公开(公告)号：US07524388B2

公开(公告)日：2009-04-28

申请号：US11382513

申请日：2006-05-10

Applicant: E. Clifford Roseen, Jr. ,  Murali Sethumadhavan

Inventor： E. Clifford Roseen, Jr. ,  Murali Sethumadhavan

IPC: B29C53/58 ,  B29C70/34 ,  B31C1/00 ,  B65H81/00

CPC classification number: H05K1/0366 ,  B29C70/00 ,  B29C70/025 ,  B29K2105/0079 ,  B32B3/26 ,  B32B5/02 ,  B32B5/022 ,  B32B5/024 ,  B32B27/12 ,  B32B27/20 ,  B32B27/38 ,  B32B2260/021 ,  B32B2307/202 ,  B32B2307/204 ,  B32B2307/5825 ,  B32B2307/726 ,  B32B2307/734 ,  B32B2457/08 ,  H05K2201/0141 ,  H05K2201/0278 ,  Y10S428/901 ,  Y10T442/2016 ,  Y10T442/2041 ,  Y10T442/2418

Abstract: A method of forming a dielectric substrate comprises contacting a liquid crystalline polymer fibrous web having a thickness of 5 mils (127 micrometers) or less with a resin composition to form a dielectric composite. Contacting is carried out under vacuum, followed by pressure. The dielectric substrate is useful in circuit materials, circuits, and multi-layer circuits, economical to make, and has excellent dielectric strength.

Abstract translation: 形成电介质基片的方法包括将具有5密耳（127微米）或更小厚度的液晶聚合物纤维网与树脂组合物接触以形成电介质复合材料。 接触在真空下进行，然后进行压力。 电介质基板在电路材料，电路和多层电路中是有用的，经济地制造并且具有优异的介电强度。

公开(公告)号：US07476434B2

公开(公告)日：2009-01-13

申请号：US11764405

申请日：2007-06-18

Applicant: Tsuyoshi Iwasa ,  Atsushi Funaki ,  Yoshiaki Higuchi

Inventor： Tsuyoshi Iwasa ,  Atsushi Funaki ,  Yoshiaki Higuchi

IPC: B32B15/082 ,  B32B15/20 ,  B32B27/30

CPC classification number: H05K1/036 ,  B32B15/08 ,  B32B27/06 ,  C08F214/18 ,  C08F214/245 ,  C08F214/265 ,  H05K1/034 ,  H05K1/0366 ,  H05K1/0393 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0278 ,  Y10T428/24355 ,  Y10T428/264 ,  Y10T428/265 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31721

Abstract: To provide a laminate for a flexible printed wiring board excellent in signal response in the high frequency region. A laminate for a flexible printed wiring board having a three-layer laminated structure where a reinforcing layer (A), an electrical insulator layer (B) and an electrical conductor layer (C) are laminated in this order, wherein the electrical insulator layer (B) is made of a fluorocopolymer comprising repeating units (a) based on tetrafluoroethylene and/or chlorotrifluoroethylene, repeating units (b) based on a fluoromonomer excluding tetrafluoroethylene and chlorotrifluoroethylene, and repeating units (c) based on a monomer having an acid anhydride residue and the electrical conductor layer (C) has a surface roughness of at most 10 μm on the side being in contact with the electrical insulator layer (B). The laminate for a flexible printed wiring board is excellent in signal response in the high frequency region and excellent in flex resistance.

Abstract translation: 为了提供高频区域的信号响应优异的柔性印刷线路板的层叠体。 一种具有三层层叠结构的柔性印刷电路板的叠层，其中加强层（A），电绝缘体层（B）和电导体层（C）依次层叠，其中电绝缘层 B）由包含基于四氟乙烯和/或三氟氯乙烯的重复单元（a）的含氟共聚物制成，基于除四氟乙烯和氯三氟乙烯之外的含氟单体的重复单元（b）和基于具有酸酐残基的单体的重复单元（c） 并且电导体层（C）在与电绝缘体层（B）接触的一侧具有至多10μm的表面粗糙度。 柔性印刷线路板用层叠体在高频区域的信号响应优异，抗挠曲性优异。

公开(公告)号：US20080191354A1

公开(公告)日：2008-08-14

申请号：US12081051

申请日：2008-04-10

Applicant: Robert M. Japp ,  Voya R. Markovich ,  Kostas I. Papathomas ,  Mark D. Poliks

Inventor： Robert M. Japp ,  Voya R. Markovich ,  Kostas I. Papathomas ,  Mark D. Poliks

IPC: H01L23/50 ,  H05K3/30

CPC classification number: H01L23/145 ,  H01L23/3733 ,  H01L23/3735 ,  H01L23/4922 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/564 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2924/15311 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/4602 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/0278 ,  H05K2201/068 ,  Y10T29/4913 ,  H01L2224/0401

Abstract: A circuitized substrate including a dielectric layer having a p-aramid paper impregnated with a halogen-free, low moisture absorptivity resin and not including continuous or semi-continuous fiberglass fibers as part thereof, and a first circuitized layer positioned on the dielectric layer. A method of making this substrate is also provided.

Abstract translation: 一种电路化基板，包括具有浸渍有无卤低吸湿树脂的对芳族聚酰胺纸，并且不包括作为其一部分的连续或半连续玻璃纤维纤维的介电层和位于介电层上的第一电路层。 还提供了制造该基板的方法。

公开(公告)号：US07211527B2

公开(公告)日：2007-05-01

申请号：US11028654

申请日：2005-01-05

Applicant: Satoshi Okamoto ,  Shiro Katagiri ,  Wakana Aizawa ,  Masatoshi Kito

Inventor： Satoshi Okamoto ,  Shiro Katagiri ,  Wakana Aizawa ,  Masatoshi Kito

IPC: B32B5/02 ,  B32B27/02

CPC classification number: B32B27/06 ,  B32B15/08 ,  B32B27/04 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2307/306 ,  B32B2457/08 ,  C08L67/00 ,  C08L67/03 ,  C08L2205/16 ,  D06N3/0015 ,  D06N3/121 ,  D21H13/24 ,  D21H17/53 ,  H05K1/0366 ,  H05K2201/0141 ,  H05K2201/0278 ,  H05K2203/0783 ,  Y10T442/2418 ,  Y10T442/2475 ,  Y10T442/2631 ,  Y10T442/2861 ,  Y10T442/696 ,  C08L2666/02 ,  C08L2666/18

Abstract: A resin-impregnated substrate is obtained by a method comprising the steps of immersing a sheet comprising an aromatic liquid crystalline polyester fiber in an aromatic liquid crystalline polyester solution containing 100 parts by weight of a solvent and 0.5 to 100 parts by weight of an aromatic liquid crystalline polyester and removing the solvent, the solvent containing on a weight basis with respect to the solvent 30% or more of a phenol compound. The resin-impregnated substrate has a high heat resistance in soldering conditions.

Abstract translation: 通过包括以下步骤的方法获得树脂浸渍的基材：将包含芳族液晶聚酯纤维的片材浸入含有100重量份溶剂的芳族液晶聚酯溶液和0.5至100重量份的芳族液体 结晶聚酯并除去溶剂，溶剂相对于溶剂以重量计含有30％或更多的酚化合物。 浸渍树脂的基材在焊接条件下具有高耐热性。

公开(公告)号：US20060286881A1

公开(公告)日：2006-12-21

申请号：US11158708

申请日：2005-06-21

Applicant: Chin Chou ,  I-Shou Tsai ,  Weni Kuo ,  Ya Kuo

Inventor： Chin Chou ,  I-Shou Tsai ,  Weni Kuo ,  Ya Kuo

IPC: B32B5/02

CPC classification number: B32B5/26 ,  B32B5/12 ,  B32B2250/20 ,  B32B2255/02 ,  B32B2255/20 ,  B32B2255/26 ,  B32B2262/0253 ,  B32B2307/20 ,  B32B2307/204 ,  B32B2457/08 ,  D06N3/047 ,  H05K1/034 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0278 ,  Y10T442/20

Abstract: A basic board member includes an inner fabric member, and a gelatinous emulsion disposed on the inner fabric member, to form a gel outer layer on the inner fabric member, after the gelatinous emulsion is cured, to facilitate a low dielectric characteristic to the basic board member. The inner fabric member includes one or more fabric layers made of polytetrafluoroethylene (PTFE) material, and preferably inclined relative to each other, having an included angle of about forty five (45) degrees. An outer fabric layer may further be attached onto the fabric layer. The gelatinous emulsion may include a polytetrafluoroethylene emulsion and a coupling agent mixed and stirred together.

Abstract translation: 基本的板构件包括内部织物构件和布置在内部织物构件上的凝胶状乳液，以在凝胶状乳液固化之后在内部织物上形成凝胶外层，以便于对基底板的低介电特性 会员。 内部织物构件包括一个或多个由聚四氟乙烯（PTFE）材料制成的织物层，并且优选地相对于彼此倾斜，具有约四十五（45）度的夹角。 外部织物层还可以附着到织物层上。 凝胶状乳液可以包括聚四氟乙烯乳液和一起混合并搅拌的偶联剂。

公开(公告)号：US20060135022A1

公开(公告)日：2006-06-22

申请号：US11353586

申请日：2006-02-14

Applicant: John Porter

Inventor： John Porter

IPC: B32B27/04 ,  B32B27/12 ,  B32B27/02 ,  B32B17/02 ,  B32B7/08 ,  D04H1/00 ,  D04H13/00 ,  B32B5/26 ,  D04H1/54

CPC classification number: B32B27/12 ,  B29C65/02 ,  B29C66/71 ,  B29C66/721 ,  B29C66/7212 ,  B29C66/72141 ,  B29C66/72143 ,  B29C66/723 ,  B29C66/72321 ,  B29C66/72327 ,  B29C66/72328 ,  B29C66/7392 ,  B29C66/7394 ,  B29C70/083 ,  B32B5/28 ,  B32B27/04 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/0278 ,  Y10S428/911 ,  Y10T428/249923 ,  Y10T442/2361 ,  Y10T442/2615 ,  Y10T442/2623 ,  Y10T442/2738 ,  Y10T442/2754 ,  Y10T442/2861 ,  Y10T442/2893 ,  Y10T442/2902 ,  Y10T442/291 ,  Y10T442/2926 ,  Y10T442/2992 ,  Y10T442/604 ,  Y10T442/607 ,  Y10T442/659 ,  Y10T442/69 ,  Y10T442/697 ,  B29K2307/04 ,  B29K2077/00 ,  B29K2309/08 ,  B29K2277/10 ,  B29K2023/04 ,  B29K2027/06 ,  B29K2071/00 ,  B29K2079/085 ,  B29K2081/06 ,  B29K2067/00 ,  B29K2081/04 ,  B29K2063/00 ,  B29K2055/02 ,  B29K2301/00 ,  B29K2077/10 ,  B29K2071/12 ,  B29K2067/06 ,  B29K2025/08 ,  B29K2025/06 ,  B29K2023/12 ,  B29K2023/06

Abstract: This invention provides multi-layered composites, laminates and composite joints in which at least one resin-impregnated, fiber-containing layer is joined or laminated to a core layer having a lower flexural modulus or higher elongation at break, higher toughness, or a combination of all or some of these properties. The multi-layer composite produced by laminating or joining these materials together has improved shearout, impact and cutting resistance, since stresses caused by outside forces can be more widely distributed throughout the composite.

公开(公告)号：US20050136233A1

公开(公告)日：2005-06-23

申请号：US11050264

申请日：2005-02-03

Applicant: Michael Samuels ,  Subhotosh Khan ,  Mikhail Levit

Inventor： Michael Samuels ,  Subhotosh Khan ,  Mikhail Levit

IPC: D04H1/00 ,  D04H13/00 ,  H05K1/03 ,  B32B27/04 ,  B32B27/12

CPC classification number: H05K1/0366 ,  B32B5/022 ,  B32B5/145 ,  B32B5/26 ,  B32B2255/02 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/02 ,  B32B2262/0269 ,  B32B2262/101 ,  B32B2264/0221 ,  B32B2307/306 ,  B32B2307/308 ,  B32B2307/54 ,  B32B2307/718 ,  B32B2307/7265 ,  B32B2457/08 ,  D21H27/30 ,  H05K1/036 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/24942 ,  Y10T442/2066 ,  Y10T442/2484 ,  Y10T442/2861

Abstract: A sheet comprising thermoplastic polymer (TP) and short high tensile modulus fibers, in which the concentration of TP in the middle of the sheet is higher than at the surface of the sheet, useful for making prepregs with a thermoset resin.

公开(公告)号：US20050100720A1

公开(公告)日：2005-05-12

申请号：US11020035

申请日：2004-12-23

Applicant: Seiji Shirai ,  Kenichi Shimada ,  Motoo Asai

Inventor： Seiji Shirai ,  Kenichi Shimada ,  Motoo Asai

IPC: H05K3/10 ,  H05K3/38 ,  H05K3/42 ,  H05K3/46 ,  B32B15/00 ,  B32B3/00

CPC classification number: H05K3/4661 ,  H05K3/108 ,  H05K3/381 ,  H05K3/382 ,  H05K3/421 ,  H05K3/423 ,  H05K2201/0129 ,  H05K2201/015 ,  H05K2201/0278 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09745 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/31681

Abstract: The present invention provides a multilayer printed wiring board having a filled viahole structure advantageously usable for forming a fine circuit pattern thereon, and having an excellent resistance against cracking under a thermal shock or due to heat cycle. The multilayer printed wiring board is comprised of conductor circuitry layers and interlaminar insulative resin layers deposited alternately one on another, the interlaminar insulative resin layers each having formed through them holes each filled with a plating layer to form a viahole. The surface of the plating layer exposed out of the hole for the viahole is formed substantially flat and lies at a substantially same level as the surface of the conductor circuit disposed in the interlaminar insulative resin layer. The thickness of the conductor circuitry layer is less than a half of the viahole diameter and less than 25 μm. The inner wall of the hole formed in the interlaminar insulative resin layer is roughened and an electroless plating layer is deposited on the roughened surface. An electroplating layer is filled in the hole including the electroless plating layer to form the viahole. The interlaminar insulative resin layer is formed from a composite of a fluororesin showing a high fracture toughness and a heat-resistant thermoplastic resin, a composite of fluororesin and thermosetting resin or a composite of thermosetting and thermoplastic resins.

Abstract translation: 本发明提供了一种多层印刷线路板，其具有有利地用于在其上形成精细电路图案的填充通孔结构，并且在热冲击下或由于热循环具有优异的抗开裂性。 多层印刷布线板由交替地彼此堆叠的导体电路层和层间绝缘树脂层构成，层间绝缘树脂层各自形成有各自填充有镀层的孔，以形成通孔。 露出用于通孔的孔的镀层的表面形成为基本上平坦，并且位于与布置在层间绝缘树脂层中的导体电路的表面基本相同的水平。 导体电路层的厚度小于通孔直径的一半，小于25μm。 形成在层间绝缘树脂层中的孔的内壁变粗糙，并且在粗糙化表面上沉积化学镀层。 在包括无电镀层的孔中填充电镀层以形成通孔。 层间绝缘树脂层由显示高断裂韧性的氟树脂和耐热性热塑性树脂，氟树脂和热固性树脂的复合物或热固性和热塑性树脂的复合材料的复合材料形成。

公开(公告)号：US20050019541A1

公开(公告)日：2005-01-27

申请号：US10921649

申请日：2004-08-18

Applicant: Kalu Vasoya ,  Bharat Mangrolia ,  William Davis ,  Richard Bohner

Inventor： Kalu Vasoya ,  Bharat Mangrolia ,  William Davis ,  Richard Bohner

IPC: C08J5/24 ,  B32B5/26 ,  B32B27/04 ,  C08K3/38 ,  C08K9/08 ,  H05K1/02 ,  H05K1/03 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  B32B27/12 ,  B32B31/08

CPC classification number: B32B27/12 ,  B32B5/26 ,  B32B27/04 ,  B32B2260/021 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2457/00 ,  C08K3/38 ,  C08K9/08 ,  C08K2003/385 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/429 ,  H05K3/445 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0209 ,  H05K2201/0278 ,  H05K2201/0287 ,  H05K2201/0323 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/249942 ,  Y10T428/249945 ,  Y10T428/249946 ,  Y10T428/249947 ,  Y10T428/249951 ,  Y10T428/249952 ,  Y10T428/25 ,  Y10T428/292 ,  Y10T428/31504 ,  Y10T442/117 ,  Y10T442/2418

Abstract: Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.

Abstract translation: 预浸料，层压板，印刷线路板结构以及用于构造材料和印刷线路板的工艺，其能够构造具有改善的热性能的印刷线路板。 在一个实施方案中，预浸料包括浸渍有导电和导热树脂的基材。 在其它实施例中，预浸料坯具有包括碳的基底材料。 在其它实施方案中，预浸料包括浸渍有导热树脂的基材。 在其他实施例中，印刷线路板结构包括可以用作接地和/或电力平面的导电和导热的层压板。

公开(公告)号：US20050014035A1

公开(公告)日：2005-01-20

申请号：US10890329

申请日：2004-07-12

Applicant: Yasushi Nakagiri ,  Shinobu Masuda ,  Shozo Ochi ,  Satoru Tomekawa

Inventor： Yasushi Nakagiri ,  Shinobu Masuda ,  Shozo Ochi ,  Satoru Tomekawa

IPC: C08J5/04 ,  D04H1/42 ,  D04H13/00 ,  H05K1/03 ,  H05K3/40 ,  H05K3/46 ,  C04B35/64 ,  B28B1/00 ,  B28B3/00 ,  B28B5/00 ,  B32B3/00 ,  B32B5/02 ,  B32B9/00 ,  C04B33/32 ,  C04B33/36 ,  D04H1/00 ,  D04H3/00 ,  D04H5/00 ,  H01R12/04 ,  H05K1/11

CPC classification number: H05K1/0366 ,  C08J5/046 ,  D04H1/4318 ,  D04H1/64 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/015 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T442/20

Abstract: A prepreg for a printed wiring board includes fluorocarbon fibers as a reinforcing material, and the reinforcing material is impregnated with a resin. The fluorocarbon fibers include short fibers having a branch structure. The reinforcing material includes a nonwoven fabric formed by interlacing the fluorocarbon fibers in the thickness direction. The proportion of the fluorocarbon fibers among the fibers constituting the nonwoven fabric ranges from 50 wt % to 100 wt %, and the remaining fibers are synthetic fibers or inorganic fibers. The nonwoven fabric is heat-treated at 330° C. to 390° C., then annealed at 200° C. to 270° C., and impregnated with the resin. This prepreg can used to provide a printed wiring board with low Interstitial Via Hole connection resistance and high connection stability and a method for manufacturing the printed wiring board.

Abstract translation: 用于印刷线路板的预浸料包括作为增强材料的氟碳纤维，并且增强材料用树脂浸渍。 氟碳纤维包括具有分支结构的短纤维。 增强材料包括通过使碳氟化合物纤维沿厚度方向交织而形成的无纺布。 构成无纺布的纤维中的氟碳纤维的比例为50重量％〜100重量％，剩余的纤维为合成纤维或无机纤维。 无纺布在330℃至390℃下热处理，然后在200℃下退火至270℃，并用树脂浸渍。 该预浸料可用于提供具有低间隙通孔连接电阻和高连接稳定性的印刷线路板以及印刷线路板的制造方法。