公开(公告)号：US07078819B2

公开(公告)日：2006-07-18

申请号：US09854269

申请日：2001-05-11

Applicant: Thomas H. DiStefano

Inventor： Thomas H. DiStefano

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/81 ,  H01L21/561 ,  H01L21/563 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/49805 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/742 ,  H01L24/94 ,  H01L2224/02319 ,  H01L2224/02333 ,  H01L2224/0401 ,  H01L2224/11003 ,  H01L2224/1184 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/274 ,  H01L2224/29101 ,  H01L2224/29298 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/18301 ,  H05K3/3436 ,  H05K3/363 ,  H05K2201/0215 ,  H05K2201/0248 ,  H05K2201/09427 ,  H05K2201/10977 ,  H05K2203/0465 ,  H05K2203/074 ,  H05K2203/306 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: A soldered assembly for a microelectronic element includes a microelectronic element, solder columns extending from a surface of the microelectronic element and terminals connected to distal ends of the columns. The assembly can be handled and mounted using conventional surface-mount techniques, but provides thermal fatigue resistance. The solder columns may be inclined relative to the chip surface, and may contain long, columnar inclusions preferentially oriented along the lengthwise axes of the columns.

Abstract translation: 用于微电子元件的焊接组件包括微电子元件，从微电子元件的表面延伸的焊料柱和连接到柱的远端的端子。 组件可以使用传统的表面贴装技术进行处理和安装，但提供耐热疲劳性能。 焊料柱可以相对于芯片表面倾斜，并且可以包含沿着柱的纵向轴线优先取向的长的柱状夹杂物。

公开(公告)号：US06800537B2

公开(公告)日：2004-10-05

申请号：US10342969

申请日：2003-01-15

Applicant: Belgacem Haba

Inventor： Belgacem Haba

IPC: H01L2130

CPC classification number: H01L21/568 ,  B29C70/62 ,  B29C70/882 ,  G02F1/1339 ,  H01L21/6835 ,  H01L23/49827 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/27438 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29499 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K3/323 ,  H05K3/368 ,  H05K3/4623 ,  H05K2201/0133 ,  H05K2201/0248 ,  H05K2201/083 ,  H05K2201/09536 ,  H05K2203/104 ,  H05K2203/105 ,  H01L2924/00

Abstract: A layer of an anisotropic material has a pair of substantially flat oppositely-directed major faces, a vertical direction extending between the faces and horizontal directions transverse to the vertical direction, the layer including a dielectric material and a plurality of conductive particles in the dielectric material. The particles are distributed non-uniformly in the horizontal directions so as to provide areas of high particle concentration interspersed with areas of low particle concentration.

Abstract translation: 各向异性材料层具有一对基本平坦的相反方向的主面，垂直方向在横向于垂直方向的面和水平方向之间延伸，所述层包括电介质材料和电介质材料中的多个导电颗粒 。 颗粒在水平方向上不均匀地分布，以提供散布有低颗粒浓度区域的高颗粒浓度的区域。

公开(公告)号：US20040109974A1

公开(公告)日：2004-06-10

申请号：US10696075

申请日：2003-10-28

Inventor： George Hsieh ,  Terrance J. Dishongh ,  Norman J. Armendariz ,  David V. Spaulding

IPC: B32B003/02

CPC classification number: H05K3/321 ,  H05K2201/0248 ,  H05K2201/083 ,  H05K2201/10636 ,  H05K2203/104 ,  Y02P70/611 ,  Y10T428/2852 ,  Y10T428/2896 ,  Y10T428/32

Abstract: Coupling components to an underlying substrate using a composition of a polymer and magnetic material particles. Upon applying the composition between the component and the printed circuit board, the composition may be subjected to a magnetic field to align the magnetic material particles into a conductive path between the component and the underlying substrate. At the same time the polymer-based material may be cured or otherwise solidified to affix the conductive path formed by the magnetic material particles.

公开(公告)号：US06696906B1

公开(公告)日：2004-02-24

申请号：US09870839

申请日：2001-05-30

Applicant: James J. deBlanc ,  David Dickey ,  Andrew Michael Cherniski

Inventor： James J. deBlanc ,  David Dickey ,  Andrew Michael Cherniski

IPC: H01P308

CPC classification number: H01P3/085 ,  H05K1/024 ,  H05K2201/0248 ,  H05K2201/0278 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49135 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A circuit board or microelectronic device in which conductive signal lines are suspended or supported by filaments in air, rather than surrounded by a solid dielectric material. Dry air has a low relative permittivity and extremely low loss tangent compared with common dielectric substrates in which signal lines are currently embedded within circuit boards and microelectronic devices. The signal intensity attenuation for filament-suspended or filament-supported signal lines is much lower than signal lines embedded in solid dielectric materials, allowing for transmission of significantly higher frequency signals within filament-suspended and filament-supported signal lines.

Abstract translation: 电路板或微电子器件，其中导电信号线由细丝悬挂或支撑在空气中，而不是被固体电介质材料包围。 与其中信号线当前嵌入电路板和微电子器件的普通介质基板相比，干燥空气具有低的相对介电常数和极低的损耗角正切。 长丝悬挂或灯丝支撑的信号线的信号强度衰减比嵌入固体电介质材料的信号线要低得多，允许在灯丝悬挂和灯丝支持的信号线中传输明显更高的频率信号。

公开(公告)号：US20020056890A1

公开(公告)日：2002-05-16

申请号：US10039710

申请日：2002-01-04

Applicant: International Business Machines Corporation

Inventor： Gerald G. Advocate JR. ,  Francis J. Downes JR. ,  Luis J. Matienzo ,  Ronald A. Kaschak ,  John S. Kresge ,  Daniel C. Van Hart

IPC: H01L029/93

CPC classification number: H01L23/5226 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/0035 ,  H05K3/027 ,  H05K3/06 ,  H05K3/383 ,  H05K3/421 ,  H05K3/4644 ,  H05K2201/0248 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2203/0307 ,  H05K2203/0353 ,  H01L2924/00

Abstract: An electronic structure including a metallic interlocking structure for bonding a conductive plated layer to metal surface, and a method of forming the electronic structure. The method provides a substrate having a metallic sheet within a dielectric layer. The metallic sheet includes a metal such as copper. An opening in the substrate, such as a blind via, is formed by laser drilling through the dielectric layer and partially through the metallic sheet. If the opening is a blind via, then the laser drilling is within an outer ring of the blind via cross section using a laser beam having a target diameter between about 20% and about 150% of a radius of the blind via cross section. A surface at the bottom of the opening, called a nullblind surface,null includes a metallic protrusion formed by the laser drilling, such that the metallic protrusion is integral with a portion of the blind surface. The metallic protrusion includes the metal of the metallic sheet and at least one constituent element from the dielectric layer. The metallic protrusion is then etched to form a metallic interlocking structure that is integral with the portion of the blind surface. The metallic interlocking structure includes discrete metallic fibers, with each metallic fiber having a curved (or curled) geometry. Each metallic fiber has its own unique composition that includes the metal, at least one constituent element of the dielectric layer, or both.

公开(公告)号：US06335222B1

公开(公告)日：2002-01-01

申请号：US09157047

申请日：1998-09-18

Applicant: Thomas H. DiStefano

Inventor： Thomas H. DiStefano

IPC: H01L2144

CPC classification number: H01L24/81 ,  H01L21/561 ,  H01L21/563 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/49805 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/742 ,  H01L24/94 ,  H01L2224/02319 ,  H01L2224/02333 ,  H01L2224/0401 ,  H01L2224/11003 ,  H01L2224/1184 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/274 ,  H01L2224/29101 ,  H01L2224/29298 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/18301 ,  H05K3/3436 ,  H05K3/363 ,  H05K2201/0215 ,  H05K2201/0248 ,  H05K2201/09427 ,  H05K2201/10977 ,  H05K2203/0465 ,  H05K2203/074 ,  H05K2203/306 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: A soldered assembly such as a packaged semiconductor chip includes elongated solder columns connected to the pads on the chip and a dielectric sheet having pads connected to the distal ends of the solder columns remote from the chip. Terminals on the sheet are connected to the pads of the sheet. The assembly can be handled and mounted using conventional surface-mount techniques, but provides thermal fatigue resistance. The solder columns may be inclined relative to the chip surface, and may contain long, columnar inclusions preferentially oriented along the lengthwise axes of the columns.

Abstract translation: 诸如封装半导体芯片的焊接组件包括连接到芯片上的焊盘的细长焊料柱和具有连接到远离芯片的焊料柱的远端的焊盘的电介质片。 纸张上的端子连接到纸张的垫。 组件可以使用传统的表面贴装技术进行处理和安装，但提供耐热疲劳性能。 焊料柱可以相对于芯片表面倾斜，并且可以包含沿着柱的纵向轴线优先取向的长的柱状夹杂物。

公开(公告)号：US06197149B1

公开(公告)日：2001-03-06

申请号：US09057522

申请日：1998-04-09

Applicant: Kazuhito Kobayashi ,  Yasushi Kumashiro ,  Atsushi Takahashi ,  Koji Morita ,  Takahiro Tanabe ,  Kazunori Yamamoto ,  Akishi Nakaso ,  Shigeharu Arike ,  Kazuhisa Otsuka ,  Naoyuki Urasaki ,  Daisuke Fujimoto ,  Nozomu Takano

Inventor： Kazuhito Kobayashi ,  Yasushi Kumashiro ,  Atsushi Takahashi ,  Koji Morita ,  Takahiro Tanabe ,  Kazunori Yamamoto ,  Akishi Nakaso ,  Shigeharu Arike ,  Kazuhisa Otsuka ,  Naoyuki Urasaki ,  Daisuke Fujimoto ,  Nozomu Takano

IPC: C09J500

CPC classification number: H05K3/4655 ,  C09D5/00 ,  H05K1/0373 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0248 ,  H05K2201/0355 ,  H05K2201/0358 ,  Y10T428/24994 ,  Y10T428/249944 ,  Y10T428/249946 ,  Y10T428/249952

Abstract: An insulating varnish comprising a resin component, electrical insulating whiskers, and if necessary, one or more additives such as an ion adsorbent, and/or an organic reagent for preventing injury from copper, produced by adding the additives to the resin component and the whiskers, or filtering the whiskers, or milled by using a beads mill or a three-roll mill, or the like, is excellent for producing a multilayer printed circuit board having high wiring density, high reliability and excellent other electrical properties.

Abstract translation: 一种绝缘漆，其包括树脂组分，电绝缘晶须，并且如果需要，可以使用一种或多种添加剂，例如离子吸附剂和/或用于防止铜损伤的有机试剂，其通过将添加剂添加到树脂组分和晶须 或过滤晶须，或通过使用珠磨机或三辊研磨机等进行研磨，对于制造具有高布线密度，高可靠性和优异的其它电性能的多层印刷电路板是优异的。

公开(公告)号：US5169471A

公开(公告)日：1992-12-08

申请号：US737224

申请日：1991-07-29

Applicant: Gene W. Strasser

Inventor： Gene W. Strasser

IPC: B29C35/08 ,  B29C70/62 ,  B29C70/88 ,  H05K1/00 ,  H05K1/03 ,  H05K3/28 ,  H05K3/32

CPC classification number: H05K3/32 ,  B29C35/08 ,  B29C70/62 ,  B29C70/882 ,  H05K1/0293 ,  H05K1/0373 ,  B29C2035/0822 ,  B29K2995/0005 ,  H05K2201/0129 ,  H05K2201/0215 ,  H05K2201/0248 ,  H05K2201/1059 ,  H05K2201/10689 ,  H05K2203/104 ,  H05K2203/1105 ,  H05K2203/173 ,  H05K3/281 ,  Y10S428/90 ,  Y10S428/901 ,  Y10T156/1057 ,  Y10T428/24331 ,  Y10T428/24909

Abstract: A circuit board for automatically interconnecting electrical components mounted on the circuit board, comprising of a nonconducting emulsion layer sandwiched between two nonconducting outer layers. Electrical leads from electronic components are inserted through holes in one outer layer. Dispersed within the emulsion layer are conducting particles with an elongated length. The emulsion layer's melting temperature is lower than the outer layers allowing movement of the conducting particles when the temperature of the emulsion layer is above the melting temperature, and prevents movement when the temperature is below. Included with the circuit board is an electromagnetic and infrared (EIR) assembly positioned near the outer layer opposite the layer with the electronic components. The EIR assembly has an infrared source and two magnetic field generating devices. One produces a magnetic field parallel to the emulsion layer forcing the conducting particles to line up parallel to the emulsion layer. The elongated length is sufficient so each parallel positioned conducting particle comes into contact with any neighboring parallel positioned particle, thus forming a conducting path. The other produces a magnetic field perpendicular to the emulsion layer forcing the conducting particles to line up perpendicular, electrically isolating the conducting particles from any neighboring particles. Moving the EIR assembly across the circuit board generating the parallel magnetic field forms a conducting path, or generating the perpendicular magnetic field erases any conducting paths. The infrared source is used to raise the temperature of the emulsion layer.

Abstract translation: 一种用于自动地连接安装在电路板上的电气部件的电路板，包括夹在两个不导电外层之间的不导电乳剂层。 电子元件的电线穿过一个外层的孔。 分散在乳剂层内的是具有细长长度的导电颗粒。 当乳剂层的温度高于熔融温度时，乳剂层的熔融温度低于允许导电颗粒移动的外层，并且当温度低于时防止移动。 包括在电路板中的电磁和红外（EIR）组件位于与电子部件相对的外层附近。 EIR组件具有红外源和两个磁场产生装置。 产生平行于乳剂层的磁场，迫使导电颗粒平行于乳剂层排列。 细长的长度是足够的，因此每个平行定位的导电粒子与任何相邻的平行定位的粒子接触，从而形成导电路径。 另一个产生垂直于乳剂层的磁场，迫使导电颗粒垂直排列，将导电颗粒与任何相邻颗粒电隔离。 将EIR组件移动穿过生成并联磁场的电路板形成导电路径，或者产生垂直磁场，擦除任何导电路径。 红外源用于提高乳剂层的温度。

公开(公告)号：US4170677A

公开(公告)日：1979-10-09

申请号：US852113

申请日：1977-11-16

Applicant: Edward T. Hutcheson

Inventor： Edward T. Hutcheson

IPC: H01L21/50 ,  H01L21/60 ,  H01L23/482 ,  H05K3/32

CPC classification number: H01L24/31 ,  H01L21/50 ,  H01L23/4828 ,  H01L24/28 ,  H01L24/83 ,  H05K3/323 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/3011 ,  H05K2201/0248 ,  H05K2201/083 ,  H05K2203/104 ,  H05K2203/105 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T428/23914 ,  Y10T428/24174 ,  Y10T428/24182 ,  Y10T428/249921

Abstract: A method of making electrical connections between large-scale integrated cuit boards or the like using a plastic adhesive charged with conductive particles. The method includes the steps of: coating one board with the adhesive, placing another board on the adhesive coating, applying a field to make the conductive whiskers align perpendicular to the boards, and hardening the adhesive while the field is applied. The field may be electric or magnetic, depending on whether the whiskers are paramagnetic or ferromagnetic.

Abstract translation: 使用填充有导电粒子的塑料粘合剂在大型集成电路板等之间进行电连接的方法。 该方法包括以下步骤：用粘合剂涂覆一个板，将另一个板放置在粘合剂涂层上，施加场以使导电晶须垂直于板对准，并且在施加场时使粘合剂硬化。 该领域可以是电的或磁性的，这取决于晶须是顺磁性的还是铁磁性的。

公开(公告)号：US20170062373A1

公开(公告)日：2017-03-02

申请号：US15351992

申请日：2016-11-15

Applicant: FUJITSU LIMITED

Inventor： Kozo Shimizu ,  Seiki Sakuyama

IPC: H01L23/00 ,  H01L25/00 ,  H01L25/065

CPC classification number: H01L24/17 ,  B23K1/0008 ,  B23K1/0016 ,  B23K3/085 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/40 ,  B23K2101/42 ,  H01L23/145 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05082 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/13016 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/1601 ,  H01L2224/16145 ,  H01L2224/16157 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/16505 ,  H01L2224/16507 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/75253 ,  H01L2224/75501 ,  H01L2224/75502 ,  H01L2224/759 ,  H01L2224/81005 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81411 ,  H01L2224/81815 ,  H01L2224/81948 ,  H01L2224/81986 ,  H01L2225/06513 ,  H01L2924/014 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1579 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/16747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3512 ,  H01L2924/35121 ,  H05K1/0203 ,  H05K1/09 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0248 ,  H05K2201/09972 ,  H05K2201/1056 ,  H05K2203/1121 ,  H05K2203/304 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/00

Abstract: An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.