公开(公告)号：US20240175767A1

公开(公告)日：2024-05-30

申请号：US18285064

申请日：2022-04-13

Applicant: Nextiles, Inc.

Inventor： George Sun

IPC: G01L1/18 ,  D05C17/00

CPC classification number: G01L1/18 ,  D05C17/00 ,  D05D2209/00 ,  D05D2303/40

Abstract: A system of fabric-based devices designed as transistors with tri-state behavior that can measure any geometries on 2D and 3D surfaces. The devices are constructed from layers of conductive materials and flexible sheets that allow signals to selectively cross between layers. Multiple layers of conductive signals can be achieved by controlling the tension of the top and bottom thread, and interlayering conductive, semiconductive, insulating, and semi-porous materials around a sensing layer. The layers can be further modified to include folds and cuts that allow for 2D and 3D bending, stretching, twisting, and curves. Large sheets of devices can be organized into grid-like matrixes, with signal wires connected in a multiplexed fashion to minimize the amount of threads to simplify construction and device communication to a central processing unit.

公开(公告)号：US11953931B2

公开(公告)日：2024-04-09

申请号：US18107716

申请日：2023-02-09

Applicant: KSR IP Holdings, LLC

Inventor： Marty Vanek ,  James Hartford

IPC: G05G1/38 ,  G01D5/14 ,  G01L1/18 ,  G01L5/22 ,  G05G1/42 ,  G01L1/22 ,  G05G1/44 ,  G05G1/50 ,  G05G5/05

CPC classification number: G05G1/38 ,  G01D5/14 ,  G01L1/18 ,  G01L5/225 ,  G05G1/42 ,  G01L1/2206 ,  G05G1/44 ,  G05G1/50 ,  G05G5/05

Abstract: A pedal assembly includes a housing having a cavity. A pedal arm is at least partially received in the cavity. The pedal arm is configured to move within the cavity relative to the housing. At least two pivot levers are positioned within the cavity and configured to pivot upon a contact by the pedal arm. A spring retainer is formed in the housing. The spring retainer has a spring positioned therein. A spring member is disposed about the spring retainer and is moveable about the spring retainer. At least two sensors are attached to the spring housing. At least two sensor assemblies are positioned in the housing and configured to sense an amount of travel of the at least two sensors. When a load is applied to the pedal pad, the pedal arm contacts the at least two pivot members pivoting the pivot members and moving the spring housing wherein the sensors movement is sensed by the respective at least two sensor assemblies indicative of the amount of depression of the pedal pad.

公开(公告)号：US11920993B1

公开(公告)日：2024-03-05

申请号：US18025186

申请日：2022-05-12

Applicant: SOUTHEAST UNIVERSITY

Inventor： Aiguo Song ,  Jingjing Xu ,  Shuyan Yang ,  Baoguo Xu ,  Huijun Li ,  Ruqi Ma

IPC: G01L1/18 ,  G01L5/1627

CPC classification number: G01L1/18 ,  G01L5/1627

Abstract: A miniature combined multi-axis force sensor structure includes a sensor body, a first shell and a second shell, two horizontal main beams and two vertical main beams are arranged on the periphery of an inner round platform in a cross shape, tail ends of the horizontal main beams and the vertical main beams are each connected to a vertical floating beam, and the horizontal floating beams consist of two thin-walled cambered beams; two ends of the horizontal floating beam are each connected to an outer round platform by means of an annular platform; the sensor body is arranged between the first shell and the second shell; strain gauges are stuck on the horizontal main beams and the vertical main beams to form two Wheatstone bridges; and when force/torque acts on the cross beam, the sensor deforms, and the resistance value of strain gauge at corresponding position changes.

公开(公告)号：US11913851B2

公开(公告)日：2024-02-27

申请号：US17462519

申请日：2021-08-31

Applicant: Japan Display Inc.

Inventor： Takumi Sano ,  Shinichiro Oka

IPC: G01L9/08 ,  G01L1/16 ,  G01L1/18 ,  H10N30/30 ,  H10N30/857 ,  H10N30/87

CPC classification number: G01L9/08 ,  G01L1/16 ,  G01L1/18 ,  H10N30/302 ,  H10N30/857 ,  H10N30/87

Abstract: A pressure sensor includes an insulating base material, a switching element disposed on the insulating base material, a piezoelectric layer disposed on the insulating base material and the switching element and an underlying layer located between the piezoelectric layer and the insulating base material, and the modulus of elasticity of the underlying layer is greater than the modulus of elasticity of the piezoelectric layer.

公开(公告)号：US11898943B2

公开(公告)日：2024-02-13

申请号：US17562829

申请日：2021-12-27

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Santo Alessandro Smerzi

IPC: G01M5/00 ,  G01L1/18 ,  G01L5/162

CPC classification number: G01M5/0041 ,  G01L1/18 ,  G01L5/162

Abstract: A stress sensor includes: a substrate, having a face and a recess, open to the face; and a sensor chip of semiconductor material, housed in the recess and bonded to the substrate, the sensor chip being provided with a plurality of sensing components of piezoresistive material. The substrate has a thickness which is less by at least one order of magnitude with respect to a main dimension of the face. Further, the sensor chip has a thickness which is less by at least one order of magnitude with respect to the thickness of the substrate, and a Young's module of the substrate and a Young's module of the sensor chip are of the same order of magnitude.

公开(公告)号：US11898918B2

公开(公告)日：2024-02-13

申请号：US18103465

申请日：2023-01-30

Applicant: NextInput, Inc.

Inventor： Julius Minglin Tsai ,  Dan Benjamin

IPC: G01L1/22 ,  G01L1/16 ,  G01L1/18

CPC classification number: G01L1/2281 ,  G01L1/16 ,  G01L1/18

Abstract: MEMS force sensors for providing temperature coefficient of offset (TCO) compensation are described herein. An example MEMS force sensor can include a TCO compensation layer to minimize the TCO of the force sensor. The bottom side of the force sensor can be electrically and mechanically mounted on a package substrate while the TCO compensation layer is disposed on the top side of the sensor. It is shown the TCO can be reduced to zero with the appropriate combination of Young's modulus, thickness, and/or thermal coefficient of expansion (TCE) of the TCO compensation layer.

公开(公告)号：US11874185B2

公开(公告)日：2024-01-16

申请号：US16764992

申请日：2018-11-16

Applicant: NEXTINPUT, INC.

Inventor： Julius Minglin Tsai ,  Dan Benjamin

IPC: G01L1/18 ,  G01L1/16 ,  G01L1/26

CPC classification number: G01L1/18 ,  G01L1/16 ,  G01L1/26

Abstract: Described herein is a force attenuator for a force sensor. The force attenuator can linearly attenuate the force applied on the force sensor and therefore significantly extend the maximum sensing range of the force sensor. The area ratio of the force attenuator to the force sensor determines the maximum load available in a linear fashion.

公开(公告)号：US11852561B2

公开(公告)日：2023-12-26

申请号：US17733059

申请日：2022-04-29

Applicant: Tekscan, Inc.

Inventor： Robert M. Podoloff ,  Camilo Aladro ,  Michael Harty ,  Christopher George ,  Arnon Ofaim ,  Gary Loomis ,  Gabor Papp

IPC: G01M17/02 ,  G01L1/18 ,  B60C25/00 ,  G01L1/14 ,  G01L1/20

CPC classification number: G01M17/022 ,  B60C25/007 ,  G01L1/146 ,  G01L1/18 ,  G01L1/205

Abstract: Embodiments disclosed herein relate to a thin, light, and portable system for measuring one or more parameters of a contact patch between a tire and a surface. The system may be configured with an array of sensors capable of being removable fixed to the surface. The array of sensors may measure the one or more parameters of the contact patch between the tire and the surface. Moreover, the system may include a scanner configured to interpret the measurements from the array of sensors as data and store the data.

公开(公告)号：US11835403B2

公开(公告)日：2023-12-05

申请号：US17654428

申请日：2022-03-11

Applicant: MINEBEA MITSUMI Inc.

Inventor： Masayuki Suganumata

IPC: G01L1/18

CPC classification number: G01L1/18

Abstract: A strain inducing body includes a strain inducing portion including a movable portion that deforms in response to force or moment in a predetermined axial direction and a non-movable portion that does not deform in response to the force or moment, and an input transmitter that is connected to the non-movable portion and does not deform in response to the force or moment, wherein the input transmitter includes, a first frame portion, a plurality of first beam structures each of which has one end thereof connected to the first frame portion and extends from the first frame portion to an inside of the first frame portion, a first coupling portion that connects other ends of the first beam structures, an accommodating portion that is provided inside the first coupling portion and that is capable of housing a sensor chip to detect the force or the moment.

公开(公告)号：US11808650B2

公开(公告)日：2023-11-07

申请号：US17063147

申请日：2020-10-05

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani ,  Federico Giovanni Ziglioli ,  Bruno Murari

IPC: G01L5/00 ,  G01L1/18 ,  G01L1/20 ,  F16B31/02 ,  G01L5/24

CPC classification number: G01L5/0038 ,  F16B31/028 ,  G01L1/18 ,  G01L1/20 ,  G01L5/243

Abstract: A pressure sensing device may include a body configured to distribute a load applied between first and second parts positioned one against the other, and a pressure sensor carried by the body. The pressure sensor may include a support body, and an IC die mounted with the support body and defining a cavity. The IC die may include pressure sensing circuitry responsive to bending associated with the cavity, and an IC interface coupled to the pressure sensing circuitry.