公开(公告)号：US09867287B2

公开(公告)日：2018-01-09

申请号：US14793639

申请日：2015-07-07

Applicant: Elite Electronic Material (Zhong Shan) Co., Ltd.

Inventor： Changyuan Li ,  Chen-Yu Hsieh ,  Hao Chen ,  Lianhui Cai ,  Xiangnan Li

IPC: B41M5/00 ,  B32B15/08 ,  C07F9/48 ,  C07F9/53 ,  H05K1/03 ,  C08K5/5397 ,  C08K5/5313 ,  C08K5/54 ,  B32B5/00 ,  B32B15/00 ,  B32B27/00 ,  H05K1/02 ,  H05K3/46 ,  B32B5/02 ,  B32B15/14 ,  B32B15/20 ,  B32B27/12 ,  B32B27/20 ,  B32B27/30 ,  B32B27/32 ,  C08L1/00

CPC classification number: H05K1/0373 ,  B32B5/00 ,  B32B5/02 ,  B32B15/00 ,  B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  B32B27/00 ,  B32B27/12 ,  B32B27/20 ,  B32B27/302 ,  B32B27/32 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2264/10 ,  B32B2274/00 ,  B32B2307/204 ,  B32B2307/30 ,  B32B2307/3065 ,  B32B2457/08 ,  C08K5/5313 ,  C08K5/5397 ,  C08K5/5406 ,  C08L1/00 ,  H05K1/024 ,  H05K1/0326 ,  H05K3/4688 ,  H05K2201/012 ,  H05K2201/0195

Abstract: The invention belongs to the technical field of low dielectric resin compositions, and discloses a low dielectric resin composition with phosphorus-containing flame retardant and a prepreg, resin film, laminate and printed circuit board prepared therefrom. The composition comprises the following components: (A) phosphorus-containing flame retardant; (B) vinyl compound. The phosphorus-containing flame retardant has a structure as shown in formula (I). In the present invention, diphenylphosphine oxide is derivatized, and prepared a phosphorus-containing flame retardant, which has no reactive functional groups, has better dielectric properties, and has high melting point, and upon combining with a vinyl compound, a resin composition is obtained, and a laminate having low thermal expansion ratio, high heat resistance, high glass transition temperature, and low dielectric constant and dissipation factor, can be made from the resin composition, and can effectively achieve the flame resistance effect of UL94 V-0 without using halogen-containing flame retardant, and can be used in the preparation of prepregs, resin films, resin coated coppers, flexible resin coated coppers, laminates and printed circuit boards.

公开(公告)号：US20180002360A1

公开(公告)日：2018-01-04

申请号：US15600123

申请日：2017-05-19

Applicant: Guangdong Guangshan New Material Co., Ltd.

Inventor： Qingchong PAN

IPC: C07F9/6593 ,  C08J5/24 ,  C09K21/12

CPC classification number: C07F9/65815 ,  B32B15/00 ,  C08J5/24 ,  C08J2363/00 ,  C09K21/12 ,  H05K1/024 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2203/122

Abstract: The present invention relates to a phosphazene compound containing an ester group having a structure of formula (I). The present invention grafts ester groups to phosphazene compounds and makes terminal grafted hydroxyl and carboxyl groups reacted with polymer matrix, producing an improvement of flame retardancy and a reduction of dielectric constant at the same time when the phosphazene compound is introduced into polymer matrix. Since N and P atoms are directly bonded into the polymer matrix by a reaction rather than addition and combination means in the prior art, there is no reduced mechanical properties of the matrix due to the addition of flame retardants.

公开(公告)号：US09840620B2

公开(公告)日：2017-12-12

申请号：US15022154

申请日：2014-03-21

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Hu Yang ,  Yueshan He

IPC: C08L79/02 ,  B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B32B27/28 ,  C08G14/06 ,  C08L61/34 ,  C08J5/24 ,  C08L71/12 ,  H05K1/03 ,  H05K3/02

CPC classification number: C08L79/02 ,  B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B32B27/285 ,  B32B2264/102 ,  B32B2307/306 ,  B32B2307/3065 ,  C08G14/06 ,  C08J5/24 ,  C08J2371/12 ,  C08J2379/02 ,  C08J2425/10 ,  C08J2471/12 ,  C08K5/14 ,  C08K7/18 ,  C08L25/10 ,  C08L61/34 ,  C08L71/126 ,  C08L2201/02 ,  C08L2201/22 ,  C08L2205/03 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/012

Abstract: Disclosed are a halogen-free resin composition, and a prepreg and a laminate prepared by using the same. The halogen-free resin composition comprises the following components according to organic solid matters by weight parts: (A) 40-80 parts by weight of allyl modified benzoxazine resin; (B) 10-20 parts by weight of hydrocarbon resin; (C) 10-40 parts by weight of allyl modified polyphenylene oxide resin; (D) 0.01-3 parts by weight of initiating agent; (E) 10-100 parts by weight of filler; and (F) 0-80 parts by weight of phosphoric flame retardant. The prepreg and the laminate prepared by using the halogen-free resin composition have lower dielectric constant and lower dielectric loss tangent value, higher peeling strength, higher glass transition temperature, excellent heat resistance and good flame retardant effect.

公开(公告)号：US09730320B2

公开(公告)日：2017-08-08

申请号：US13882126

申请日：2011-10-27

Applicant: Takashi Matsuda ,  Kiyotaka Komori ,  Akiyoshi Nozue ,  Takayuki Suzue ,  Mitsuyoshi Nishino ,  Toshiyuki Asahi ,  Naoyuki Tani ,  Yoshito Kitagawa

Inventor： Takashi Matsuda ,  Kiyotaka Komori ,  Akiyoshi Nozue ,  Takayuki Suzue ,  Mitsuyoshi Nishino ,  Toshiyuki Asahi ,  Naoyuki Tani ,  Yoshito Kitagawa

IPC: H05K1/03 ,  C08J5/24 ,  C08K3/00 ,  C08K3/22

CPC classification number: H05K1/038 ,  C08J5/24 ,  C08K3/013 ,  C08K3/22 ,  C08K2003/2217 ,  C08K2003/2227 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10T442/20 ,  Y10T442/3415 ,  Y10T442/3472 ,  Y10T442/656 ,  Y10T442/659

Abstract: A laminate with superior thermal conductivity, heat resistance, drill workability, and fire retardancy is provided. In a prepreg obtained by impregnating a woven or nonwoven fabric base with a thermosetting resin composition, the thermosetting resin composition contains 80 to 200 parts by volume of an inorganic filler per 100 parts by volume of a thermosetting resin, the inorganic filler contains (A) gibbsite type aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 μm and (B) magnesium oxide having an average particle diameter (D50) of 0.5 to 15 μm, and a compounding ratio (volume ratio) of the gibbsite type aluminum hydroxide particles (A) to the magnesium oxide (B) is 1:0.3 to 3.

公开(公告)号：US09708468B2

公开(公告)日：2017-07-18

申请号：US14775691

申请日：2014-10-23

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yuki Kitai ,  Hiroaki Fujiwara ,  Hirosuke Saito

IPC: C08K5/521 ,  C08J5/24 ,  C08K3/34 ,  C08L63/00 ,  C08L101/00 ,  C08K5/49 ,  H05K1/03 ,  B32B15/14 ,  C08K3/36 ,  C08K5/5399 ,  C08G59/40

CPC classification number: C08K5/521 ,  B32B15/14 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2457/08 ,  C08G59/4014 ,  C08J5/24 ,  C08J2300/24 ,  C08J2371/12 ,  C08K3/34 ,  C08K3/36 ,  C08K5/49 ,  C08K5/5399 ,  C08K2201/014 ,  C08L63/00 ,  C08L71/126 ,  C08L79/04 ,  C08L101/00 ,  H05K1/036 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209

Abstract: A thermosetting resin composition contains a thermosetting resin, a hardener capable of reacting with the thermosetting resin, and a flame retardant. The flame retardant contains a first phosphor compound compatible with a mixture of the thermosetting resin and the hardener, and a second phosphor compound incompatible with the mixture.

公开(公告)号：US20170137391A1

公开(公告)日：2017-05-18

申请号：US15322946

申请日：2015-06-30

Applicant: KOLON INDUSTRIES, INC.

Inventor： Hee Jin CHO ,  Do Kyung SUNG ,  Ki Hyun PARK ,  Sang Hun PARK ,  Hyun Soo KAGN

IPC: C07D265/14 ,  C08G61/12

CPC classification number: C07D265/14 ,  C08G61/122 ,  C08G2261/135 ,  C08G2261/1644 ,  C08G2261/60 ,  C08G2261/65 ,  C08G2261/76 ,  H05K1/0346 ,  H05K2201/012

Abstract: Disclosed is a polybenzoxazime precursor and a method of preparing the same. The polybenzoxazime precursor is used to prepare a hardened material having improved thermal characteristics, having high thermal and flame-retardant characteristics while maintaining its excellent electrical characteristics, or having high thermal and electrical characteristics, thus being available for use in a copper clad laminate, a semiconductor encapsulate, a printed circuit board, an adhesive, a paint, and a mold.

公开(公告)号：US20170073501A1

公开(公告)日：2017-03-16

申请号：US15358353

申请日：2016-11-22

Applicant: Chemtura Corporation

Inventor： Larry D. Timberlake ,  Mark V. Hanson

IPC: C08K5/5317 ,  C08J5/12 ,  B32B27/38 ,  B32B5/10 ,  B32B27/06 ,  C08J5/24 ,  C08L63/00

CPC classification number: C08K5/5317 ,  B32B5/10 ,  B32B27/06 ,  B32B27/38 ,  B32B2262/101 ,  B32B2307/3065 ,  B32B2363/00 ,  B32B2457/00 ,  B32B2457/08 ,  C08J5/10 ,  C08J5/124 ,  C08J5/24 ,  C08J2363/00 ,  C08J2463/00 ,  C08K5/0066 ,  C08L63/00 ,  C08L2201/02 ,  C08L2203/20 ,  H05K1/0373 ,  H05K3/4626 ,  H05K2201/012 ,  H05K2203/1147 ,  C08K5/5333

Abstract: Resin compositions, e.g., epoxy resin compositions, comprising flame retardant materials obtained by heating phosphonic acid salts at temperatures above 200° C., have excellent properties and exhibit manageable curing behavior. Laminates, composites, molded articles and the like, which have excellent flame retardant properties and physical characteristics, are readily prepared from the resin compositions of the invention.

Abstract translation: 树脂组合物，例如环氧树脂组合物，其包含通过在高于200℃的温度下加热膦酸盐而获得的阻燃材料，具有优异的性能并显示出可控的固化行为。 由本发明的树脂组合物容易地制备具有优异的阻燃性能和物理特性的层压材料，复合材料，模塑制品等。

公开(公告)号：US09587118B2

公开(公告)日：2017-03-07

申请号：US14710216

申请日：2015-05-12

Applicant: GM Global Technology Operations LLC

Inventor： Herman K. Phlegm ,  Mahmoud H. Abd Elhamid ,  Edgar P. Calderon ,  Sami A. Syed

IPC: C09D5/18 ,  H05K3/28

CPC classification number: C09D5/185 ,  H05K3/284 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/10181

Abstract: A coated electronic device that is fire resistant includes an electronic component and an intumescent layer disposed over the electronic component. The intumescent layer includes sodium silicate having formula Na2SiO3, pentaerythitol, a resin that is cross-linked by melamine, boron nitride particles, and triammonium phosphate.

Abstract translation: 耐火涂层的电子设备包括电子部件和布置在电子部件上的膨胀层。 膨胀层包括具有式Na2SiO3的硅酸钠，季戊四醇，通过三聚氰胺交联的树脂，氮化硼颗粒和磷酸三铵。

公开(公告)号：US09574070B2

公开(公告)日：2017-02-21

申请号：US14731008

申请日：2015-06-04

Applicant: Elite Electronic Material (KunShan) Co., Ltd.

Inventor： Rongtao Wang ,  Chen-Yu Hsieh ,  Wenfeng Lv ,  Wenjun Tian ,  Yu Gao ,  Ningning Jia ,  Ziqian Ma

IPC: C08K5/5397 ,  C08J5/24 ,  C08K5/14 ,  C08J5/18 ,  H05K1/03

CPC classification number: C08K5/5397 ,  C08J5/18 ,  C08J5/24 ,  C08J2325/08 ,  C08K5/14 ,  H05K1/0326 ,  H05K2201/012

Abstract: A low dissipation factor resin composition comprises the following components: (A) an aromatic tetrafunctional vinylbenzyl monomer, its prepolymer or a combination thereof, the aromatic tetrafunctional vinylbenzyl monomer having a structure shown below; (B) flame retardant; and (C) peroxide. The resin composition is applicable to laminates and printed circuit boards featuring low dissipation factor at high frequency and thermal resistance and thermal expansion meeting the demands.

Abstract translation: 低耗散因子树脂组合物包含以下组分：（A）芳族四官能乙烯基苄基单体，其预聚物或其组合，具有如下结构的芳族四官能乙烯基苄基单体; （B）阻燃剂; 和（C）过氧化物。

公开(公告)号：US09512329B2

公开(公告)日：2016-12-06

申请号：US14119342

申请日：2012-05-23

Applicant: Takeshi Nobukuni ,  Yoshihiro Kato ,  Meguru Ito ,  Tomoki Hamajima

Inventor： Takeshi Nobukuni ,  Yoshihiro Kato ,  Meguru Ito ,  Tomoki Hamajima

IPC: B32B15/092 ,  B32B27/04 ,  B32B27/20 ,  B32B27/26 ,  B32B27/38 ,  C08L63/00 ,  C08G59/24 ,  C08G59/32 ,  C08G59/38 ,  C08G59/40 ,  C08K3/22 ,  C08K3/26 ,  C08K3/28 ,  C08K3/34 ,  C08K3/36 ,  C08K3/38 ,  C08K5/5415 ,  C09D163/00 ,  C08J5/24 ,  H05K1/03

CPC classification number: C09D163/00 ,  C08G59/245 ,  C08G59/38 ,  C08G59/4014 ,  C08J5/24 ,  C08J2363/00 ,  C08J2479/04 ,  C08J2483/04 ,  C08L63/00 ,  H05K1/0353 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0212 ,  Y10T428/31529 ,  Y10T442/2008 ,  Y10T442/2951 ,  C08L79/04 ,  C08L83/04

Abstract: A resin composition contains a cyanate ester compound, a maleimide compound, an epoxy resin, a silicone rubber powder, and an inorganic filler. The cyanate ester compound contains a compound represented by the following formula. The silicone rubber powder is contained in an amount of 40 to 150 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin. The inorganic filler is contained in an amount of 100 to 340 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin. A total content of the silicone rubber powder and the inorganic filler is 140 to 380 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin.

Abstract translation: 提供了具有优异的耐热性，阻燃性和成型性，并且能够特别提供具有低热膨胀系数的树脂固化产物的树脂组合物。 根据本发明的树脂组合物含有氰酸酯化合物（A），马来酰亚胺化合物（B），环氧树脂（C），硅橡胶粉末（D）和无机填料（E）。 氰酸酯化合物（A）含有下式（I）表示的化合物。 相对于氰酸酯化合物（A），马来酰亚胺化合物（B）和环氧树脂（C）总计100质量份，硅橡胶粉末（D）的含量为40〜150质量份， 。 相对于氰酸酯化合物（A），马来酰亚胺化合物（B）和环氧树脂（C）的总计100质量份，无机填料（E）的含量为100〜340质量份。 相对于氰酸酯化合物（A），马来酰亚胺化合物（B）和马来酰亚胺化合物（B）的总量为100质量份，硅橡胶粉末（D）和无机填料（E）的总含量为140〜380质量份 环氧树脂（C）。 （其中R表示氢原子或甲基，n表示1以上的整数）