公开(公告)号：US07961152B2

公开(公告)日：2011-06-14

申请号：US11584616

申请日：2006-10-23

Applicant: Yu-Chiang Cheng ,  Ping-Cheng Chang ,  Cheng-Zing Chou

Inventor： Yu-Chiang Cheng ,  Ping-Cheng Chang ,  Cheng-Zing Chou

IPC: H01Q9/00

CPC classification number: E05C1/10 ,  E05B15/04 ,  E05B17/22 ,  E05B65/006 ,  E05B2015/0444 ,  G06F1/1616 ,  G06F1/1679 ,  G06F1/1698 ,  H01F21/04

Abstract: An electronic device includes a helical resilient member serving as an electrical inductance element. The electronic device also includes an antenna, a signal feeding line, and a transmitting/receiving module. The helical resilient member has first and second ends with a predetermined number of turns of coil arranged therebetween the first and second ends, and is made of electrically conductive materials so that the turns of coil defines an electrical inductance. The signal feeding line is connected between the helical resilient member and a signal feed point of the antenna. The transmitting/receiving module is connected to the helical resilient member so as to couple the inductance of the helical resilient member to the transmitting/receiving module.

Abstract translation: 电子装置包括用作电感元件的螺旋弹性构件。 电子设备还包括天线，信号馈送线和发射/接收模块。 螺旋弹性构件具有在第一和第二端之间设置有预定数量的线圈的第一和第二端，并且由导电材料制成，使得线圈的匝限定电感。 信号馈送线连接在螺旋弹性构件和天线的信号馈送点之间。 发射/接收模块连接到螺旋弹性构件，以将螺旋弹性构件的电感耦合到发射/接收模块。

公开(公告)号：US20070236397A1

公开(公告)日：2007-10-11

申请号：US11651981

申请日：2007-01-11

Applicant: Yu-Chiang Cheng ,  Ping-Cheng Chang ,  Cheng-Zing Chou

Inventor： Yu-Chiang Cheng ,  Ping-Cheng Chang ,  Cheng-Zing Chou

IPC: H01Q1/24

CPC classification number: H01Q1/2258 ,  G06F1/1616 ,  G06F1/1637 ,  G06F1/1683 ,  H01Q1/48

Abstract: Disclosed is an antenna device arranged inside a display module of an electronic device with an anti-EMI plate. The antenna device includes an antenna element with a ground connecting end and a signal feeding end for transceiving a wireless signal, a ground connecting line coupled to the ground connecting end of the antenna element and the anti-EMI plate, and an antenna signal feeding line coupled to the signal feeding end of the antenna element for feeding the wireless signal transceived by the antenna element.

Abstract translation: 公开了一种天线装置，其布置在具有抗EMI板的电子装置的显示模块内。 天线装置包括具有接地端的天线元件和用于收发无线信号的信号馈送端，耦合到天线元件的接地连接端和抗EMI板的接地连接线以及天线信号馈线 耦合到天线元件的信号馈送端，用于馈送由天线元件收发的无线信号。

公开(公告)号：US20070216579A1

公开(公告)日：2007-09-20

申请号：US11404813

申请日：2006-04-17

Applicant: Yu-Chiang Cheng ,  Ping-Cheng Chang ,  Cheng-Zing Chou

Inventor： Yu-Chiang Cheng ,  Ping-Cheng Chang ,  Cheng-Zing Chou

IPC: H01Q1/38 ,  H01Q1/24

CPC classification number: H01Q1/243 ,  H01Q1/38

Abstract: Disclosed is an antenna device for transceiving a wireless signal. The antenna device includes an antenna element adapted to establish a radiation pattern during transceiving the wireless signal; an antenna signal feeding line coupling to the antenna element for feeding the wireless signals transceived by the antenna element; and at least one radiation pattern adjustment element arranged at an adjacent position with respect to the antenna element and within the established radiation pattern of the antenna element to adjust the radiation pattern of the antenna element.

Abstract translation: 公开了一种用于收发无线信号的天线装置。 所述天线装置包括适于在收发所述无线信号期间建立辐射图的天线元件; 耦合到天线元件的天线信号馈电线，用于馈送由天线元件收发的无线信号; 以及布置在相对于天线元件的相邻位置处并且在天线元件的建立的辐射图案内的至少一个辐射图案调整元件，以调整天线元件的辐射图案。

公开(公告)号：US20070201207A1

公开(公告)日：2007-08-30

申请号：US11307853

申请日：2006-02-24

Applicant: Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Ping-Feng Lee ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

Inventor： Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Ping-Feng Lee ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

IPC: H05K7/20

CPC classification number: H01L23/373 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: This invention discloses a chip heat dissipation system for a chip in heat dissipating and a manufacturing method and a structure of heat dissipation device. The chip heat dissipation system includes a heat dissipation device, a heat exchange device, a pump assembly device and at least two pipes. This heat dissipation device is used for receiving waste heat generate from the chip, then heat exchange device is used for discharging waste heat. Moreover, the heat exchange device is composed of a thermal conduction material, including a metal material and a bracket structure of carbon element. Also, the pipes are used for connecting at least two connection ends of the heat dissipation device and the heat exchange device and then the pump assembly device is used for circulating a fluid between the heat dissipation device and the heat exchange device by the pipes. The bracket structure of carbon element has high thermal conductivity, so as to improve the heat conduction efficiency. The manufacturing method for thermal conduction material can be made with chemical vapor deposition, physical vapor deposition, melting or the other material preparations. The bracket structure of carbon element can be coated on the metal material surface and can also be mixed into the metal material.

Abstract translation: 本发明公开了一种用于散热芯片的芯片散热系统及散热装置的制造方法和结构。 芯片散热系统包括散热装置，热交换装置，泵组装装置和至少两个管。 该散热装置用于从芯片接收产生的废热，然后使用热交换装置排放废热。 此外，热交换装置由包括金属材料和碳元素的支架结构的导热材料构成。 此外，管道用于连接散热装置和热交换装置的至少两个连接端，然后使用泵组装装置通过管道在散热装置和热交换装置之间循环流体。 碳元素的支架结构具有高导热性，从而提高导热效率。 导热材料的制造方法可以通过化学气相沉积，物理气相沉积，熔化或其它材料制备。 碳元素的支架结构可以涂覆在金属材料表面上，也可以混入金属材料中。

公开(公告)号：US20070199681A1

公开(公告)日：2007-08-30

申请号：US11307827

申请日：2006-02-24

Applicant: Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Ping-Feng Lee ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

Inventor： Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Ping-Feng Lee ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

IPC: F28D15/00

CPC classification number: F28D15/046

Abstract: This invention discloses a manufacturing method and the structure for a dissipation heat pipe. This dissipation heat pipe includes a hollow closed pipe, a type of fluid and a wick structure. The dissipation heat pipe is often used in conducting the heat from a chip. The dissipation heat pipe can be made of a special thermal conduction material, including the metal and a bracket structure of carbon element which have high thermal conductivity, so as to improve the heat conduction efficiency. The corresponding manufacturing method for this heat conduction material can be made by chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can coat on the metal surface and can also be mixed into the metal.

Abstract translation: 本发明公开了一种散热管的制造方法和结构。 该耗散热管包括中空的封闭管，一种流体和油绳结构。 耗散热管经常用于从芯片传导热量。 散热管可以由特殊的导热材料制成，包括具有高导热性的金属和碳元素的支架结构，从而提高导热效率。 该导热材料的相应制造方法可以通过化学气相沉积，物理气相沉积，电镀或其它材料制备方法制备。 碳元素的支架结构可以涂覆在金属表面上，也可以混入金属中。

公开(公告)号：US20070199679A1

公开(公告)日：2007-08-30

申请号：US11307839

申请日：2006-02-24

Applicant: Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Ping-Feng Lee ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

Inventor： Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Ping-Feng Lee ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

IPC: H05K7/20

CPC classification number: H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: This invention discloses a chip heat dissipation system for chip heat dissipation and a manufacturing method and structure of heat dissipation device thereof. The chip heat dissipation system includes a heat dissipation device, a heat exchange device, a pump assembly device and at least two pipes. The heat dissipation device is used for receiving a waste heat from the chip, and the heat dissipation device is composed of a thermal conduction material, including a metal material and a bracket structure of carbon element; the heat exchange device is used for discharging the waste heat; the at least two pipes are used for connecting at least two joints of the heat dissipation device and the heat exchange device; and the pump assembly device is used for circulating a fluid between the heat dissipation device and the heat exchange device by the at least two pipes. The bracket structure of carbon element has high thermal conductivity, so as to improve the heat conduction efficiency. The manufacturing method for the thermal conduction material can be made with chemical vapor deposition, physical vapor deposition, melting or the other materials preparation method. The bracket structure of carbon element can be coated on a surface of the metal material and also can be mixed into the metal material.

Abstract translation: 本发明公开了一种用于芯片散热的芯片散热系统及其散热装置的制造方法和结构。 芯片散热系统包括散热装置，热交换装置，泵组装装置和至少两个管。 散热装置用于从芯片接收废热，散热装置由包括金属材料和碳元素支架结构的导热材料组成; 热交换装置用于排放废热; 所述至少两个管道用于连接所述散热装置和所述热交换装置的至少两个接头; 并且所述泵组装装置用于通过所述至少两个管道在所述散热装置和所述热交换装置之间循环流体。 碳元素的支架结构具有高导热性，从而提高导热效率。 导热材料的制造方法可以通过化学气相沉积，物理气相沉积，熔化或其它材料的制备方法进行。 碳元素的支架结构可以涂覆在金属材料的表面上，并且也可以混入金属材料中。

公开(公告)号：US20070199678A1

公开(公告)日：2007-08-30

申请号：US11307841

申请日：2006-02-24

Applicant: Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

Inventor： Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

IPC: H05K7/20

CPC classification number: H01L23/373 ,  G06F1/20 ,  H01L23/3672 ,  H01L23/3735 ,  H01L2924/0002 ,  H01L2924/00

Abstract: This invention discloses a manufacturing method and the structure for a surface coating film on a heat dissipation metal. The surface coating film structure on the heat dissipation metal includes a heat dissipation metal and a thin film. The surface coating film structure on the heat dissipation metal is often used in dissipation the waste heat from the electronic apparatuses. The thin film is composed of a bracket structure of carbon element which has high thermal conductivity, so as to improve the efficiency of heat dissipation of the heat dissipation metal. The corresponding manufacturing method for the thin film can be made with chemical vapor deposition, physical vapor deposition or the other material preparation methods.

Abstract translation: 本发明公开了一种散热金属表面涂膜的制造方法和结构。 散热金属上的表面涂膜结构包括散热金属和薄膜。 散热金属上的表面涂膜结构经常用于散发来自电子设备的废热。 该薄膜由具有高导热性的碳元素的支架结构构成，以提高散热金属的散热效率。 薄膜的相应制造方法可以用化学气相沉积，物理气相沉积或其它材料制备方法制成。

公开(公告)号：US20050007717A1

公开(公告)日：2005-01-13

申请号：US10710159

申请日：2004-06-23

Applicant: Kuo-Ming Chuang ,  Yu-Chiang Cheng

Inventor： Kuo-Ming Chuang ,  Yu-Chiang Cheng

IPC: H04B15/02 ,  H05K1/02 ,  H05K1/18 ,  H02H9/06

CPC classification number: H05K1/0216 ,  H04B15/02 ,  H05K1/181 ,  H05K2201/09309

Abstract: A circuit for suppressing electromagnetic interference (EMI) and operation method thereof is provided. Interfering signals captured or coupled from the motherboard are transmitted to the phase-shifter for shifting the phase of the signals. The interfering signals with phase shifted are outputted and coupled to the ground layer or the power-supply layer to offset EMI noise thereof. Since merely additional space for the phase shifter is reserved on the motherboard, EMI effect is eliminated and time and cost for rerouting the circuit is thus reduced.

Abstract translation: 提供了一种用于抑制电磁干扰（EMI）的电路及其操作方法。 从主板捕获或耦合的干扰信号被发送到移相器，用于移位信号的相位。 输出具有相移的干扰信号并耦合到接地层或电源层以抵消其EMI噪声。 由于在主板上仅保留了用于移相器的额外空间，因此消除了EMI效应，因此减少了用于重新路由电路的时间和成本。

公开(公告)号：US06548858B2

公开(公告)日：2003-04-15

申请号：US09800409

申请日：2001-03-06

Applicant: Yu-Chiang Cheng

Inventor： Yu-Chiang Cheng

IPC: H01L29792

CPC classification number: H05K1/024 ,  H05K1/0298 ,  H05K2201/0191 ,  H05K2201/09327 ,  Y10T29/49126

Abstract: A multi-layer circuit board includes first, second, third, fourth and fifth insulating substrates, first, second, third and fourth signal wiring layers, a ground wiring layer and a power wiring layer. The insulating substrates and the wiring layers are press-bonded to each other to form the circuit board with a thickness of about 1.0 mm. Each of the first and fifth insulating substrates has a thickness ranging from 5.225 to 5.775 mil. Each of the second and fourth insulating substrates has a thickness ranging from 7.6 to 8.4 mil. The third insulating substrate has a thickness ranging from 3.8 to 4.2 mil. The first signal wiring layer has a first resistance with respect to the ground wiring layer. The second signal wiring layer has a second resistance with respect to the ground wiring layer and the power wiring layer. The third signal wiring layer has a third resistance with respect to the ground wiring layer and the power wiring layer. The fourth signal wiring layer has a fourth resistance with respect to the power wiring layer. The first, second, third and fourth resistances are within the range of 49.5 to 60.5 ohms.

公开(公告)号：US07804459B2

公开(公告)日：2010-09-28

申请号：US12213611

申请日：2008-06-23

Applicant: Shyh-Jong Chung ,  Yu-Hsin Wang ,  Yu-Chiang Cheng

Inventor： Shyh-Jong Chung ,  Yu-Hsin Wang ,  Yu-Chiang Cheng

IPC: H01Q9/04

CPC classification number: H01Q9/30 ,  H01Q5/364

Abstract: Disclosed is a transmission line loaded dual-band monopole antenna, which realizes operation in dual bands with a single antenna. The dual-band monopole antenna includes a monopole antenna and a transmission line load. The monopole antenna has a signal feeding terminal and a load connection terminal. The load connection terminal is connected to the transmission line load. The transmission line load includes a core transmission line, an outer circumferential conductor, and a short-circuit section. The core transmission line has an antenna connection terminal and a short-circuit terminal. The antenna connection terminal is connected to the load connection terminal of the monopole antenna. The outer circumferential conductor circumferentially surrounds and is spaced from the core transmission line and the outer circumferential conductor has an open terminal and a short-circuit terminal. The opening of the open terminal of the outer circumferential conductor faces the antenna connection terminal of the core transmission line so that the outer circumferential conductor forms an open structure facing the monopole antenna.

Abstract translation: 公开了一种传输线路加载的双频单极天线，其实现在具有单个天线的双频带中的操作。 双频单极天线包括单极天线和传输线负载。 单极天线具有信号馈送端子和负载连接端子。 负载连接端子连接到传输线负载。 传输线负载包括芯传输线，外周导体和短路部分。 核心传输线具有天线连接端子和短路端子。 天线连接端子连接到单极天线的负载连接端子。 外周导体周向地包围并且与芯传输线间隔开，并且外周导体具有开路端子和短路端子。 外周导体的开放端子的开口面向芯传输线的天线连接端子，使得外周导体形成面向单极天线的开放结构。