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公开(公告)号：US09983321B2
公开(公告)日：2018-05-29
申请号：US15258209
申请日：2016-09-07
Applicant: Nuctech Company Limited , TSINGHUA UNIVERSITY
Inventor： Qingjun Zhang , Yuanjing Li , Zhiqiang Chen , Ziran Zhao , Yinong Liu , Yaohong Liu , Xiang Zou , Huishao He , Shuwei Li , Jianping Chang , Wenjian Zhang
CPC classification number: G01T7/00 , G01J1/0271 , G01J2001/0276
Abstract: The invention discloses a safety inspection detector and a goods safety inspection system. The safety inspection detector at least comprises a circuit board, a first housing, a second housing, a detection module and a connecting interface. The detection module and the connecting interface are mounted on the circuit board. The first housing is pressed and connected to a first surface of the circuit board, and the second housing is pressed and connected to a second surface of the circuit board. The first housing and the second housing can hermetically wrap the detection module and electronic devices on the circuit board, but bypass the connecting interface to realize leading-out and connection with related interconnected cables by utilizing the connecting interface. The housings can be used for sealing and protecting sensitive electronic devices in the detector, thus being moisture proof and preventing interference.
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公开(公告)号：USD816518S1
公开(公告)日：2018-05-01
申请号：US29560076
申请日：2016-04-01
Applicant: View, Inc.
Designer： Stephen C. Brown , Alexander Rumer , Nilesh T. Desai
CPC classification number: G01J1/4228 , E06B9/24 , E06B2009/2464 , E06B2009/2476 , G01J1/0271 , G01J1/0474 , G01J1/44 , G01J2001/4266 , G01K1/14 , G02F1/163 , G02F2201/58
Abstract: Various implementations relate generally to a multi-sensor device. Some implementations more particularly relate to a multi-sensor device including a ring of radially-oriented photosensors. Some implementations more particularly relate to a multi-sensor device that is orientation-independent with respect to a central axis of the ring. Some implementations of the multi-sensor devices described herein also include one or more additional sensors. For example, some implementations include an axially-directed photosensor. Some implementations also can include one or more temperature sensors configured to sense an exterior temperature, for example, an ambient temperature of an outdoors environment around the multi-sensor. Additionally or alternatively, some implementations can include a temperature sensor configured to sense an interior temperature within the multi-sensor device. Particular implementations provide, characterize, or enable a compact form factor. Particular implementations provide, characterize, or enable a multi-sensor device requiring little or no wiring, and in some such instances, little or no invasion, perforation or reconstruction of a building or other structure on which the multi-sensor device is mounted.
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公开(公告)号：US20180113022A1
公开(公告)日：2018-04-26
申请号：US15298370
申请日：2016-10-20
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Tim Boescke , Christoph Goeltner
CPC classification number: G01J1/44 , G01J1/0204 , G01J1/0271 , G01J1/08 , H01L27/14618 , H01L27/14623 , H01L27/14629 , H01L27/14678
Abstract: An integrated circuit for sensor applications includes a plurality of photosensitive areas on a top side, capable of measuring incident light, thereby creating a signal, and a processing unit adapted to evaluate the signal measured by the photosensitive areas; and a sensor including 1) the integrated circuit, 2) a housing with a first cavity and a second cavity, and 3) a barrier located between the first cavity and the second cavity, wherein the integrated circuit is located within the first cavity, the top side of the integrated circuit faced upwardly, and a light source is located within the second cavity.
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公开(公告)号：US09952089B2
公开(公告)日：2018-04-24
申请号：US14536210
申请日：2014-11-07
Applicant: Lingsen Precision Industries, Ltd.
Inventor： Ming-Te Tu , Yu-Chang Huang
CPC classification number: G01J1/0271 , G01J1/0209 , G01J1/0233 , G01J1/42 , G01S7/4813 , G01S7/4815 , G01S17/026
Abstract: An optical sensing module includes a substrate, a cover, a plurality of light-emitting chips, a light-receiving chip, and a plurality of encapsulants. The cover is disposed on the substrate. A plurality of first chambers and a second chamber are formed between the cover and the substrate. The cover has a plurality of light-emitting holes communicating with the first chambers, respectively, and a light-receiving hole communicating with the second chamber. The light-emitting chips are disposed on the substrate and in the first chambers, respectively. The light-receiving chip is disposed on the substrate and in the second chamber. The encapsulants fill the first and second chambers and enclose the light-emitting chips and the light-receiving chip, respectively. Hence, characterized in that: the light-emitting chips and the light-receiving chip are disposed on the substrate, and the light-emitting chips emit light beams in different colors to enhance light emission efficiency.
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公开(公告)号：US09915560B2
公开(公告)日：2018-03-13
申请号：US14838017
申请日：2015-08-27
Applicant: Applied Optoelectronics, Inc.
Inventor： I-Lung Ho , Kai-Sheng Lin , Jun Zheng
CPC classification number: G01J1/0271 , G01J1/029 , G01J1/0403 , G02B6/29365 , G02B6/2938 , G02B6/4214 , G02B6/4246 , G02B6/4263 , G02B6/4284 , G02B6/4292 , G02B6/4295 , G02B6/43
Abstract: A multi-channel receiver optical subassembly (ROSA) including at least one sidewall receptacle configured to receive and electrically isolate an adjacent multi-channel transmitter optical subassembly (TOSA) is disclosed. The multi-channel ROSA includes a housing with at least first and second sidewalls, with the first sidewall being opposite the second sidewall and including at least one sidewall opening configured to fixedly attach to photodiode assemblies. The second sidewall includes at least one sidewall receptacle configured to receive at least a portion of an optical component package, such as a transistor outline (TO) can laser package, of an adjacent multi-channel TOSA, and provide electrical isolation between the ROSA housing and the TOSA within an optical transceiver. The sidewall receptacle can include non-conductive material in regions that directly or otherwise come into close proximity with the optical component package of the adjacent TOSA.
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Patent Agency Ranking
公开(公告)号：US20180066984A1
公开(公告)日：2018-03-08
申请号：US15810070
申请日：2017-11-12
Applicant: Jahangir S. Rastegar , Harbans Dhadwal , Thomas Spinelli
Inventor： Jahangir S. Rastegar , Harbans Dhadwal , Thomas Spinelli
CPC classification number: G01J1/429 , G01J1/0233 , G01J1/0271 , G01J1/0488 , G06T7/0012 , G06T7/90 , G06T2207/30088 , G06T2207/30196
Abstract: A device including: a processor being configured to: instruct an image sensor to capture first image data of a patch applied to a user's skin unprotected against an ultraviolent spectrum of radiation, the patch having a reflection coefficient in the ultraviolent spectrum; measure a first reflectance from the patch based on the reflection coefficient; determine a second reflectance from the unprotected skin adjacent to the patch based on the measured first reflectance; instruct the image sensor to capture second image data of the user's skin after application of a sunscreen; determine a third reflectance from the skin adjacent to the applied patch for the skin having the applied sunscreen based on the measured first reflectance; and determine a time extending factor for the applied sunscreen based on the second and third reflectance.
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公开(公告)号：US20180066981A1
公开(公告)日：2018-03-08
申请号：US15808051
申请日：2017-11-09
Applicant: ROHM CO., LTD.
Inventor： Toshikazu MUKAI , Jae-young KIM , Kazuisao TSURUDA
IPC: G01J1/02 , G01J1/06 , H01L31/02 , H01L31/0203 , H01L31/0232 , H01L31/0304 , H01L31/109 , H01L31/167
CPC classification number: G01J1/0271 , G01J1/0209 , G01J1/06 , G01J5/045 , H01L31/02005 , H01L31/0203 , H01L31/02325 , H01L31/03046 , H01L31/109 , H01L31/167 , H03B7/08 , H03B2200/0084
Abstract: The THz device module includes: a substrate; a THz device disposed on a front side surface of the substrate, and configured to oscillate or detect THz waves; a cap covering the THz device being separated from the THz device, and comprising an opening formed at a position opposite to the THz device in a vertical direction of the front side surface of the substrate; and a sealing member covering the opening of the cap so as to seal the THz device in conjunction with the substrate and the cap. A distance from the THz device to the sealing member is within a near-field pattern to which an electric field of the THz waves can be reached without interruption from a surface of the THz device to the sealing member. The THz device module efficiently emits or detects THz waves from the opening, thereby suppressing upsizing of the cap.
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公开(公告)号：US20180058920A1
公开(公告)日：2018-03-01
申请号：US15611266
申请日：2017-06-01
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor： Karine Saxod , Jean-Michel Riviere
CPC classification number: G01J1/0271 , G01J1/0403 , G01V8/10 , H01L25/167 , H01L31/0203 , H01L31/167 , H05K1/18 , H05K3/284 , H05K2201/10151 , H05K2201/10378
Abstract: A microchip has a rear face attached to a front mounting face of a support plate. An encapsulation cover for the microchip is mounted to the support plate. The encapsulation cover includes a front wall, a peripheral wall extending from the front wall and an inside partition extending from the front wall and between opposite sides of the peripheral wall. The inside partition passes locally above the microchip to delimit two cavities. A bonding material is interposed between encapsulation cover and the support plate and microchip. An end part of the inside partition of the cover, adjacent to the front face of the microchip, include an accumulation and containment recess that is configured to at least partly receive the bonding material.
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公开(公告)号：US20180039057A1
公开(公告)日：2018-02-08
申请号：US15520854
申请日：2015-10-22
Applicant: LEICA MICROSYSTEMS CMS GMBH
Inventor： Patric MRAWEK , Frank SCHREIBER , Roland SEIFERT
CPC classification number: G02B21/28 , G01J1/0252 , G01J1/0271 , G01J1/0403 , G01J1/0448 , G02B21/0032 , G02B21/008 , G02B21/0096
Abstract: A detector device is designed to capture light and to generate electrical signals. The detector device includes a housing and a detector disposed in the housing so as to be moveable at least partially in the housing and with respect to the housing. The detector device is useable in a detection system and/or in a microscope.
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公开(公告)号：US09885601B2
公开(公告)日：2018-02-06
申请号：US14964591
申请日：2015-12-10
Applicant: PixArt Imaging Inc.
Inventor： Hung-Yu Lai , Yu-Hsiang Huang , Hung-Ching Lai
CPC classification number: G01J1/0214 , G01J1/0271 , G01S7/4813 , G01S17/026
Abstract: An optical detecting device includes a light source, an optical detecting component, a package structure and a light tight component. The light source outputs a sampling signal to project onto an external object. The optical detecting component is disposed by the light source and has an interval relative to the light source. The optical detecting component receives the sampling signal reflected from the external object. The package structure covers the optical detecting component and the light source, and includes an illuminating surface unit and an incident surface unit respectively corresponding to the light source and the optical detecting component, and further includes an isolation component disposed between the illuminating surface unit and the emerging surface unit. The light tight component is disposed on the isolation component to obstruct transmission path of the sampling signal from the illuminating surface unit to the incident surface without reflection by the external object.
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