日：2018-03-02

    Applicant: X-Celeprint Limited

    Inventor： Christopher Bower ,  Matthew Meitl

    IPC: H01L21/78

    CPC classification number: H01L21/7813 ,  B81C99/008 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/83 ,  H01L2221/68368

    Abstract: The disclosed technology relates generally to methods and systems for controlling the release of micro devices. Prior to transferring micro devices to a destination substrate, a native substrate is formed with micro devices thereon. The micro devices can be distributed over the native substrate and spatially separated from each other by an anchor structure. The anchors are physically connected/secured to the native substrate. Tethers physically secure each micro device to one or more anchors, thereby suspending the micro device above the native substrate. In certain embodiments, single tether designs are used to control the relaxation of built-in stress in releasable structures on a substrate, such as Si (1 1 1). Single tether designs offer, among other things, the added benefit of easier break upon retrieval from native substrate in micro assembly processes. In certain embodiments, narrow tether designs are used to avoid pinning of the undercut etch front.

    Systems and methods for controlling release of transferable semiconductor structures
    17.
    发明授权
    Systems and methods for controlling release of transferable semiconductor structures 有权

    公开(公告)号：US09947584B2

    公开(公告)日：2018-04-17

    申请号：US15430101

    申请日：2017-02-10

    Applicant: X-Celeprint Limited

    Inventor： Christopher Bower ,  Matthew Meitl

    IPC: H01L21/78

    CPC classification number: H01L21/7813 ,  B81C99/008 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/83 ,  H01L2221/68368

    Abstract: The disclosed technology relates generally to methods and systems for controlling the release of micro devices. Prior to transferring micro devices to a destination substrate, a native substrate is formed with micro devices thereon. The micro devices can be distributed over the native substrate and spatially separated from each other by an anchor structure. The anchors are physically connected/secured to the native substrate. Tethers physically secure each micro device to one or more anchors, thereby suspending the micro device above the native substrate. In certain embodiments, single tether designs are used to control the relaxation of built-in stress in releasable structures on a substrate, such as Si (1 1 1). Single tether designs offer, among other things, the added benefit of easier break upon retrieval from native substrate in micro assembly processes. In certain embodiments, narrow tether designs are used to avoid pinning of the undercut etch front.

    DEVICES WITH A SINGLE METAL LAYER
    20.
    发明申请
    DEVICES WITH A SINGLE METAL LAYER 审中-公开

    公开(公告)号：US20180033853A1

    公开(公告)日：2018-02-01

    申请号：US15659500

    申请日：2017-07-25

    Applicant: X-Celeprint Limited

    Inventor： Christopher Bower ,  Matthew Meitl ,  Carl Prevatte ,  Ronald S. Cok

    IPC: H01L27/32 ,  H01L27/146 ,  H01L27/15

    CPC classification number: H01L27/3288 ,  H01L25/0753 ,  H01L27/14636 ,  H01L27/156 ,  H01L27/3211 ,  H01L27/3255 ,  H01L27/3276 ,  H01L33/62 ,  H01L2933/0066

    Abstract: A single metal layer device, such as a display or sensor, comprises a substrate and a patterned metal layer. The patterned metal layer forms a two-dimensional array of spatially separated column line segments that each extend only partially across the display substrate in a column direction and forms a one-dimensional array of row lines extending across the display substrate in a row direction different from the column direction. The row lines and column line segments are electrically separate in the patterned metal layer. Spatially separated electrical jumpers are disposed on the display substrate and electrically connect pairs of column line segments adjacent in the column direction. Each electrical jumper has an independent jumper substrate independent of and separate from the display substrate. In certain embodiments, spatially separated light-emitting pixel circuits are disposed on a display substrate and are electrically connected to at least one row line and one column line.

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