公开(公告)号：US20240032209A1

公开(公告)日：2024-01-25

申请号：US18036798

申请日：2021-11-16

Applicant: Resonac Corporation

Inventor： Chihiro HAYASHI ,  Minoru KAKITANI ,  Takao TANIGAWA ,  Ryuji AKEBI ,  Naoyoshi SATO ,  Akira HORIE

IPC: H05K3/46 ,  C08L39/04 ,  H05K3/12 ,  H05K1/03 ,  H01L23/498

CPC classification number: H05K3/4652 ,  C08L39/04 ,  H05K3/1283 ,  H05K1/0353 ,  H01L23/49822 ,  C08L2203/20 ,  H05K2203/068 ,  H05K2201/10007

Abstract: Provided are a maleimide resin composition containing (A) one or more selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a derivative thereof, (B) a modified conjugated diene polymer, and (C) a thermoplastic elastomer other than the above component (B), wherein the component (B) is one resulting from modification of (b1) a conjugated diene polymer having a vinyl group in the side chain with (b2) a maleimide compound having two or more N-substituted maleimide groups; and a prepreg, a resin film, a laminated board, a printed wiring board and a semiconductor package, each using the maleimide resin composition.

公开(公告)号：US10015886B2

公开(公告)日：2018-07-03

申请号：US14891108

申请日：2014-04-29

Applicant: GIESECKE & DEVRIENT GMBH

Inventor： Thomas Tarantino

IPC: G06K19/06 ,  H05K1/18 ,  G06K19/077 ,  H05K3/00 ,  H05K3/10 ,  H05K3/14 ,  H05K3/20 ,  H05K3/32

CPC classification number: H05K1/186 ,  G06K19/07718 ,  G06K19/07722 ,  G06K19/07732 ,  G06K19/07747 ,  H05K3/0014 ,  H05K3/0052 ,  H05K3/10 ,  H05K3/14 ,  H05K3/202 ,  H05K3/32 ,  H05K2201/10007 ,  H05K2201/10128 ,  H05K2201/10151 ,  H05K2203/033

Abstract: A method for producing a portable data carrier includes a spatial structure printed on a first foil. Electroconductive lines are applied first, and components are subsequently inserted in the structure, wherein the structure corresponds to the dimensions or the shape and size of the inserted components. The components are electroconductively connected to the lines therein. A cover is printed over the components. A second foil can be applied to the cover, wherein a design print can be applied to both foils. A gap can be incorporated in the structure and the foils, in order to insert a chip module.

公开(公告)号：US20160203910A1

公开(公告)日：2016-07-14

申请号：US15076856

申请日：2016-03-22

Applicant: Elwha LLC

Inventor： Jeffrey A. Bowers ,  Alistair K. Chan ,  Geoffrey F. Deane ,  Roderick A. Hyde ,  Nathan Kundtz ,  Nathan P. Myhrvold ,  David R. Smith ,  Lowell L. Wood,, JR.

IPC: H01G4/008 ,  H05K1/09 ,  B32B9/00 ,  H05K1/18 ,  B32B5/18 ,  H05K1/02 ,  H05K1/03

CPC classification number: H01G4/008 ,  B32B5/18 ,  B32B9/007 ,  B32B37/14 ,  B32B2266/04 ,  B32B2266/057 ,  B32B2266/126 ,  B32B2307/202 ,  B32B2457/08 ,  B82Y30/00 ,  H01G4/002 ,  H01G4/005 ,  H01L27/12 ,  H01L29/1606 ,  H01L29/78603 ,  H05K1/02 ,  H05K1/0274 ,  H05K1/0306 ,  H05K1/032 ,  H05K1/09 ,  H05K1/097 ,  H05K1/181 ,  H05K3/00 ,  H05K2201/0323 ,  H05K2201/10007 ,  H05K2201/10121 ,  Y10S977/734 ,  Y10T29/49128 ,  Y10T29/49826 ,  Y10T156/10 ,  Y10T428/24331 ,  Y10T428/24777 ,  Y10T428/24996 ,  Y10T428/249981 ,  Y10T428/24999 ,  Y10T428/30

Abstract: An apparatus having reduced phononic coupling between a graphene monolayer and a substrate is provided. The apparatus includes an aerogel substrate and a monolayer of graphene coupled to the aerogel substrate.

公开(公告)号：US20160197400A1

公开(公告)日：2016-07-07

申请号：US14591120

申请日：2015-01-07

Applicant: DELPHI TECHNOLOGIES, INC.

Inventor： DAVID W. ZIMMERMAN ,  JAMES F. SEARCY ,  CHARLES I. DELHEIMER

IPC: H01Q1/50 ,  H05K1/02

CPC classification number: H01Q1/50 ,  H01L23/66 ,  H01L2223/6683 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L2924/0002 ,  H01P5/028 ,  H01Q21/065 ,  H05K1/02 ,  H05K1/0243 ,  H05K1/141 ,  H05K1/184 ,  H05K3/368 ,  H05K2201/041 ,  H05K2201/10007 ,  H05K2201/10098 ,  H05K2203/049

Abstract: A circuit board assembly includes a low-frequency (LF) substrate, a monolithic microwave integrated circuit (MMIC), electrical components, a high-frequency (HF) substrate, and an antenna. The LF substrate is formed of FR-4 type material. The LF substrate defines a waveguide through the LF substrate. The MMIC is attached to the top-side of the LF substrate and outputs the radio-frequency signal. The electrical components are electrically attached to the LF substrate. The HF substrate is soldered to the top side of the LF substrate. An opening through the HF substrate surrounds the MMIC. A vertical transition guides the radio-frequency signal output by the MMIC to the waveguide. A plurality of wire bonds electrically connects the MMIC to the HF substrate and couple the radio-frequency signal from the MMIC to the vertical transition. The antenna is attached to the LF substrate and configured to radiate the radio-frequency signal from the waveguide.

Abstract translation: 电路板组件包括低频（LF）衬底，单片微波集成电路（MMIC），电气部件，高频（HF）衬底和天线。 LF基板由FR-4型材料形成。 LF衬底限定通过LF衬底的波导。 MMIC连接到LF基板的顶侧，并输出射频信号。 电气部件电连接到LF基板。 将HF衬底焊接到LF衬底的顶侧。 通过HF衬底的开口围绕MMIC。 垂直转换将MMIC输出的射频信号引导到波导。 多个引线键合将MMIC电连接到HF衬底，并将来自MMIC的射频信号耦合到垂直转换。 天线连接到LF衬底并且被配置为辐射来自波导的射频信号。

公开(公告)号：US20160037640A1

公开(公告)日：2016-02-04

申请号：US14883792

申请日：2015-10-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kiyofumi TAKAI ,  Hidenori OBIYA ,  Shinya HITOMI

IPC: H05K1/14 ,  H05K1/11 ,  H01L23/29 ,  H01L23/498 ,  H01L23/31 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/147 ,  H01L23/12 ,  H01L23/13 ,  H01L23/24 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/552 ,  H01L23/66 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/16227 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/1631 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/18 ,  H05K2201/042 ,  H05K2201/10007 ,  H05K2201/10053 ,  H05K2201/10098 ,  H05K2201/1053 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012

Abstract: In a method for mounting a filter circuit component to obtain desired frequency characteristics of the filter circuit component without receiving the influence of a parasitic inductance and a parasitic capacitance, and to increase the packing density of components, since the ground terminal of the filter circuit component connected to the mounting electrode is connected to the ground electrode through the via conductors at the shortest distance, the occurrence of an unnecessary parasitic inductance and an unnecessary parasitic capacitance is prevented. The filter circuit component is mounted on the high-frequency component to obtain the desired frequency characteristics of the filter circuit component without the influence of a parasitic inductance and a parasitic capacitance. Since the component is located in a space surrounded by the inner peripheral surface of the supporting frame body, the packing density of components is increased.

Abstract translation: 在用于安装滤波器电路部件以获得滤波器电路部件的期望频率特性而不接收到寄生电感和寄生电容的影响的方法中，并且为了增加部件的封装密度，由于滤波电路部件的接地端子 连接到安装电极的电极通过通孔导体以最短距离连接到接地电极，防止了不必要的寄生电感和不必要的寄生电容的发生。 滤波器电路组件安装在高频分量上，以获得滤波器电路组件的期望频率特性，而不受寄生电感和寄生电容的影响。 由于部件位于由支撑框体的内周面包围的空间内，所以部件的堆积密度增加。

公开(公告)号：US20140376156A1

公开(公告)日：2014-12-25

申请号：US14479984

申请日：2014-09-08

Applicant: Elwha LLC

Inventor： Alistair K. Chan ,  Geoffrey F. Deane ,  Roderick A. Hyde ,  Jeffrey A. Bowers ,  Nathan Kundtz ,  Nathan P. Myhrvold ,  David R. Smith ,  Lowell L. Wood,, Jr.

IPC: H01G4/008 ,  H01L27/12 ,  H05K1/09 ,  H01L29/16

CPC classification number: H01G4/008 ,  B32B5/18 ,  B32B9/007 ,  B32B37/14 ,  B32B2266/04 ,  B32B2266/057 ,  B32B2266/126 ,  B32B2307/202 ,  B32B2457/08 ,  B82Y30/00 ,  H01G4/002 ,  H01G4/005 ,  H01L27/12 ,  H01L29/1606 ,  H01L29/78603 ,  H05K1/02 ,  H05K1/0274 ,  H05K1/0306 ,  H05K1/032 ,  H05K1/09 ,  H05K1/097 ,  H05K1/181 ,  H05K3/00 ,  H05K2201/0323 ,  H05K2201/10007 ,  H05K2201/10121 ,  Y10S977/734 ,  Y10T29/49128 ,  Y10T29/49826 ,  Y10T156/10 ,  Y10T428/24331 ,  Y10T428/24777 ,  Y10T428/24996 ,  Y10T428/249981 ,  Y10T428/24999 ,  Y10T428/30

Abstract: An apparatus having reduced phononic coupling between a graphene monolayer and a substrate is provided. The apparatus includes an aerogel substrate and a monolayer of graphene coupled to the aerogel substrate.

Abstract translation: 提供了一种在石墨烯单层和基底之间具有减小的声子耦合的装置。 该装置包括气凝胶基底和耦合到气凝胶基底的单层石墨烯。

公开(公告)号：US08867217B2

公开(公告)日：2014-10-21

申请号：US12696829

申请日：2010-01-29

Applicant: Francis Steffen ,  Gilbert Assaud

Inventor： Francis Steffen ,  Gilbert Assaud

IPC: H05K1/00 ,  B41J2/175 ,  G06K19/073 ,  G06K19/077

CPC classification number: H05K1/028 ,  B41J2/1753 ,  B41J2/17546 ,  B41J2/17559 ,  G06K19/0739 ,  G06K19/07798 ,  H05K1/0283 ,  H05K1/0313 ,  H05K1/118 ,  H05K1/181 ,  H05K3/20 ,  H05K3/30 ,  H05K2201/10007 ,  Y10T29/49128 ,  Y10T29/4913

Abstract: A circuit including a flexible substrate and at least one electric element attached to the substrate, the substrate including at least one cavity arranged near the electric element and helping to break or distort the electric element in response to a flexion or stretching of the substrate. Application in particular is to the manufacture of tear-proof electronic micromodules.

Abstract translation: 一种电路，包括柔性基板和至少一个附着到基板的电气元件，所述基板包括布置在所述电气元件附近的至少一个空腔，并且有助于响应于所述基板的弯曲或拉伸来破坏或变形所述电气元件。 尤其适用于制造防撕裂电子微型模块。

公开(公告)号：US08593783B2

公开(公告)日：2013-11-26

申请号：US13398561

申请日：2012-02-16

Applicant: Jeffrey A. Bowers ,  Alistair K. Chan ,  Geoffrey F. Deane ,  Roderick A. Hyde ,  Nathan Kundtz ,  Nathan P. Myhrvold ,  David R. Smith ,  Lowell L. Wood, Jr.

Inventor： Jeffrey A. Bowers ,  Alistair K. Chan ,  Geoffrey F. Deane ,  Roderick A. Hyde ,  Nathan Kundtz ,  Nathan P. Myhrvold ,  David R. Smith ,  Lowell L. Wood, Jr.

IPC: H01G4/008 ,  H01G4/06

CPC classification number: H01G4/008 ,  B32B5/18 ,  B32B9/007 ,  B32B37/14 ,  B32B2266/04 ,  B32B2266/057 ,  B32B2266/126 ,  B32B2307/202 ,  B32B2457/08 ,  B82Y30/00 ,  H01G4/002 ,  H01G4/005 ,  H01L27/12 ,  H01L29/1606 ,  H01L29/78603 ,  H05K1/02 ,  H05K1/0274 ,  H05K1/0306 ,  H05K1/032 ,  H05K1/09 ,  H05K1/097 ,  H05K1/181 ,  H05K3/00 ,  H05K2201/0323 ,  H05K2201/10007 ,  H05K2201/10121 ,  Y10S977/734 ,  Y10T29/49128 ,  Y10T29/49826 ,  Y10T156/10 ,  Y10T428/24331 ,  Y10T428/24777 ,  Y10T428/24996 ,  Y10T428/249981 ,  Y10T428/24999 ,  Y10T428/30

Abstract: An apparatus having reduced phononic coupling between a graphene monolayer and a substrate is provided. The apparatus includes an aerogel substrate and a monolayer of graphene coupled to the aerogel substrate.

Abstract translation: 提供了一种在石墨烯单层和基底之间具有减小的声子耦合的装置。 该装置包括气凝胶基底和耦合到气凝胶基底的单层石墨烯。

公开(公告)号：US20130215551A1

公开(公告)日：2013-08-22

申请号：US13398561

申请日：2012-02-16

Applicant: Jeffrey A. Bowers ,  Alistair K. Chan ,  Geoffrey F. Deane ,  Roderick A. Hyde ,  Nathan Kundtz ,  Nathan P. Myhrvold ,  David R. Smith ,  Lowell L. Wood, JR.

Inventor： Jeffrey A. Bowers ,  Alistair K. Chan ,  Geoffrey F. Deane ,  Roderick A. Hyde ,  Nathan Kundtz ,  Nathan P. Myhrvold ,  David R. Smith ,  Lowell L. Wood, JR.

IPC: H05K1/03 ,  B32B5/32 ,  B32B9/00 ,  H01G4/002 ,  B32B5/18 ,  B82Y30/00

CPC classification number: H01G4/008 ,  B32B5/18 ,  B32B9/007 ,  B32B37/14 ,  B32B2266/04 ,  B32B2266/057 ,  B32B2266/126 ,  B32B2307/202 ,  B32B2457/08 ,  B82Y30/00 ,  H01G4/002 ,  H01G4/005 ,  H01L27/12 ,  H01L29/1606 ,  H01L29/78603 ,  H05K1/02 ,  H05K1/0274 ,  H05K1/0306 ,  H05K1/032 ,  H05K1/09 ,  H05K1/097 ,  H05K1/181 ,  H05K3/00 ,  H05K2201/0323 ,  H05K2201/10007 ,  H05K2201/10121 ,  Y10S977/734 ,  Y10T29/49128 ,  Y10T29/49826 ,  Y10T156/10 ,  Y10T428/24331 ,  Y10T428/24777 ,  Y10T428/24996 ,  Y10T428/249981 ,  Y10T428/24999 ,  Y10T428/30

Abstract: An apparatus having reduced phononic coupling between a graphene monolayer and a substrate is provided. The apparatus includes an aerogel substrate and a monolayer of graphene coupled to the aerogel substrate.

公开(公告)号：US20230217599A1

公开(公告)日：2023-07-06

申请号：US18184728

申请日：2023-03-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Toru KOMATSU ,  Tadashi NOMURA

IPC: H05K3/30 ,  H05K3/00 ,  H05K1/18

CPC classification number: H05K3/305 ,  H05K3/0052 ,  H05K1/181 ,  H05K2201/10007 ,  H05K2201/10977 ,  H05K2203/0228 ,  H05K2203/0264 ,  H05K3/3478

Abstract: An electronic component module includes a plurality of components having terminals and arranged along a plane, a sealing resin portion that covers and seals these components and has a plane as one plane of an outer surface, and a shield layer that covers the outer surface of the sealing resin portion. Terminals of the plurality of components are exposed in a state of protruding from the plane of the sealing resin portion, and the terminals of these components protruding from the plane of the sealing resin portion are used as mounting terminals of the electronic component module.