Abstract:
An inertial sensor includes first and second movable elements suspended from a substrate and interconnected by a beam. The second movable element is positioned laterally adjacent to the first movable element, and each of the movable elements has a mass that is asymmetric relative to a rotational axis. A first spring system couples the first movable element to the substrate and a second spring system couples the second movable element to the substrate. The spring systems and the beam enable the movable elements to move together in response to force imposed upon the movable elements. In particular, the first and second movable elements can undergo in-plane torsion motion in response to force, such as acceleration, imposed in a sense direction. Additionally, damping structures may be integrated into the first and second movable elements to effectively increase a damping ratio of the device resulting from the in-plane torsion motion.
Abstract:
A physical quantity sensor includes: a substrate; a movable body including, with a first axis as a boundary, a first movable electrode portion disposed in a first region, a second movable electrode portion disposed in a second region, and a damping adjusting portion disposed in at least one of the first region and the second region; beam portions supporting the movable body; a first fixed electrode portion; and a second fixed electrode portion. A first through-hole is disposed in the damping adjusting portion. Second through-holes are disposed in the movable electrode portions. The area of a region where the first movable electrode portion overlaps with the first fixed electrode portion is the same as the area of a region where the second movable electrode portion overlaps with the second fixed electrode portion. The width of the first through-hole is greater than the widths of the second through-holes.
Abstract:
An inertial sensor includes a first sensor element, which is damped against vibrations from an interface of the inertial sensor by a damping element. The first sensor element is configured to detect a first measured variable in a first frequency band, and the damping element is configured to dampen vibrations at least in the first frequency band. The inertial sensor further includes a second sensor element, which is mechanically coupled to the interface. The second sensor element is configured to detect a second measured variable in a second frequency band.
Abstract:
The invention relates to an acceleration sensor, comprising a substrate having a substrate surface and a sample mass that is movable relative to the substrate in a first direction (x) parallel to the substrate surface. The sample mass has a comb-like electrode that is movable together with the sample mass and has a plurality of teeth, which extend in the first direction (x). The acceleration sensor further comprises a counter-electrode fixedly connected to the substrate, which counter-electrode has a fixed comb-like electrode and wherein said fixed comb-like electrode has a plurality of teeth which extend in a direction opposite to the first direction (x). The teeth of the movable comb-like electrode engage with the teeth of the fixed comb-like electrode. The acceleration sensor further comprises a shielding electrode fixedly connected to the substrate and which is suitable for increasing a pneumatic damping of the sample mass during a deflection movement of the sample mass.
Abstract:
A fiber optic sensor is provided. The fiber optic sensor includes: a fixed portion configured to be secured to a body of interest; a moveable portion; a spring member positioned at least partially between the fixed portion and the moveable portion; an optical fiber wound in contact with the fixed portion and the moveable portion such that the optical fiber spans at least a portion of the spring; and an elastomeric material provided in contact with at least one of the fixed portion, the moveable portion, the spring member, the body of interest, and the optical fiber.
Abstract:
A vibration damper for a sensor unit comprises an elastic damping element including a central plate, a plurality of damping fingers joined at a first end to the central plate, and a plurality of fastening surfaces. At least two fastening surfaces of the plurality of fastening surfaces are disposed at a distance from each other in a first spatial direction. The damping element is flexurally elastically soft along the first spatial direction and is formed with a higher stiffness in a main extension plane defined perpendicular to the first spatial direction. A layer of adhesive is applied to each of the at least two fastening surfaces which are configured to be subjected to shear stress as a result of vibrations in the main extension plane.
Abstract:
The present invention provides a capacitive acceleration sensor with a bending elastic beam and a preparation method. The sensor at least includes a first electrode structural layer, a middle structural layer and a second electrode structural layer; wherein the first electrode structural layer and the second electrode structural layer are provided with an electrode lead via-hole, respectively; the middle structural layer includes: a frame formed on a SOI silicon substrate with a double device layers, a seismic mass whose double sides are symmetrical and a bending elastic beam with one end connected to the frame and the other end connected to the seismic mass, wherein anti-overloading bumps and damping grooves are symmetrically provided on two sides of the seismic mass, and the bending elastic beams at different planes are staggered distributed and are not overlapped with each other in space. Since the bending times, the total length and the total width of the bending elastic beam can be prepared as needed, capacitive acceleration sensors with different sensitivities can be manufactured according to the present invention, and the manufacturing has high flexibility.
Abstract:
A micromechanical sensor is provided which includes a substrate having a main plane of extension and a rocker structure which is connected to the substrate via a torsion means. The torsion means extends primarily along a torsion axis, and the torsion axis is situated essentially in parallel to the main plane of extension of the substrate. The rocker structure is pivotable about the torsion axis from a neutral position into a deflected position, and the rocker structure has a mass distribution which is asymmetrical with respect to the torsion axis. The mass distribution is designed in such a way that a torsional motion of the rocker structure about the torsion axis is effected as a function of an inertial force which is oriented along a Z direction which is essentially perpendicular to the main plane of extension of the substrate.
Abstract:
A process for encapsulating a microelectronic device, comprising the following steps: make the microelectronic device on a first substrate; make one portion of a first material not permeable to the ambient atmosphere and permeable to a noble gas in a second substrate comprising a second material not permeable to the ambient atmosphere and the noble gas; secure the second substrate to the first substrate, forming at least one cavity inside which the microelectronic device is encapsulated such that said portion of the first material forms part of a wall of the cavity; inject the noble gas into the cavity through the portion of the first material; hermetically seal the cavity towards the ambient atmosphere and the noble gas.
Abstract:
A damping device for a micromechanical sensor device, having at least one first intermediate layer having at least two sections, a second section being situated around a first section, a lateral distance being provided between the first and the second section, and an elastic device being provided between the first section and the second section as an integral part of the first intermediate layer.