Abstract:
A tape comprising: a first hot melt adhesive composition or plastic composition that provides weft strength to the tape; a second hot melt adhesive composition that includes a release agent; an encapsulated fibrous material layer, wherein the fibrous material is encapsulated by (i) the first hot melt adhesive composition or (ii) the second hot melt adhesive composition; and a pressure sensitive adhesive layer that defines an outer pressure sensitive adhesive surface of the tape; wherein the first hot melt adhesive composition or plastic composition is located between the second hot melt adhesive composition and the pressure sensitive adhesive layer.
Abstract:
Provided are a pressure-sensitive adhesive tape, a polishing pad, a method of manufacturing the same, a polishing device and a method of manufacturing a glass substrate. The illustrative pressure-sensitive adhesive tape may be a pressure-sensitive adhesive tape for a polishing material. The pressure-sensitive adhesive tape may be effectively fixed to a surface plate without bubbles, and have excellent resistance to water and a polishing solution and shear strength applied in a polishing process. In addition, the pressure-sensitive adhesive tape may be easily removed from a carrier or surface plate for a polishing pad without residues after polishing.
Abstract:
An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.
Abstract:
An adhesive tape comprising a core layer comprising a foam and having a first surface and a second surface opposite the first surface. The adhesive tape also comprises a first adhesive layer disposed about the first surface. And, the adhesive tape also comprises a second adhesive layer disposed about the second surface. At least one of the first and second adhesive layers comprises a radiation curable rubber based adhesive. The tapes are suitable for bonding an article to a target substrate having a low surface energy and for bonding under a variety of atmospheric conditions including at elevated temperatures.
Abstract:
A pressure-sensitive adhesive sheet used for integrally immobilizing an imprint mold to a pressure application unit in an imprint apparatus for transferring a profile of a fine pattern formed on the imprint mold to a transfer-receiving body by pressing the imprint mold having the fine pattern thereon against the transfer-receiving body, having a substrate, a pressure-sensitive adhesive layer (A) provided on one surface of the substrate and a pressure-sensitive adhesive layer (B) provided on the other surface of the substrate. The adhesive strength of the pressure-sensitive adhesive layer (B) at 23° C. is higher than the adhesive strength of the pressure-sensitive adhesive layer (A) at 23° C., the pressure-sensitive adhesive layer (A) has an adhesive strength of 1 to 10 N/25 mm at 23° C. and an adhesive strength of 1 to 30 N/25 mm after allowed to stand for 7 hours at 80° C. and a humidity of 65%, and the pressure-sensitive adhesive layer (B) has an adhesive strength of 3 to 30 N/25 mm at 23° C.
Abstract:
An adhesive film, and a product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable hot-melt adhesive layer including a curable resin and a moisture absorbent, and the curable hot-melt adhesive layer includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive layer.
Abstract:
Provided is a novel transparent adhesive sheet with which the cut edge is not sticky over time when a laminated body that has been bonded via the adhesive sheet is cut, which can be adhered without generating residual air bubbles, even when the surface of an adherend is uneven, and which can be adhered without foaming, even when the adherend is a material such as plastic that can generate outgas. Suggested is an adhesive sheet that has one or more layers of a first adhesive layer and one or more layer of a second adhesive layer that exhibit different viscoelastic behaviors, and has an integrated structure whereby these layers are laminated, with a dynamic shear storage modulus G′ of 2×104 to 5×105 Pa for G′(20° C.) and 1×104 to 1×105 Pa for G′(150° C.) when measured with a 1 Hz frequency temperature dispersion.
Abstract:
Layers of an item may be temporarily assembled using a tacky surface on an adhesive layer. The adhesive layer may be activated by the application of energy to cause it to partially or entirely melt to bond layers together. The tacky layer may permit layers to be moved after initial positioning if the positioning is not acceptable. A tacky layer may cover all or part of the surface of an adhesive layer to permit the adhesive to flow without hindrance when activated.
Abstract:
The composite microporour filter material comprises a base-cloth layer, an upper adhesion layer attached to a top side of the base-cloth layer, and a lower adhesion layer attached to a bottom side of the base-cloth layer. The base-cloth layer is made of either polymide yarn base-cloth, polysulfoneamide yarn base-cloth, or polytetrafluoroethylene filament base-cloth. The upper adhesion layer is made of a mixture of polysulfoneamide short-staple and polymide short-staple; the lower adhesion layer is made of a pure polysulfoneamide short-staple. The upper adhesion layer and the lower adhesion layer are attached to two sides of the base-cloth layer by entangling which is adopted by needle punching, spunlacing or a combination thereof. The present filter material is temperature-resistant and corrosion-resistant and has features of a low manufacturing cost and the high filter precision.
Abstract:
A rubber pad capable of repeated washing and peeling includes a substrate, made of a sheet of certain thickness and area and defined into a first and a second side surface. An inertia adhesive layer is incorporated onto the first side surface to form an inertia bonding surface. The inertia bonding surface can be repeatedly peeled-off without residual colloid, and the temperature resistance range is between −20° C. and 120° C. An adhesion layer; incorporated onto the second side surface is made of glue of high adhesive capacity to form an adhesion surface. The adhesion surface is adhered securely at one time without repeated peeling-off. At least a debonding layer is attached onto at least the adhesion surface or inertia bonding surface in a peeling-off state.