Abstract:
A physical properties measuring method includes: acquiring an experimental convergent beam electron diffraction image of a sample by using a transmission electron microscope; calculating Zernike moment intensities of the experimental convergent beam electron diffraction image; and comparing the Zernike moment intensities of the experimental convergent beam electron diffraction image with Zernike moment intensities of calculated convergent beam electron diffraction images calculated on changed physical properties of the sample.
Abstract:
The invention relates to a method and a device for measuring electron diffraction of a sample, including the steps of illuminating the sample with an incident electron beam which is deflected from a sample axis to hit the sample at an angle of incidence relative to the sample axis, at least partially subjecting the incident electron beam to diffraction by the sample, subjecting the diffracted and undiffracted electron beams transmitted through the sample to a partial deflection compensation, detecting the intensity of the diffracted and undiffracted electron beams transmitted through the sample in dependency on the angle of incidence and a scattering angle of the diffracted beam. The invention also relates to a computer program for controlling a transmission electron microscope for carrying out the inventive method.
Abstract:
In an electron beam interference system using an electron biprism, which is capable of independently controlling each of the interference fringe spacing s and the interference width W, both of which are important parameters for an interferometer and for an interferogram acquired by the interferometer, an optical system used in a two-stage electron biprism interferometer is adopted. The optical system uses two stages of electron biprisms in an optical axis direction to give the flexibility to the relative magnification relative to a specimen image and that relative to an image of a filament electrode of the electron biprism. In addition, as a two-stage configuration in which two objective lenses (51, 52) are combined, independently controlling the focal length of each objective lens makes it possible to set the relative magnification relative to a specimen image and that relative to an image of the filament electrode of the electron biprism at arbitrary values.
Abstract:
A double-biprism electron interferometer is an optical system which dramatically increases the degree of freedom of a conventional one-stage electron interferometer. The double biprism interferometer, however, is the same as the optical system of the single electron biprism in terms of the one-dimensional shape of an electron hologram formed by filament electrodes, the direction of an interference area, and the azimuth of the interference fringes. In other words, the longitudinal direction of the interference area is determined corresponding to the direction of the filament electrodes, and the azimuth of the interference fringes only coincides with and is in parallel with the longitudinal direction of the interference area. An interferometer according to the present invention has upper-stage and lower-stage electron biprisms, and operates with an azimuth angle Φ between filament electrodes of the upper-stage and lower-stage electron biprisms to arbitrarily control an interference area and an azimuth θ of the interference fringes formed therein.
Abstract:
The present invention provides a technique enabling to control fringe spacing s and an interference width W independently of each other, which are important parameters for an interferometer using an electron biprism. In the present invention, two electron biprisms 9u, 9b are used in two stages along the optical axis, and fringe spacing s and an interference width W are controlled independently of each other by controlling a voltage applied to an electrode of each of the electron biprisms. Also Fresnel diffraction can be suppressed.
Abstract:
An aberration-correcting microscopy instrument is provided. The instrument has a first magnetic deflector disposed for reception of a first non-dispersed electron diffraction pattern. The first magnetic deflector is also configured for projection of a first energy dispersed electron diffraction pattern in an exit plane of the first magnetic deflector. The instrument also has an electrostatic lens disposed in the exit plane of a first magnetic deflector, as well as a second magnetic deflector substantially identical to the first magnetic deflector. The second magnetic deflector is disposed for reception of the first energy dispersed electron diffraction pattern from the electrostatic lens. The second magnetic deflector is also configured for projection of a second non-dispersed electron diffraction pattern in a first exit plane of the second magnetic deflector. The instrument also has an electron mirror configured for correction of one or more aberrations in the second non-dispersed electron diffraction pattern. The electron mirror is disposed for reflection of the second non-dispersed electron diffraction pattern to the second magnetic deflector for projection of a second energy dispersed electron diffraction pattern in a second exit plane of the second magnetic deflector.
Abstract:
The invention relates to an energy filter image generator for filtering electrically charged particles. The inventive energy filter comprises at least two toroidal energy analysers (30, 40) arranged one inside the other. A transfer lens device (20) is disposed between the plane of emergence (5) of the first energy analyser (30) and the plane of incidence of the second energy analyser (40), thereby making it possible to obtain the perfect energy filtered reproduction of the surface (1′) of a sample on a detector (10).
Abstract:
The present invention relates to a method of testing, in the manufacturing process of an LSI (large scale integration) device, a result obtained by the manufacturing process, a testing apparatus therefor, and a semiconductor device suitable for the test. The present invention relates, in particular, to a testing method used to immediately and accurately perform a test of the cross-sectional microstructure of an LSI device obtained by the manufacturing process. The above testing method is characterized by including a sample production step of thinning a semiconductor chip such that the semiconductor chip includes a substrate crystal and a portion added by the manufacturing process, a step of irradiating an electron beam to the semiconductor chip, a step of detecting an electron beam transmitted through the semiconductor chip to thereby obtain an electron beam diffraction image, a step of removing an electron beam diffracted due to the substrate crystal, and a step of comparing, in the electron beam diffraction image, the thickness of grating stripes obtained from the substrate crystal with the thickness of the portion added by the manufacturing process.
Abstract:
An electron source particularly for a RHEED measurement system or a RHEED measurement system as such includes an electron emitter (5), a first deflection stage (6a, b) for radiating an electron beam onto a sample (1), and a second deflection stage between the first stage (6a, b) and the sample 1, preferably near the sample.
Abstract:
A scattering target constituting an electron spin analyzer is supported by a scattering target-holding member made of a conductive material from the outside of the space formed by an accelerating electrode and an electrode supporter. Then, the scattering target-holding member is supported in insulation by an insulation supporting member made of an insulating material. Moreover, a guiding member is provided so as to cover the periphery of the insulation supporting member for guiding the scattering target, the scattering target-holding member and the insulation supporting member.