公开(公告)号：US20220084975A1

公开(公告)日：2022-03-17

申请号：US17536555

申请日：2021-11-29

Applicant: DEXERIALS CORPORATION

Inventor： Reiji TSUKAO ,  Yasushi AKUTSU

IPC: H01L23/00 ,  B32B5/30 ,  B32B27/06 ,  B32B3/30 ,  B32B7/04 ,  B32B27/28 ,  C09J4/00 ,  B32B7/02 ,  H05K3/32 ,  C09J163/00 ,  C09J201/00 ,  B32B7/00 ,  B32B3/00 ,  B32B27/00 ,  H01R4/04 ,  B32B27/08 ,  C08L63/00 ,  C09J7/10

Abstract: An anisotropic conductive film has first and second connection layers formed on a first layer surface. The first connection layer is a photopolymerized resin layer, and the second is thermo- or photo-cationically, anionically, or radically polymerizable resin layer. On the surface of the first connection layer on a second connection layer side, conductive particles for anisotropic conductive connection are in a single layer. The first connection layer has fine projections and recesses in a surface. An anisotropic conductive film of another aspect has first, second, and third connection layers layered in sequence. The first layer formed of photo-radically polymerized resin. The second and third layers are formed of thermo-cationically or thermo-anionically polymerizable resin, photo-cationically or photo-anionically polymerizable resin, thermo-radically polymerizable resin, or photo-radically polymerizable resin. On a surface of the first connection layer on a second connection layer side, conductive particles for anisotropic conductive connection are in a single layer.

公开(公告)号：US11242472B2

公开(公告)日：2022-02-08

申请号：US16486522

申请日：2018-02-14

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Tetsuyuki Shirakawa ,  Hiroyuki Izawa ,  Takahiro Fukui ,  Tatsuya Kumada

IPC: C09J9/02 ,  C08K3/08 ,  C09J11/04 ,  C09J201/00

Abstract: One aspect of the present invention is an adhesive film comprising a first adhesive layer comprising a first conductive particle that is a dendritic conductive particle; and a second adhesive layer containing a second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle comprising a nonconductive core body and a conductive layer provided on the core body.

公开(公告)号：US11174419B2

公开(公告)日：2021-11-16

申请号：US16287093

申请日：2019-02-27

Applicant: Henkel IP & Holding GmbH ,  Henkel AG & Co. KGaA

Inventor： Puwei Liu ,  Jiangbo Ouyang ,  ChunHua Gu

IPC: C09J133/14 ,  C09J133/00 ,  C09J133/04 ,  C09J11/04 ,  C09J133/06 ,  C09J133/08 ,  C09J163/00 ,  C09J167/06 ,  C09J183/04 ,  G02B1/04 ,  C08F220/30 ,  C08K9/04 ,  C08K3/22 ,  C08K9/08 ,  C08K9/10 ,  C09J201/00

Abstract: Provided herein are high refractive index compositions with excellent light stability, and methods for the use thereof, as well as assemblies and articles prepared using invention formulations and methods.

公开(公告)号：US20210189198A1

公开(公告)日：2021-06-24

申请号：US17195603

申请日：2021-03-08

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Norzafriza NITTA ,  Yoshihiro SATO ,  Hidemichi FUJIWARA

IPC: C09J9/02 ,  C09J7/25 ,  C09J7/38 ,  B32B7/12 ,  B32B15/04 ,  B32B37/12 ,  H01L21/683 ,  C09J7/00 ,  H01B1/22 ,  B32B27/00 ,  B32B27/18 ,  C09J201/00 ,  H01B1/00 ,  B32B5/18

Abstract: The invention provides a joining film having sufficient connection heat resistance and high reliability, for which a joining process of joining a semiconductor element and a substrate is simple and easy, a tape for wafer processing, a method for producing a joined body, and a joined body. Disclosed is a joining film for joining a semiconductor element and a substrate, the joining film having an electroconductive joining layer formed by molding an electroconductive paste containing metal fine particles (P) into a film form; and a tack layer having tackiness and being laminated with the electroconductive joining layer. The tack layer is thermally decomposed by heating at the time of joining, the metal fine particles (P) of the electroconductive joining layer are sintered, and thereby the semiconductor element and the substrate are joined.

公开(公告)号：US11020825B2

公开(公告)日：2021-06-01

申请号：US15767804

申请日：2016-11-18

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Mai Yamagami ,  Satoshi Haneda ,  Takeshi Wakiya ,  Yasuyuki Yamada ,  Saori Ueda ,  Masao Sasadaira

IPC: B23K35/36 ,  B23K35/02 ,  B23K35/30 ,  C08F216/06 ,  C08F212/36 ,  C08F36/20 ,  C09J9/02 ,  B23K35/34 ,  B22F7/08 ,  C08F30/08 ,  C08J3/12 ,  C08F16/32 ,  C08F36/08 ,  H01B1/22 ,  H01R11/01 ,  C09J11/00 ,  C09J201/00 ,  H01B5/00 ,  B23K35/26 ,  B22F1/00 ,  B22F1/02 ,  B22F7/06 ,  C08K3/08 ,  B23K35/24 ,  C08K7/00

Abstract: A connecting material that can suppress the occurrence of cracking during a stress load in a connection part that connects two members to be connected, further can suppress the variation in thickness in the connection part to ensure the heat dissipation performance, and can increase the connection strength is provided. The connecting material according to the present invention is a connecting material used for forming the connection part that connects two members to be connected, the connecting material contains particles and metal atom-containing particles, the particles are used for forming the connection part such that thickness of the connection part after connection is twice or less the average particle diameter of the particles before connection, or the particles have an average particle diameter of 1 μm or more and 300 μm or less, the particles have a 10% K value of exceeding 3000 N/mm2 and 20000 N/mm2 or less, and the particles have a particle diameter CV value of 10% or less.

公开(公告)号：US11017916B2

公开(公告)日：2021-05-25

申请号：US15767803

申请日：2016-11-18

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Mai Yamagami ,  Satoshi Haneda ,  Takeshi Wakiya ,  Yasuyuki Yamada ,  Saori Ueda ,  Masao Sasadaira

IPC: B23K35/36 ,  B23K35/02 ,  B23K35/30 ,  C08F216/06 ,  C08F212/36 ,  C08F36/20 ,  C09J9/02 ,  H01B1/22 ,  B22F7/08 ,  C08F30/08 ,  C08F36/08 ,  H01R11/01 ,  C08F16/32 ,  H01B5/00 ,  C09J201/00 ,  B23K35/26 ,  B22F7/06 ,  B22F1/02 ,  B23K35/24 ,  C08F12/36 ,  C09J11/08 ,  C08F16/20 ,  C08G61/02 ,  H01L23/00 ,  B22F1/00

Abstract: Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 μm or more and 15 μm or less, the particles have a 10% K value of 30 N/mm2 or more and 3000 N/mm2 or less, and the particles have a particle diameter CV value of 50% or less.

公开(公告)号：US10945412B2

公开(公告)日：2021-03-16

申请号：US16596226

申请日：2019-10-08

Applicant: TOKUYAMA CORPORATION

Inventor： Yoji Inui ,  Hitoshi Kondo ,  Katsuhiro Shirai

IPC: A01K13/00 ,  A61D9/00 ,  B32B27/40 ,  A01J7/04 ,  B32B27/00 ,  C09J11/00 ,  C09J201/00 ,  A01J7/00

Abstract: A method of protecting a teat opening with a teat opening protection patch, which is stuck to portions inclusive of the teat openings of livestock, and includes a laminate 1 of an elastic sheet 2 and an adhesive layer 3 laminated on one surface of the elastic sheet 2, the laminate 1 having a double-stretched tensile stress in a range of 0.1 to 5 N.

公开(公告)号：US10822526B2

公开(公告)日：2020-11-03

申请号：US15561148

申请日：2015-12-18

Applicant: NICHIBAN CO., LTD.

Inventor： Syuji Ichimura ,  Mikihiro Endou ,  Yusuke Sugiyama

IPC: B29B9/10 ,  B29C48/00 ,  B29B9/16 ,  C09J201/00 ,  B29B9/06 ,  C09J7/30 ,  C08J3/12 ,  C09J7/00 ,  B29B9/12 ,  B29B13/06 ,  C09J9/00 ,  C08K7/00 ,  B29C48/05 ,  B29C48/04 ,  C09J7/10

Abstract: A method for manufacturing adhesive resin pellets includes adding an antiblocking agent to water, melting an adhesive resin and extruding the adhesive resin into the water, and cutting the adhesive resin extruded into the water to form adhesive resin pellets. Polyolefin fine particles used for the antiblocking agent have an average particle diameter of 1 μm or more and less than 18 μm, and the adhesive resin has an adhesive force of less than 15.00 N/25 mm.

公开(公告)号：US10815395B2

公开(公告)日：2020-10-27

申请号：US15743346

申请日：2016-07-05

Applicant: AICA KOGYO CO., LTD.

Inventor： Kazuya Shido ,  Kazuki Kouyama ,  Keisuke Shitan

IPC: C09J7/29 ,  B32B5/02 ,  B32B29/00 ,  B44C5/04 ,  B32B17/04 ,  C09J201/00 ,  B32B37/18 ,  B32B38/00 ,  C08K7/14

Abstract: A decorative sheet according to one aspect of the present disclosure comprises a decorative plate and an adhesive layer disposed on a first side of the decorative plate. The decorative plate comprises (A) a decorative layer disposed on a second side from the first side, (B) a core layer made of a prepreg containing a fiber base material, and (C) a balancing layer including mixed paper containing an endothermic metal hydroxide as a base material.

公开(公告)号：US20200332083A1

公开(公告)日：2020-10-22

申请号：US16760123

申请日：2018-11-08

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Krzysztof P. Rudnicki ,  Michael Juergens

IPC: C08K5/00 ,  C09J11/06 ,  C09J201/00

Abstract: The present disclosure relates to a color-changing composition comprising: a) a dye selected from the group consisting of metal complexes, wherein the metal complexes comprise: i. a central ion of a metal selected from the group consisting of iron, vanadium, chromium, manganese, cobalt, nickel and copper; and ii. chelate ligands having heteroaromatic structures; b) an adhesive composition; c) optionally, a curable polymer resin selected from the group consisting of epoxy resins, polyester resins, polyurethane resins, vinyl resins, and any combinations or mixtures thereof; wherein the color-changing composition has an initial color and is capable of changing color to a final color upon contacting a curable composition comprising one or more curing agents and a curable polymer resin; wherein the one or more curing agents are suitable to cure the curable polymer resin; and wherein the initial color is different from the final color.