公开(公告)号：US20120328132A1

公开(公告)日：2012-12-27

申请号：US13169065

申请日：2011-06-27

Applicant: Yunlong Wang

Inventor： Yunlong Wang

IPC: H04R17/02

CPC classification number: H04R19/04 ,  H04R1/222

Abstract: This invention relates to a miniature silicon capacitive microphone having a perforated backplate supported on a substrate, a shallowly corrugated and perforated diaphragm that is suspended above said backplate and said suspended shallowly corrugated and perforated diaphragm is fully clamped and anchored on the said substrate at the edge of said diaphragm. Said perforated backplate is isolated electrically from said substrate by a layer of dielectric material. Said suspended shallowly corrugated diaphragm has a plurality of perforation holes to allow the passage of slow varying ambient pressure, and to equalize the barometric pressure in and out of the back cavity.

Abstract translation: 本发明涉及一种微型硅电容式麦克风，其具有支撑在基板上的多孔背板，悬挂在所述背板上的浅波纹和穿孔隔膜，以及所述悬挂的浅波纹和穿孔的隔膜完全夹紧并锚定在所述基板上的边缘 的隔膜。 所述多孔背板通过介电材料层与所述基板电隔离。 所述悬吊的浅波浪形隔膜具有多个穿孔，以允许缓慢变化的环境压力的通过，并使进入和离开后腔的大气压力相等。

公开(公告)号：US07899935B2

公开(公告)日：2011-03-01

申请号：US12249549

申请日：2008-10-10

Applicant: Zhongchu Zhu ,  Yongfeng Wang ,  Fei Zhou ,  Mingzhu Shi ,  Wei He ,  Yunlong Wang

Inventor： Zhongchu Zhu ,  Yongfeng Wang ,  Fei Zhou ,  Mingzhu Shi ,  Wei He ,  Yunlong Wang

IPC: G06F15/16

CPC classification number: G06F17/30581 ,  H04L41/00 ,  H04L67/1095 ,  H04L69/08

Abstract: A data synchronization system and method. The method includes that when a change happens in a source application, data is collected from a source application based on a target application subscribing the source application and collection data is transmitted to the target application or is directly inserted to target database. The system includes data collection unit and distribution unit. The present invention may realize synchronization on demand, simultaneously reduce greatly synchronous data quantity, decrease network load, and guarantee smoothness and stabilization of network. The present invention applies to data synchronization of enterprise internal/external data systems, telecommunication networks, etc.

Abstract translation: 数据同步系统和方法。 该方法包括当源应用程序发生变化时，基于订阅源应用程序的目标应用程序从源应用程序收集数据，并将收集数据传输到目标应用程序或直接插入目标数据库。 该系统包括数据采集单元和分配单元。 本发明可以实现按需同步，同时大大减少同步数据量，减少网络负载，保证网络的平滑性和稳定性。 本发明适用于企业内部/外部数据系统，电信网络等的数据同步。

公开(公告)号：US07771989B2

公开(公告)日：2010-08-10

申请号：US12583669

申请日：2009-08-24

Applicant: Yunlong Wang

Inventor： Yunlong Wang

IPC: C12M1/34

CPC classification number: G01N33/54386 ,  G01N33/558

Abstract: This invention relates to a micromachined microfluidics diagnostic device that comprises one or multiple assaying channels each of which is comprised a sample port, a first valve, a reaction chamber, a second valve, a fluid ejector array, a third valve, a buffer chamber, a capture zone and a waste chamber. Each of these device components are interconnected through microfluidic channels. This invention further relates to the method of operating a micromachined microfluidic diagnostic device. The flow of fluid in the microchannels is regulated through micromachined valves. The reaction of sample analytes with fluorescent tags and detection antibodies in the reaction chamber are enhanced by the micromachined active mixer. By ejecting reaction mixture onto the capture zone through micromachined fluid ejector array, the fluorescent tagged analytes bind with capturing antiodies on capture zone. The fluid ejector array further ejects buffer fluid to wash away unbound fluorescent tags.

Abstract translation: 本发明涉及一种微加工微流体诊断装置，其包括一个或多个测定通道，每个测定通道包括样品端口，第一阀，反应室，第二阀，流体喷射器阵列，第三阀，缓冲室， 捕获区和废物室。 这些器件组件中的每一个通过微流体通道相互连接。 本发明还涉及微加工微流体诊断装置的操作方法。 微通道中的流体流动通过微加工阀来调节。 样品分析物与反应室中的荧光标签和检测抗体的反应通过微加工的活性混合器增强。 通过微型加工流体喷射器阵列将反应混合物喷射到捕获区上，荧光标记的分析物与捕获区上的捕获抗体结合。 流体喷射器阵列进一步喷射缓冲液以洗去未结合的荧光标签。

公开(公告)号：US07493821B2

公开(公告)日：2009-02-24

申请号：US10907824

申请日：2005-04-16

Applicant: Yunlong Wang

Inventor： Yunlong Wang

IPC: G01L9/12

CPC classification number: H04R19/00

Abstract: This invention relates generally to a micromachined acoustic transducer that has a scalable array of sealed cavities and perforated members forming capacitive cells that convert the electrical signal to acoustic signal or vice versa. It also relates to the method and more particularly to a micromachined acoustic transducer which includes a plurality of micromachined membranes and perforated members forming capacitive cells and more particularly to an acoustic transducer in which the capacitive cells are connected in a scalable array whereby electrical signals are applied to the said array and converted to acoustic signals. The transducer can either be used as an acoustic actuator or a microphone.

Abstract translation: 本发明一般涉及一种微机械声学换能器，其具有可缩放阵列的密封空腔和形成电容单元的穿孔构件，其将电信号转换成声信号，反之亦然。 它还涉及该方法，更具体地涉及一种微机械声学换能器，其包括多个微机械加工膜和形成电容性电池的穿孔构件，更具体地涉及一种声变换器，其中电容单元以可伸缩的阵列连接，从而施加电信号 到所述阵列并转换成声信号。 传感器可以用作声音致动器或麦克风。

公开(公告)号：US20080212807A1

公开(公告)日：2008-09-04

申请号：US12117724

申请日：2008-05-08

Applicant: Yunlong Wang

Inventor： Yunlong Wang

IPC: H04R17/10

CPC classification number: H04R19/005 ,  H04R1/227 ,  H04R17/00

Abstract: The present invention relates to an acoustic transducer that includes one or more capsules, side walls and a backing plate. Each capsule contains a cavity formed by the side walls and a plurality of film stacks. Each film stack has one or more membranes that can be a piezoelectric layer. Two or more of the film stacks that form the first cavity faces each other. A film stack and the backing plate face each other and form the wall of a second cavity. The transducers of this invention have a broadband response, can radiate sounds uni-directionally, and produce high quality sounds at low frequencies and at high intensities. They can be driven by AC signals. They can be fabricated using conventional integrated circuit manufacturing processes and therefore can be mass produced easily and inexpensively.

Abstract translation: 本发明涉及一种包括一个或多个胶囊，侧壁和背板的声换能器。 每个胶囊包含由侧壁和多个膜叠层形成的空腔。 每个膜堆具有一个或多个可以是压电层的膜。 形成第一空腔的两个或多个薄膜叠层彼此面对。 薄膜叠层和背板彼此面对并形成第二腔的壁。 本发明的换能器具有宽带响应，可以单向辐射声音，并且在低频和高强度下产生高质量的声音。 它们可以由交流信号驱动。 它们可以使用传统的集成电路制造工艺制造，因此可以容易且廉价地批量生产。

公开(公告)号：USD1063513S1

公开(公告)日：2025-02-25

申请号：US29936864

申请日：2024-04-10

Applicant: Yunlong Wang

Designer： Yunlong Wang

公开(公告)号：US20190174234A1

公开(公告)日：2019-06-06

申请号：US16270574

申请日：2019-02-07

Applicant: Guanghua Wu ,  Xingshuo Lan ,  Yunlong Wang

Inventor： Guanghua Wu ,  Xingshuo Lan ,  Yunlong Wang

IPC: H04R19/04 ,  H04R7/18 ,  H04R19/00

CPC classification number: H04R19/04 ,  H04R7/18 ,  H04R19/005 ,  H04R2201/003 ,  H04R2410/03

Abstract: The present invention provides a capacitive microphone having a capability of acceleration noise cancelation. The microphone includes (1) a moveable functional membrane comprising a basic functional membrane with an area Ao; and (2) a moveable reference membrane comprising a basic reference membrane. The basic reference membrane has one or more holes through the membrane's thickness, and the moveable reference membrane would be identical to the moveable functional membrane if the basic reference membrane does not have said one or more holes. The total area of said one or more holes is Ah, and a hole density HD is defined as Ah/Ao (%), and HD is in the range of e.g. from 0.012% to 2.647%.

公开(公告)号：US08472648B2

公开(公告)日：2013-06-25

申请号：US12813730

申请日：2010-06-11

Applicant: Yunlong Wang ,  Yi-Wen Chen

Inventor： Yunlong Wang ,  Yi-Wen Chen

IPC: H04R25/00

CPC classification number: H04R19/005 ,  H01L2924/16151 ,  H01L2924/16152 ,  Y10T29/49005

Abstract: MEMS microphone packages and fabrication methods thereof are disclosed. A MEMS microphone package includes a casing with a conductive part disposed over a substrate, to enclose a cavity. A MEMS acoustic sensing element and an IC chip are disposed inside the cavity. An opening with an acoustic passage connects the cavity to an ambient space. A first ground pad is disposed on a backside of the substrate connecting to the conductive part of the casing through a via hole of the substrate. A second ground pad is disposed on the backside of the substrate connecting to the MEMS acoustic sensing element or the IC chip through an interconnection of the substrate, wherein the first ground pad and the second ground pad are isolated from each other.

Abstract translation: 公开了MEMS麦克风封装及其制造方法。 MEMS麦克风封装包括具有设置在基板上方的导电部分以封闭空腔的壳体。 MEMS声学传感元件和IC芯片设置在腔内。 具有声通道的开口将空腔连接到环境空间。 第一接地焊盘设置在通过基板的通孔连接到壳体的导电部分的基板的背面。 第二接地焊盘通过衬底的互连设置在连接到MEMS声学感测元件或IC芯片的衬底的背面上，其中第一接地焊盘和第二接地焊盘彼此隔离。

公开(公告)号：US20130028459A1

公开(公告)日：2013-01-31

申请号：US13170151

申请日：2011-07-28

Applicant: Yunlong Wang

Inventor： Yunlong Wang

IPC: H04R17/02

CPC classification number: B81B7/0061 ,  B81B2201/0257 ,  B81B2207/096 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003 ,  H04R2499/11

Abstract: A monolithic silicon microphone including a first backplate, a second backplate and a diaphragm displaced between said first backplate and said second backplate. Said first backplate is supported by a silicon substrate with one or more perforation holes. Said second substrate is attached to a perforated plate which itself is supported on said substrate. Said monolithic silicon microphone has integrated signal conditioning circuit, and is said diaphragm, said first backplate, said second backplate, and said signal conditioning circuit are electrically interconnected. Signals from said diaphragm, said first backplate, and said second backplate are fed into said signal conditioning circuit, and are amplified differentially.

Abstract translation: 一种单片硅麦克风，包括第一背板，第二背板和在所述第一背板和所述第二背板之间移动的隔膜。 所述第一背板由具有一个或多个穿孔的硅衬底支撑。 所述第二基板附着到多孔板上，多孔板本身被支撑在所述基板上。 所述单片硅麦克风具有集成信号调理电路，并且是所述隔膜，所述第一背板，所述第二背板和所述信号调理电路电互连。 来自所述隔膜的信号，所述第一背板和所述第二背板被馈送到所述信号调理电路中，并且被差分地放大。

公开(公告)号：US20100246877A1

公开(公告)日：2010-09-30

申请号：US12813730

申请日：2010-06-11

Applicant: Yunlong Wang ,  Yi-Wen Chen

Inventor： Yunlong Wang ,  Yi-Wen Chen

IPC: H04R1/04 ,  H04R31/00

CPC classification number: H04R19/005 ,  H01L2924/16151 ,  H01L2924/16152 ,  Y10T29/49005

Abstract: MEMS microphone packages and fabrication methods thereof are disclosed. A MEMS microphone package includes a casing with a conductive part disposed over a substrate, to enclose a cavity. A MEMS acoustic sensing element and an IC chip are disposed inside the cavity. An opening with an acoustic passage connects the cavity to an ambient space. A first ground pad is disposed on a backside of the substrate connecting to the conductive part of the casing through a via hole of the substrate. A second ground pad is disposed on the backside of the substrate connecting to the MEMS acoustic sensing element or the IC chip through an interconnection of the substrate, wherein the first ground pad and the second ground pad are isolated from each other.

Abstract translation: 公开了MEMS麦克风封装及其制造方法。 MEMS麦克风封装包括具有设置在基板上方的导电部分以封闭空腔的壳体。 MEMS声学传感元件和IC芯片设置在腔内。 具有声通道的开口将空腔连接到环境空间。 第一接地焊盘设置在通过基板的通孔连接到壳体的导电部分的基板的背面。 第二接地焊盘通过衬底的互连设置在连接到MEMS声学感测元件或IC芯片的衬底的背面上，其中第一接地焊盘和第二接地焊盘彼此隔离。