公开(公告)号：US12101878B2

公开(公告)日：2024-09-24

申请号：US17906214

申请日：2021-03-12

Applicant: LG INNOTEK CO., LTD.

Inventor： Dong Hwa Lee ,  Yong Suk Kim

IPC: H05K1/03 ,  H05K1/02 ,  H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/46

CPC classification number: H05K1/0366 ,  H05K1/0373 ,  H05K1/056 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/0275 ,  H05K2201/068 ,  H05K2201/096 ,  H05K2201/09827

Abstract: A circuit board according to an embodiments includes an insulating portion comprising a plurality of insulating layers, wherein the insulating portion includes: a first insulating portion; a second insulating portion disposed on the first insulating portion and having a coefficient of thermal expansion corresponding to the first insulating portion; and a third insulating portion disposed under the first insulating portion and having a coefficient of thermal expansion corresponding to the first insulating portion; wherein the first insulating portion includes a prepreg including glass fibers, and wherein the second and third insulating portions include a resin coated copper (RCC) with a coefficient of thermal expansion in the range of 10 to 65 (10−6 m/m·k).

公开(公告)号：US11864314B2

公开(公告)日：2024-01-02

申请号：US17417506

申请日：2019-12-18

Applicant: KURARAY CO., LTD. ,  OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY

Inventor： Kohei Hayashi ,  Soichi Obata ,  Yasuhiro Shirotani ,  Masashi Nitani ,  Mayumi Uno ,  Kazuki Maeda

IPC: H05K1/03 ,  D06M10/00 ,  D06M23/16 ,  H05K3/28 ,  H05K3/46

CPC classification number: H05K1/038 ,  D06M10/001 ,  D06M23/16 ,  H05K3/28 ,  H05K3/4644 ,  H05K2201/0275

Abstract: The present invention relates to a patterned fiber substrate comprising: a fiber substrate; and a pattern consisting of a functional material and formed on the fiber substrate, wherein at least a part of the functional material that constitutes the pattern is present in inside of the fiber substrate, the fiber substrate has a contact angle of 100 to 170° with pure water on its surface, and the pattern has a narrowest line width of 1 to 3000 μm.

公开(公告)号：US09817499B2

公开(公告)日：2017-11-14

申请号：US15144850

申请日：2016-05-03

Applicant: Hitachi Chemical Company, Ltd.

Inventor： Hiroshi Yamazaki ,  Yoshimi Igarashi

IPC: G06F3/041 ,  H05K1/09 ,  H05K3/06 ,  G06F3/044 ,  G03F7/027 ,  G03F7/09 ,  G03F7/095 ,  G03F7/20 ,  G03F7/00 ,  H05K1/03 ,  H05K1/02

CPC classification number: G06F3/041 ,  G03F7/0005 ,  G03F7/027 ,  G03F7/09 ,  G03F7/092 ,  G03F7/095 ,  G03F7/0952 ,  G03F7/0955 ,  G03F7/2022 ,  G06F3/044 ,  G06F2203/04112 ,  H05K1/0274 ,  H05K1/0313 ,  H05K1/036 ,  H05K1/09 ,  H05K3/06 ,  H05K2201/0275 ,  Y10T428/24802

Abstract: A conductive pattern formation method of the present invention includes a first exposure step of radiating active light in a patterned manner to a photosensitive layer including a photosensitive resin layer provided on a substrate and a conductive film provided on a surface of the photosensitive resin layer on a side opposite to the substrate; a second exposure step of radiating active light, in the presence of oxygen, to some or all of the portions of the photosensitive layer not exposed at least in the first exposure step; and a development step of developing the photosensitive layer to form a conductive pattern following the second exposure step.

公开(公告)号：US09795030B2

公开(公告)日：2017-10-17

申请号：US15468333

申请日：2017-03-24

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Hiroharu Inoue ,  Koji Kishino

IPC: H05K1/00 ,  B32B7/02 ,  H05K1/03 ,  H05K3/02

CPC classification number: H05K1/036 ,  B32B5/022 ,  B32B5/024 ,  B32B7/02 ,  B32B15/12 ,  B32B15/14 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/0276 ,  B32B2262/10 ,  B32B2307/30 ,  B32B2307/306 ,  B32B2457/08 ,  H05K1/00 ,  H05K3/022 ,  H05K3/025 ,  H05K2201/0212 ,  H05K2201/0275 ,  H05K2201/029 ,  H05K2201/068 ,  Y10T428/24942

Abstract: A metal-clad laminate according to the present embodiment includes an insulating layer, and a metal layer present on at least one surface side of the insulating layer. The insulating layer is a laminate of at least three layers of a center layer, a first resin layer present on one surface side of the center layer, and a second resin layer present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a resin composition. Coefficients of thermal expansion of the cured products of the resin compositions contained in the first resin layer and the second resin layer are smaller than a coefficient of thermal expansion of the cured product of the resin composition contained in the center layer.

公开(公告)号：US09661749B2

公开(公告)日：2017-05-23

申请号：US14364914

申请日：2012-11-29

Applicant: Panasonic Corporation

Inventor： Hiroharu Inoue ,  Koji Kishino

IPC: H05K1/00 ,  B32B7/02 ,  H05K1/03 ,  H05K3/02 ,  B32B5/02 ,  B32B15/12 ,  B32B15/14

CPC classification number: H05K1/036 ,  B32B5/022 ,  B32B5/024 ,  B32B7/02 ,  B32B15/12 ,  B32B15/14 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/0276 ,  B32B2262/10 ,  B32B2307/30 ,  B32B2307/306 ,  B32B2457/08 ,  H05K1/00 ,  H05K3/022 ,  H05K3/025 ,  H05K2201/0212 ,  H05K2201/0275 ,  H05K2201/029 ,  H05K2201/068 ,  Y10T428/24942

Abstract: A metal-clad laminate according to the present embodiment includes an insulating layer, and a metal layer present on at least one surface side of the insulating layer. The insulating layer is a laminate of at least three layers of a center layer, a first resin layer present on one surface side of the center layer, and a second resin layer present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a resin composition. Coefficients of thermal expansion of the cured products of the resin compositions contained in the first resin layer and the second resin layer are smaller than a coefficient of thermal expansion of the cured product of the resin composition contained in the center layer.

公开(公告)号：US09420685B2

公开(公告)日：2016-08-16

申请号：US14444583

申请日：2014-07-28

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Jean-Michel Riviere ,  Karine Saxod

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K3/28 ,  H01L23/498 ,  H01L23/00

CPC classification number: H05K1/0271 ,  H01L23/49844 ,  H01L23/562 ,  H01L24/16 ,  H01L2224/131 ,  H01L2224/16111 ,  H01L2224/16237 ,  H05K1/181 ,  H05K3/28 ,  H05K3/30 ,  H05K2201/0275 ,  H05K2201/09909 ,  H05K2201/10007 ,  H05K2201/2009 ,  Y10T29/4913 ,  H01L2924/014

Abstract: A substrate board includes an electrical connection network on a face thereof. An integrated-circuit chip is mounted to the face of the substrate board in electrical contact with the electrical connection network. A local reinforcing or balancing layer made of a non-metallic material is mounted to the face of the substrate board in at least one local zone free of the face which is free of metal portions of the electrical connection network.

Abstract translation: 基板包括在其表面上的电连接网络。 集成电路芯片安装到与电连接网络电接触的基板的表面。 由非金属材料制成的局部增强或平衡层在至少一个不具有电连接网络的金属部分的表面的局部区域中安装到基板的表面上。

公开(公告)号：US20150271919A1

公开(公告)日：2015-09-24

申请号：US14732817

申请日：2015-06-08

Applicant: Hitachi Chemical Company, Ltd.

Inventor： Hiroshi Yamazaki ,  Yoshimi lgarashi

IPC: H05K1/03 ,  G03F7/09 ,  H05K3/06

CPC classification number: G06F3/041 ,  G03F7/0005 ,  G03F7/027 ,  G03F7/09 ,  G03F7/092 ,  G03F7/095 ,  G03F7/0952 ,  G03F7/0955 ,  G03F7/2022 ,  G06F3/044 ,  G06F2203/04112 ,  H05K1/0274 ,  H05K1/0313 ,  H05K1/036 ,  H05K1/09 ,  H05K3/06 ,  H05K2201/0275 ,  Y10T428/24802

Abstract: A conductive pattern formation method of the present invention includes a first exposure step of radiating active light in a patterned manner to a photosensitive layer including a photosensitive resin layer provided on a substrate and a conductive film provided on a surface of the photosensitive resin layer on a side opposite to the substrate; a second exposure step of radiating active light, in the presence of oxygen, to some or all of the portions of the photosensitive layer not exposed at least in the first exposure step; and a development step of developing the photosensitive layer to form a conductive pattern following the second exposure ste

Abstract translation: 本发明的导电图案形成方法包括：第一曝光步骤，以图案化方式将有源光照射到设置在基板上的感光性树脂层的感光层和设置在感光性树脂层的表面上的导电膜上 一侧与基板相对; 至少在第一曝光步骤中，在存在氧气的情况下将活性光辐射到感光层的部分或全部未暴露的第二曝光步骤; 以及显影步骤，在第二次曝光之后显影感光层以形成导电图案

公开(公告)号：US20150091177A1

公开(公告)日：2015-04-02

申请号：US14142719

申请日：2013-12-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chang Seob Hong ,  Eun Jung Jo ,  Kyu Hwan Oh ,  Kang Hyun Lee

IPC: H01L23/482 ,  H01L23/00

CPC classification number: H01L23/482 ,  H01L23/295 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/29 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/81447 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/1531 ,  H01L2924/181 ,  H01L2924/19106 ,  H05K1/0366 ,  H05K1/141 ,  H05K3/181 ,  H05K2201/0275 ,  H05K2201/049 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Disclosed herein are an external connection terminal part, a semiconductor package having the external connection terminal part, and a method for manufacturing the same. According to a preferred embodiment of the present invention, the external connection terminal part includes an insulating material and metal plating pattern formed on both surfaces of the insulating material.

Abstract translation: 这里公开了一种外部连接端子部件，具有外部连接端子部件的半导体封装件及其制造方法。 根据本发明的优选实施例，外部连接端子部分包括形成在绝缘材料的两个表面上的绝缘材料和金属电镀图案。

公开(公告)号：US11787732B2

公开(公告)日：2023-10-17

申请号：US16600769

申请日：2019-10-14

Applicant: Electric Glass Fiber America, LLC

Inventor： Hong Li

IPC: C03C13/00 ,  C03C3/093 ,  C03C3/118 ,  C03C13/06 ,  C03C3/091 ,  H05K1/03

CPC classification number: C03C13/00 ,  C03C3/091 ,  C03C3/093 ,  C03C3/118 ,  C03C13/06 ,  H05K1/0306 ,  C03C2213/00 ,  H05K2201/0275

Abstract: New glass compositions and applications thereof are disclosed. A glass composition as described herein can include 50 to 55 weight percent SiO2, 17 to 26 weight percent B2O3, 13 to 19 weight percent Al2O3, 0 to 8.5 weight percent MgO, 0 to 7.5 weight percent ZnO, 0 to 6 weight percent CaO, 0 to 1.5 weight percent Li2O, 0 to 1.5 weight percent F2, 0 to 1 weight percent Na2O, 0 to 1 weight percent Fe2O3, 0 to 1 weight percent TiO2, and 0 to 8 weight percent of other constituents. Also described herein are glass fibers formed from such compositions, composites, and articles of manufacture comprising the glass compositions and/or glass fibers.

公开(公告)号：US20160246394A1

公开(公告)日：2016-08-25

申请号：US15144850

申请日：2016-05-03

Applicant: Hitachi Chemical Company, Ltd.

Inventor： Hiroshi Yamazaki ,  Yoshimi Igarashi

IPC: G06F3/041 ,  H05K1/09 ,  H05K1/02 ,  H05K1/03

CPC classification number: G06F3/041 ,  G03F7/0005 ,  G03F7/027 ,  G03F7/09 ,  G03F7/092 ,  G03F7/095 ,  G03F7/0952 ,  G03F7/0955 ,  G03F7/2022 ,  G06F3/044 ,  G06F2203/04112 ,  H05K1/0274 ,  H05K1/0313 ,  H05K1/036 ,  H05K1/09 ,  H05K3/06 ,  H05K2201/0275 ,  Y10T428/24802

Abstract: A conductive pattern formation method of the present invention includes a first exposure step of radiating active light in a patterned manner to a photosensitive layer including a photosensitive resin layer provided on a substrate and a conductive film provided on a surface of the photosensitive resin layer on a side opposite to the substrate; a second exposure step of radiating active light, in the presence of oxygen, to some or all of the portions of the photosensitive layer not exposed at least in the first exposure step; and a development step of developing the photosensitive layer to form a conductive pattern following the second exposure step.

Abstract translation: 本发明的导电图案形成方法包括：第一曝光步骤，以图案化方式将有源光照射到设置在基板上的感光性树脂层的感光层和设置在感光性树脂层的表面上的导电膜上 一侧与基板相对; 至少在第一曝光步骤中，在存在氧气的情况下将活性光辐射到感光层的部分或全部未暴露的第二曝光步骤; 以及在第二曝光步骤之后使感光层显影以形成导电图案的显影步骤。