公开(公告)号：US20130120504A1

公开(公告)日：2013-05-16

申请号：US13806277

申请日：2011-06-10

Applicant: Yuichi Machida ,  Nobuko Yanata

Inventor： Atsuro Yanata ,  Yuichi Machida

IPC: B41J2/045

CPC classification number: B41J2/14201 ,  B41J2/045 ,  B41J2/14233 ,  B41J2002/14459 ,  B41J2002/14491 ,  B41J2202/18

Abstract: An inkjet printhead includes multiple sets each of which includes a nozzle, pressure chamber, and actuator; a circuit board; and a connection member. The circuit board includes a wire, through hole via, and ink channel. The connection member, which connects the wire to a driving unit, is provided outside of an array area where the sets are two-dimensionally arrayed. The number of the nozzle rows is N, and each row includes M nozzles (M and N: integer of 2 or more). The through hole vias corresponding to the nozzles of n nozzle row of the N nozzle rows are provided inside of the array area (n: 1≦n

Abstract translation: 喷墨打印头包括多组，每组包括喷嘴，压力室和致动器; 电路板; 和连接构件。 电路板包括电线，通孔通孔和墨水通道。 将线连接到驱动单元的连接构件设置在阵列二维排列的阵列区域的外侧。 喷嘴列的数量为N，每行包括M个喷嘴（M和N：2或更大的整数）。 对应于N个喷嘴列的n个喷嘴列的喷嘴的通孔过孔设置在阵列区域（n：1 @ n

公开(公告)号：US20120105488A1

公开(公告)日：2012-05-03

申请号：US13276891

申请日：2011-10-19

Applicant: Masao KONDO ,  Kunihito Sawai ,  Yuichi Machida

Inventor： Masao KONDO ,  Kunihito Sawai ,  Yuichi Machida

IPC: G09G5/34

CPC classification number: G06F3/0488 ,  G06F3/0485 ,  G06T3/20

Abstract: An image processing apparatus includes a position movement input unit configured to receive a position movement instruction from a user, a pointer movement unit configured to set a position of a pointer that moves in accordance with the instruction, and a screen movement unit configured to scroll a screen based on a relative position of the pointer with respect to a reference point of a predefined area around the pointer, the screen movement unit configured to move the predefined area to keep the pointer inside the predefined area when the pointer is at a border of the predefined area and moves towards an outside of the predefined area.

Abstract translation: 图像处理装置包括：位置移动输入单元，被配置为从用户接收位置移动指令;指针移动单元，被配置为设置根据该指示移动的指针的位置;以及屏幕移动单元， 基于所述指针相对于所述指示器周围的预定区域的参考点的相对位置的屏幕，所述屏幕移动单元被配置为当所述指针位于所述指针的边界处时移动所述预定区域以将所述指针保持在所述预定区域内 预定区域并且朝向预定区域的外部移动。

公开(公告)号：US07140785B2

公开(公告)日：2006-11-28

申请号：US11131979

申请日：2005-05-18

Applicant: Yuichi Machida ,  Hisashi Tomita ,  Tomoshi Hirayama ,  Yoichi Mizutani ,  Masato Kajimoto ,  Tsutomu Sampei

Inventor： Yuichi Machida ,  Hisashi Tomita ,  Tomoshi Hirayama ,  Yoichi Mizutani ,  Masato Kajimoto ,  Tsutomu Sampei

IPC: G02B6/36

CPC classification number: H04B10/801 ,  H01L31/167

Abstract: An optical connector assembly has a plug connector having a first optical element for performing emission or receipt of light and a first lens. It also has a receptacle connector having a second optical element for performing receipt or emission of light and a second lens. The plug connector includes a convex portion having sectional configuration of round arch and the first lens, and a plug portion formed on a forward end of the convex portion. The plug portion is perpendicular to first optical axis of the first optical element and the first lens. The receptacle connector includes a concave portion into which the convex portion is inserted and a receptacle portion in a bottom of the concave portion. The receptacle portion is perpendicular to second optical axis of the second optical element and the second lens. The plug or receptacle connector has supporting mechanism that supports the connector movably.

Abstract translation: 光学连接器组件具有插头连接器，其具有用于执行光的发射或接收的第一光学元件和第一透镜。 它还具有插座连接器，其具有用于执行光的接收或发射的第二光学元件和第二透镜。 插头连接器包括具有圆拱和第一透镜的截面构造的凸部，以及形成在凸部的前端上的插头部。 插头部分垂直于第一光学元件和第一透镜的第一光轴。 插座连接器包括凹部，凹部插入该凹部中，凹部的底部中的插座部。 插座部分垂直于第二光学元件和第二透镜的第二光轴。 插头或插座连接器具有可移动地支撑连接器的支撑机构。

公开(公告)号：US09024423B2

公开(公告)日：2015-05-05

申请号：US12767071

申请日：2010-04-26

Applicant: Akira Muto ,  Yuichi Machida ,  Nobuya Koike ,  Atsushi Fujiki ,  Masaki Tamura

Inventor： Akira Muto ,  Yuichi Machida ,  Nobuya Koike ,  Atsushi Fujiki ,  Masaki Tamura

IPC: H01L23/02 ,  H01L25/07 ,  H01L23/495 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L25/074 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49537 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49582 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73253 ,  H01L2924/13091

Abstract: A semiconductor chip in which a power MOSFET is placed above a semiconductor chip in which another power MOSFET is formed and they are sealed with an encapsulation resin. The semiconductor chips are so arranged that the upper semiconductor chip does not overlap with a gate pad electrode of the lower semiconductor chip in a plan view. The semiconductor chips are identical in size and the respective source pad electrodes and gate pad electrodes of the lower semiconductor chip and the upper semiconductor chip are identical in shape and arrangement. The lower semiconductor chip and the upper semiconductor chip are arranged with their respective centers displaced from each other. Accordingly, the size of a semiconductor device can be reduced.

Abstract translation: 一种半导体芯片，其中功率MOSFET被放置在其上形成另一功率MOSFET的半导体芯片之上，并且它们用封装树脂密封。 半导体芯片布置成使得上半导体芯片在平面图中不与下半导体芯片的栅极焊盘电极重叠。 半导体芯片的尺寸相同，并且下半导体芯片和上半导体芯片的各个源极焊盘电极和栅极焊盘电极的形状和布置相同。 下半导体芯片和上半导体芯片被布置成它们各自的中心彼此偏离。 因此，可以减小半导体器件的尺寸。

公开(公告)号：US08979246B2

公开(公告)日：2015-03-17

申请号：US13996795

申请日：2011-12-15

Applicant: Shigekazu Sakai ,  Yoshifumi Takafuji ,  Yuichi Machida ,  Naomi Kubo ,  Koujiro Yoshida ,  Yasuo Nishi

Inventor： Shigekazu Sakai ,  Yoshifumi Takafuji ,  Yuichi Machida ,  Naomi Kubo ,  Koujiro Yoshida ,  Yasuo Nishi

IPC: B41J2/15 ,  B41J2/145 ,  B41J25/34 ,  B41J2/155 ,  B41J25/00

CPC classification number: B41J2/145 ,  B41J2/155 ,  B41J25/34 ,  B41J2025/008 ,  B41J2202/19 ,  B41J2202/20

Abstract: The object is to provide an inkjet head unit having: head chips having nozzles arranged on nozzle faces, and capable of discharging ink by respective independent pressure generating module from pressure chambers communicating with the nozzles; and a tabular head unit base on which the head chips are arranged and which is capable of holding the head chips, of abutting faces of the head unit base and the head chip, at least one of the abutting face on the head unit base side and the abutting face on the head chip side is formed in a stepped shape, so that the height of the abutting face of the head chip relative to the surface of the head unit base is partially changed, and the head chip is thereby attached to be inclined relative to the surface of the head unit base.

Abstract translation: 本发明的目的是提供一种喷墨头单元，其具有头喷头，其喷嘴布置在喷嘴面上，并且能够通过与喷嘴连通的压力室由相应的独立压力产生模块排出墨; 以及平板式头单元，其中头部芯片布置在其上，并且能够保持头部单元基座和头部芯片的邻接面的头部芯片，头部单元基座侧的抵接面中的至少一个和 头芯片侧的抵接面形成为台阶形状，使得头芯片相对于头单元基座的表面的抵接面的高度部分地改变，并且头芯片因此被附接为倾斜 相对于头单元基座的表面。

公开(公告)号：US20090190320A1

公开(公告)日：2009-07-30

申请号：US12362354

申请日：2009-01-29

Applicant: ICHIO SHIMIZU ,  Kenya Kawano ,  Kisho Ashida ,  Yuichi Machida

Inventor： ICHIO SHIMIZU ,  Kenya Kawano ,  Kisho Ashida ,  Yuichi Machida

IPC: H05K7/04 ,  H01L23/48

CPC classification number: H05K7/04 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49589 ,  H01L24/28 ,  H01L24/29 ,  H01L24/36 ,  H01L24/39 ,  H01L24/40 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/40245 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2224/83801 ,  H01L2224/83855 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/351 ,  H05K3/202 ,  H05K3/321 ,  H05K3/3442 ,  H05K2201/0397 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09745 ,  H05K2201/1003 ,  H05K2201/10484 ,  H05K2201/10636 ,  H05K2201/10924 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Coupling reliability of a passive component is improved to increase the reliability of a semiconductor device. A first through hole is formed in a first electrode part of a first plate-like lead, and a second through hole is formed in a second electrode part of a second plate-like lead. As a result, at the first electrode part of the first plate-like lead, one external terminal of the passive component can be coupled to the first electrode parts on both sides of the first through hole while being laid across the first through hole. Also, at the second electrode part of the second plate-like lead, the other external terminal of the passive component can be coupled to the second electrode parts on both sides of the second through hole while being laid across the second through hole. Accordingly, at central portions both in the longitudinal and width directions of the passive component, the passive component is surrounded by sealing members. As a result, thermal stress applied to jointing materials such as solder can be reduced, improving the reliability of the semiconductor device (semiconductor package).

Abstract translation: 改善了无源部件的耦合可靠性，以提高半导体器件的可靠性。 第一通孔形成在第一板状引线的第一电极部分中，第二通孔形成在第二板状引线的第二电极部分中。 结果，在第一板状引线的第一电极部分，无源部件的一个外部端子可以被连接到第一通孔的两侧的第一电极部分，同时跨过第一通孔。 此外，在第二板状引线的第二电极部分，无源部件的另一个外部端子可以在跨过第二通孔而被布置在第二通孔的两侧上的第二电极部件上。 因此，在无源部件的纵向和宽度方向的中心部分处，被动部件被密封部件包围。 结果，可以减少施加到诸如焊料的接合材料的热应力，从而提高半导体器件（半导体封装）的可靠性。

公开(公告)号：US09013569B2

公开(公告)日：2015-04-21

申请号：US13167990

申请日：2011-06-24

Applicant: Yu Hirono ,  Fumiyasu Suzuki ,  Yuichi Machida

Inventor： Yu Hirono ,  Fumiyasu Suzuki ,  Yuichi Machida

IPC: H04N9/47 ,  H04N7/18 ,  G02B21/34 ,  G02B21/26

CPC classification number: G01N21/13 ,  G01N2021/135 ,  G02B21/26 ,  G02B21/34

Abstract: A conveying device including: a storage unit storing two or more sheets of slide glasses to be subjected to a predetermined treatment; a stage holding only one sheet of slide glass to be subjected to the treatment; a supply arm by which one sheet of slide glass to be subjected to the treatment is picked up from the storage unit and supplied onto the stage; a discharge arm by which the slide glass mounted on the stage is picked up and discharged in the storage unit; a moving unit operable to move the supply arm and the discharge arm in an integral manner so as to bring the supply arm or the discharge arm into proximity to each of the storage unit and the stage; and a control unit operable to control the supply arm, the discharge arm and the moving unit.

Abstract translation: 一种输送装置，包括：存储单元，存储要进行预定处理的两张或更多张幻灯片; 仅容纳一张待处理的载玻片的台阶; 供给臂，通过该供给臂从所述存储单元拾取待处理的一张载玻片并供给到所述台上; 安装在台架上的载玻片通过该排出臂拾取并放出到存储单元中; 移动单元，其可操作以一体地移动所述供给臂和所述排出臂，以使所述供应臂或所述排出臂接近所述存储单元和所述台中的每一个; 以及控制单元，其可操作以控制供应臂，排出臂和移动单元。

公开(公告)号：US20130271528A1

公开(公告)日：2013-10-17

申请号：US13996795

申请日：2011-12-15

Applicant: Shigekazu Sakai ,  Yoshifumi Takafuji ,  Yuichi Machida ,  Naomi Kubo ,  Koujiro Yoshida ,  Yasuo Nishi

Inventor： Shigekazu Sakai ,  Yoshifumi Takafuji ,  Yuichi Machida ,  Naomi Kubo ,  Koujiro Yoshida ,  Yasuo Nishi

IPC: B41J2/145

CPC classification number: B41J2/145 ,  B41J2/155 ,  B41J25/34 ,  B41J2025/008 ,  B41J2202/19 ,  B41J2202/20

Abstract: The object is to provide an inkjet head unit having: head chips having nozzles arranged on nozzle faces, and capable of discharging ink by respective independent pressure generating module from pressure chambers communicating with the nozzles; and a tabular head unit base on which the head chips are arranged and which is capable of holding the head chips, of abutting faces of the head unit base and the head chip, at least one of the abutting face on the head unit base side and the abutting face on the head chip side is formed in a stepped shape, so that the height of the abutting face of the head chip relative to the surface of the head unit base is partially changed, and the head chip is thereby attached to be inclined relative to the surface of the head unit base.

Abstract translation: 本发明的目的是提供一种喷墨头单元，其具有头喷头，其喷嘴布置在喷嘴面上，并且能够通过与喷嘴连通的压力室由相应的独立压力产生模块排出墨; 以及平板式头单元，其中头部芯片布置在其上，并且能够保持头部单元基座和头部芯片的邻接面的头部芯片，头部单元基座侧的抵接面中的至少一个和 头芯片侧的抵接面形成为台阶形状，使得头芯片相对于头单元基座的表面的抵接面的高度部分地改变，并且头芯片因此被附接为倾斜 相对于头单元基座的表面。

公开(公告)号：US08335436B2

公开(公告)日：2012-12-18

申请号：US12432472

申请日：2009-04-29

Applicant: Yuichi Machida

Inventor： Yuichi Machida

IPC: H04B10/00

CPC classification number: H04M1/0235 ,  H04B10/801

Abstract: An electronic apparatus is provided and includes a light transmitting module configured to convert an electric signal into an optical signal and emit light, a light receiving module configured to receive the light emitted from the light transmitting module and convert the optical signal into an electric signal, and a mover unit configured to cause at least one of the light transmitting module and the light receiving module to carry out linear movement along an optical axis of the light emitted from the light transmitting module and/or rotation about the optical axis.

Abstract translation: 提供了一种电子设备，包括：光传输模块，被配置为将电信号转换为光信号并发光;光接收模块，被配置为接收从光发射模块发射的光并将光信号转换为电信号; 以及移动单元，被配置为使得所述光传输模块和所述光接收模块中的至少一个沿着从所述光传输模块发射的光的光轴进行线性移动和/或围绕所述光轴的旋转。

公开(公告)号：US20090285578A1

公开(公告)日：2009-11-19

申请号：US12432472

申请日：2009-04-29

Applicant: Yuichi Machida

Inventor： Yuichi Machida

IPC: H04B10/00

CPC classification number: H04M1/0235 ,  H04B10/801

Abstract: An electronic apparatus is provided and includes a light transmitting module configured to convert an electric signal into an optical signal and emit light, a light receiving module configured to receive the light emitted from the light transmitting module and convert the optical signal into an electric signal, and a mover unit configured to cause at least one of the light transmitting module and the light receiving module to carry out linear movement along an optical axis of the light emitted from the light transmitting module and/or rotation about the optical axis.

Abstract translation: 提供了一种电子设备，包括：光传输模块，被配置为将电信号转换为光信号并发光;光接收模块，被配置为接收从光发射模块发射的光并将光信号转换为电信号; 以及移动单元，被配置为使得所述光传输模块和所述光接收模块中的至少一个沿着从所述光传输模块发射的光的光轴进行线性移动和/或围绕所述光轴的旋转。