公开(公告)号：US20180215956A1

公开(公告)日：2018-08-02

申请号：US15747187

申请日：2016-08-18

Applicant: SEKISUI PLASTICS CO., LTD.

Inventor： Koichiro OKAMOTO ,  Kengo NISHIUMI ,  Shuichi SASAHARA

IPC: C09J7/21 ,  C09J7/38 ,  C09J163/00 ,  C09J5/06 ,  B32B5/02 ,  B32B7/12 ,  B32B15/14 ,  B32B37/12 ,  B32B37/06

CPC classification number: C09J7/21 ,  B32B5/024 ,  B32B5/10 ,  B32B7/02 ,  B32B7/12 ,  B32B15/08 ,  B32B15/14 ,  B32B37/06 ,  B32B37/12 ,  B32B2037/1253 ,  B32B2250/02 ,  B32B2255/02 ,  B32B2255/26 ,  B32B2262/101 ,  B32B2363/00 ,  B32B2605/00 ,  C08J5/04 ,  C08J5/10 ,  C08J5/24 ,  C08J2363/00 ,  C08J2433/00 ,  C09J5/06 ,  C09J7/20 ,  C09J7/38 ,  C09J157/00 ,  C09J163/00 ,  C09J201/00 ,  C09J2400/143 ,  C09J2433/00 ,  C09J2463/00

Abstract: A metal panel reinforcing material comprising a resin composition, including a plastic component that has at least curability and is for a crosslinked polymer matrix, a curing agent for the plastic component, a curing accelerator for the plastic component, and a crosslinked polymer matrix, and a sheet-like fiber substrate, in which when the metal panel reinforcing material is stuck to a metal panel having a thickness of 0.8 mm and heated to be integrated into a reinforced metal panel, the metal panel reinforcing material exhibits the following properties to said metal panel: in three-point bending measured at a span of 100 mm, (i) a strength improvement rate of strength at 1 mm displacement is 120% or more, (ii) a maximum strength improvement rate is 200% or more, and (iii) a strain energy up to a maximum point is 0.5 N·m or more.

公开(公告)号：US20180134922A1

公开(公告)日：2018-05-17

申请号：US15569202

申请日：2016-07-20

Applicant: NITTO DENKO CORPORATION

Inventor： Hirofumi KATAMI ,  Atsushi YASUI

IPC: C09J7/38 ,  H01L51/52 ,  G02B5/30 ,  B32B7/12 ,  B32B7/02

CPC classification number: C09J7/381 ,  B32B7/02 ,  B32B7/12 ,  C08K3/22 ,  C09J7/38 ,  C09J11/04 ,  C09J11/08 ,  C09J201/00 ,  C09J2203/318 ,  C09J2205/102 ,  C09J2433/00 ,  G02B5/3033 ,  G02B5/3083 ,  G02F1/133502 ,  G02F2202/28 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/5281

Abstract: Provided is a polarizing film laminate comprising: an element substrate; a polarizer; a transparent electroconductive layer patterned so as to function as a touch sensor; and a pressure-sensitive adhesive layer, wherein the adhesive layer comprises: a base adhesive zone made of a transparent base pressure-sensitive adhesive material and formed over a given range from the adhesive layer in a thickness direction of the adhesive layer; and a refractive index adjustment zone formed over a given range from the adhesive layer in the thickness direction and comprising the base adhesive material and material infiltrated into the base adhesive material and different from the base adhesive material, the refractive index adjustment zone having an average refractive index greater than a refractive index of the base adhesive material, and wherein the base adhesive material zone of the adhesive layer is located on the side of the element substrate.

公开(公告)号：US20180134823A1

公开(公告)日：2018-05-17

申请号：US15571919

申请日：2016-05-02

Applicant: Nisshinbo Holdings Inc.

Inventor： Kazutoshi Hayakawa ,  Toshifumi Hashiba ,  Erina Matsuzaka

IPC: C08F20/14 ,  C09D11/107 ,  C09D133/12 ,  C09D7/40 ,  C09D7/65 ,  C09J133/12 ,  C08F12/08 ,  C09D11/108 ,  C09D125/14 ,  C09J125/14 ,  C09J11/08 ,  A61K8/81 ,  A61Q19/10 ,  A61K8/02 ,  A61Q1/00 ,  G02B5/02

CPC classification number: C08F20/14 ,  A61K8/0245 ,  A61K8/8152 ,  A61K2800/28 ,  A61K2800/41 ,  A61K2800/412 ,  A61K2800/60 ,  A61Q1/00 ,  A61Q1/02 ,  A61Q19/00 ,  A61Q19/10 ,  C08F2/22 ,  C08F2/30 ,  C08F12/08 ,  C08F120/14 ,  C08F212/08 ,  C08F220/14 ,  C08F2500/24 ,  C09D7/65 ,  C09D7/69 ,  C09D7/70 ,  C09D11/107 ,  C09D11/108 ,  C09D125/14 ,  C09D133/12 ,  C09D201/00 ,  C09J11/08 ,  C09J125/14 ,  C09J133/12 ,  C09J201/00 ,  G02B5/0242 ,  C08F2222/1013 ,  C08F2220/325 ,  C08F2/20 ,  C08F2220/281

Abstract: These flat elliptical polymer particles have a front view, a planar view, and a side view in a projection diagram based on third-angle projection which are all elliptical. The flat elliptical polymer particles satisfy (1)-(4): (1) the average length (LAV) of flat portions satisfies 0.13≤(LAV)≤500 μm; (2) the average breadth (DAV) of the flat portions satisfies 0.1≤(DAV)≤250 μm; (3) the average (P1AV) aspect ratio (L/D) calculated from the length (L) and the breadth (D) satisfies 1.3

公开(公告)号：US20180086945A1

公开(公告)日：2018-03-29

申请号：US15563074

申请日：2016-03-16

Applicant: NITTO DENKO CORPORATION

Inventor： Tomohito HARADA ,  Bojun CHEN

IPC: C09J7/02 ,  C09J109/08 ,  H01B7/00

CPC classification number: H01B7/0045 ,  C08K5/0016 ,  C08K5/098 ,  C09J7/245 ,  C09J109/08 ,  C09J201/00 ,  C09J2201/606 ,  C09J2201/622 ,  C09J2203/302 ,  C09J2205/106 ,  C09J2407/00 ,  C09J2409/00 ,  C09J2421/006 ,  C09J2427/006 ,  C09J2467/00 ,  C09J2471/00 ,  C09J2475/00 ,  C09J2483/00

Abstract: Provided is a polyvinyl chloride (PVC) adhesive tape less susceptible to cracking at low temperatures even with thin PVC film. The pressure-sensitive adhesive (PSA) tape provided by the present invention comprises a PVC film and a PSA layer placed on at least one face of the PVC film. The PSA tape shows a tensile elongation at break of 80% or higher at −20° C.

公开(公告)号：US20180051191A1

公开(公告)日：2018-02-22

申请号：US15552706

申请日：2016-07-11

Applicant: NITTO DENKO CORPORATION

Inventor： Hirofumi KATAMI ,  Atsushi YASUI

IPC: C09J7/02 ,  B32B7/12 ,  B32B7/02 ,  C08K3/22 ,  C03C27/10 ,  G06F3/041

CPC classification number: B32B7/12 ,  B32B7/02 ,  B32B27/00 ,  B32B2307/418 ,  C03C27/10 ,  C08K3/22 ,  C08K2201/002 ,  C09J7/10 ,  C09J201/00 ,  C09J2201/134 ,  C09J2201/606 ,  C09J2203/318 ,  C09J2205/102 ,  G02F2202/28 ,  G06F3/041

Abstract: The present invention provides a cover element having a pressure-sensitive adhesive sheet preliminarily laminated thereto, wherein the pressure-sensitive adhesive sheet comprises a pressure-sensitive adhesive layer in which a refractive index adjustment zone having a refractive index greater than that of a base pressure-sensitive adhesive material thereof is formed over a given range from a surface of the pressure-sensitive adhesive layer in a thickness direction thereof, whereby: in a lamination process of a customer which is a supply destination of the cover element, it becomes possible to eliminate a need to distinguish between obverse and reverse sides of the pressure-sensitive adhesive sheet itself; and, when the cover element is bonded to an optical element through the pressure-sensitive adhesive layer, it becomes possible to suppress internal reflection in a laminate formed of these optical elements.

公开(公告)号：US09895925B2

公开(公告)日：2018-02-20

申请号：US15316654

申请日：2015-06-18

Applicant: GINGAM JAPAN LTD.

Inventor： Shoji Nakajima

IPC: B44C1/18

CPC classification number: B44C1/18 ,  B32B7/12 ,  B32B17/063 ,  B32B25/14 ,  C09J201/00

Abstract: The present invention provides adhesion of a solid to an elastic member with a sufficient adhesive strength. The present invention, specifically, provides a product comprising an elastic member having at least 200% elongation and a solid adhered to the elastic member with a hot-melt adhesive. Specifically, according to the present invention, adhesion of an elastic member and a solid of excellent durability with adhesive force of 2.5×106 Pa or more, more preferably adhesive force of 2.7×106 Pa or more, even more preferably adhesive force of 3.0×106 Pa or more, and particularly preferably adhesive force of 3.5×106 Pa or more, is provided.

公开(公告)号：US09759286B1

公开(公告)日：2017-09-12

申请号：US15365923

申请日：2016-11-30

Applicant: NEWTONOID TECHNOLOGIES, L.L.C.

Inventor： Fielding B. Staton ,  David Strumpf

IPC: F16F7/00 ,  F16F15/02 ,  F16F15/00

CPC classification number: F16F15/022 ,  C09J201/00 ,  F16F1/3605 ,  F16F15/002 ,  F16F2224/02 ,  F16F2224/0283

Abstract: Adhesive damping systems are described. A damping system for reducing the effects on a substrate caused by a disruption in the substrate environment includes an adhesive having a plurality of three-dimensional nanoparticles dispersed therein. The nanoparticles are configured to provide a controlled response to an applied force field. The system further includes a sensor which measures an amplitude and frequency spectrum of the disruption. In a use configuration, the sensor determines the amplitude and frequency spectrum of the disruption received by the substrate; and the applied force field is dependent on the amplitude and frequency spectrum of the disruption.

公开(公告)号：US20170233610A1

公开(公告)日：2017-08-17

申请号：US15500355

申请日：2016-04-29

Applicant: LG CHEM, LTD.

Inventor： Hee Jung KIM ,  Se Ra KIM ,  Jung Hak KIM ,  Seung Hee NAM ,  Jung Ho JO ,  Kwang Joo LEE ,  Young Kook KIM

IPC: C09J7/00 ,  H01L23/00

CPC classification number: C09J7/00 ,  B32B7/06 ,  B32B7/12 ,  B32B15/08 ,  B32B15/082 ,  B32B15/085 ,  B32B15/09 ,  B32B27/06 ,  B32B27/08 ,  B32B27/16 ,  B32B27/18 ,  B32B27/20 ,  B32B27/24 ,  B32B27/26 ,  B32B27/281 ,  B32B27/285 ,  B32B27/286 ,  B32B27/288 ,  B32B27/302 ,  B32B27/304 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/38 ,  B32B27/42 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2270/00 ,  B32B2307/306 ,  B32B2307/50 ,  B32B2307/51 ,  B32B2307/558 ,  B32B2307/58 ,  B32B2307/732 ,  B32B2405/00 ,  B32B2457/14 ,  B32B2553/00 ,  C08L63/00 ,  C09D163/00 ,  C09J7/10 ,  C09J7/20 ,  C09J161/12 ,  C09J163/00 ,  C09J163/04 ,  C09J201/00 ,  C09J2201/162 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2423/006 ,  C09J2433/00 ,  C09J2433/006 ,  C09J2461/00 ,  C09J2463/00 ,  C09J2467/005 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/00 ,  H01L24/29 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2924/066 ,  H01L2924/0665 ,  H01L2924/20102 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2924/20642 ,  H01L2924/20643 ,  C08L33/08

Abstract: The present invention relates to an adhesive film for a semiconductor that can more easily bury unevenness such as through wires of a semiconductor substrate or a wire attached to a semiconductor chip and the like, and yet can be applied to various cutting methods without specific limitations to realize excellent cuttability, thus improving reliability and efficiency of a semiconductor packaging process.

公开(公告)号：US20170216860A1

公开(公告)日：2017-08-03

申请号：US15500747

申请日：2015-08-17

Applicant: William C. Stumphauzer

Inventor： William C. Stumphauzer

IPC: B05B7/16 ,  C09J7/02 ,  G05D23/19 ,  C09J11/06 ,  C08J9/10 ,  C09J201/00 ,  B05B7/00 ,  C09J9/00

CPC classification number: B05B7/168 ,  B05B7/0025 ,  B29B13/02 ,  B29B13/04 ,  B29C44/3484 ,  B29K2105/046 ,  C08J9/103 ,  C08J2400/12 ,  C09J7/35 ,  C09J9/00 ,  C09J11/06 ,  C09J201/00 ,  G05D23/1902 ,  G05D23/1917

Abstract: The present invention relates to self-foaming hot melt adhesive compositions and methods of making and using the same. Self-foaming hot melt adhesive compositions are formed by admixing a dispersion concentrate including a chemical blowing agent and a compatible carrier (liquid or molten) with a molten base hot melt adhesive composition at a temperature below the decomposition temperature of the chemical blowing agent. The resolidified material is processed through a device that heats the material above the decomposition temperature of the chemical agent and cools it below such temperature before being dispensed. The device preferably includes sensors and a controller configured to prevent the material from accumulating an adverse thermal history during processing.

公开(公告)号：US20170198175A1

公开(公告)日：2017-07-13

申请号：US15324006

申请日：2015-08-12

Applicant: MITSUBISHI PLASTICS, INC.

Inventor： Kahoru NIIMI ,  Makoto INENAGA

IPC: C09J11/06 ,  H01L33/50 ,  C09J7/02 ,  C09J133/08 ,  C09J151/00 ,  C09J5/06

CPC classification number: C09J11/06 ,  C08F290/04 ,  C08F290/046 ,  C08K5/0041 ,  C08K5/45 ,  C09J5/06 ,  C09J7/10 ,  C09J133/08 ,  C09J133/12 ,  C09J151/003 ,  C09J155/005 ,  C09J201/00 ,  C09J2205/102 ,  C09J2205/114 ,  C09J2205/31 ,  C09J2433/00 ,  C09J2451/00 ,  G02B5/208 ,  H01L33/502 ,  C08F2220/1825 ,  C08F220/06 ,  C08F220/14

Abstract: The present invention relates to a photocurable adhesive sheet. Provided is a new adhesive sheet that can be photocured even if there are places such as print-concealed sections that are difficult for light to reach, and even if the adhesive sheet has a certain degree of thickness, the entire sheet can be cured.Proposed is a transparent adhesive sheet formed from an adhesive composition containing: (A) a thermoplastic resin; (B) a crosslinking agent; (C) a photopolymerization initiator that reacts with light having a wavelength of at least 380 to 430 nm; and (D) a wavelength conversion agent that is excited by light having a wavelength shorter than 380 nm and that emits light having a wavelength of 380 to 550 nm. The transparent adhesive sheet is characterized by the adhesive sheet absorbance X at a wavelength of 390 nm and the adhesive sheet thickness Y satisfying relational formula (1). 0.5≦X/Y≦12  Formula (1):