Method and device for calibrating measurements of temperatures independent of emissivity
    11.
    发明授权
    Method and device for calibrating measurements of temperatures independent of emissivity 有权
    用于校准独立于发射率的温度测量的方法和装置

    公开(公告)号:US06561694B1

    公开(公告)日:2003-05-13

    申请号:US09744880

    申请日:2001-04-19

    CPC classification number: G01J5/0003 G01J5/524 G01J2005/0048

    Abstract: A method and apparatus for calibrating temperature measurements that are taken with a first radiation detector for measuring thermal radiation given off by a reference substrate are provided. The method includes the steps of heating the reference substrate, which carries at least one reference material having a known melting point temperature, to or over the melting point temperature and measuring the thermal radiation of the reference substrate during the heating step, during a cooling period that follows the heating, or during both the heating and the cooling periods. The method also includes the step of correlating a measurement plateau of the thermal radiation which occurs during the measuring step with the known melting point temperature.

    Abstract translation: 提供了用于校准用于测量由参考基板发出的热辐射的第一辐射检测器进行的温度测量的方法和装置。 该方法包括以下步骤:在冷却期间,将具有已知熔点温度的至少一种参考材料的参考基板加热至熔点以上并在加热步骤期间测量参考基板的热辐射, 在加热之后,或在加热和冷却期间。 该方法还包括将在测量步骤期间发生的热辐射的测量平台与已知熔点温度相关联的步骤。

    Temperature measuring method using radiation thermometer
    13.
    发明授权
    Temperature measuring method using radiation thermometer 失效
    使用辐射温度计的温度测量方法

    公开(公告)号:US06283630B1

    公开(公告)日:2001-09-04

    申请号:US09414888

    申请日:1999-10-08

    Applicant: Minoru Yazawa

    Inventor: Minoru Yazawa

    CPC classification number: G01K11/00 G01J5/0003

    Abstract: A temperature measuring method measures the temperature of a measuring object, such as a semiconductor wafer, by a radiation thermometer capable of approximating the relation between its output and the temperature of the measuring object by a predetermined straight line and of being calibrated by properly determining a slope and a y-intercept for the straight line. The measuring method carries out a procedure including the steps of measuring the reflectivity of a measuring object regarding the light of a wavelength that is not transmitted by the measuring object, and determining a slope and a y-intercept for a proper straight line for the measuring object on the basis of results of processing the measuring object by a predetermined process, such as a film forming process, that provides a result, such as the thickness of a film, corresponding to process temperature. The procedure is repeated for a plurality of measuring objects to determine the relation between the reflectivity of the measuring object, and the slope and y-intercept of the proper straight line. The radiation thermometer is calibrated on the basis of the relation, and the temperature of the measuring objects is measured.

    Abstract translation: 温度测量方法通过辐射温度计测量诸如半导体晶片的测量对象的温度,该辐射温度计能够通过预定直线近似其输出与测量对象的温度之间的关系,并且通过适当地确定 斜线和y截距为直线。 测量方法执行一个步骤,包括以下步骤:测量测量对象关于由测量对象不传输的波长的光的反射率,以及确定用于测量的适当直线的斜率和y截距 基于通过诸如成膜过程的预定处理来处理测量对象的结果,其对应于处理温度提供诸如膜的厚度的结果。 对于多个测量对象重复该过程以确定测量对象的反射率与正确直线的斜率和y截距之间的关系。 辐射温度计是根据关系进行校准的,测量对象的温度。

    Vehicle visibility assist device and method
    14.
    发明授权
    Vehicle visibility assist device and method 失效
    车辆可见度辅助装置及方法

    公开(公告)号:US06825469B2

    公开(公告)日:2004-11-30

    申请号:US10206232

    申请日:2002-07-29

    Abstract: A vehicle visibility assist device is started up when a switching operation of a switch for an external vehicle light is detected and when it is determined by a brightness sensor that it is darker outside of the vehicle than a predetermined threshold. The visibility assist device projects infrared light to a region outside the vehicle, captures a reflection of the light, processes an image of the region outside the vehicle, and projects the image onto a surface visible to the vehicle operator.

    Abstract translation: 当检测到用于外部车辆灯的开关的切换操作并且当由亮度传感器确定其在车辆外部比预定阈值更暗时,启动车辆可见度辅助装置。 可见度辅助装置将红外光投射到车辆外部的区域,捕获光的反射,处理车辆外部的区域的图像,并将图像投影到车辆操作者可见的表面上。

    Thermal process apparatus for a semiconductor substrate

    公开(公告)号:US06641302B2

    公开(公告)日:2003-11-04

    申请号:US09962851

    申请日:2001-09-26

    CPC classification number: G01J5/06 G01J5/0003 G01J5/0007 G01J5/08 G01J5/0853

    Abstract: A thermal process apparatus for a semiconductor substrate, including a heating source heating the semiconductor substrate by irradiating a light on one side of the semiconductor substrate, a reflection plate facing to the semiconductor substrate in a state where a reflection cavity is formed with another side of the semiconductor substrate, a thermometer having a light-receiving part provided on the refection plate so as to measure a temperature of the semiconductor substrate by catching a radiation beam from the semiconductor substrate heated by the heating source by the light-receiving part; and light absorption means provided around the light-receiving part for absorbing a diffuse reflection light generated in the reflection cavity.

    Radiation thermometer
    18.
    发明授权
    Radiation thermometer 有权
    辐射温度计

    公开(公告)号:US06609824B1

    公开(公告)日:2003-08-26

    申请号:US09597690

    申请日:2000-06-19

    CPC classification number: G01J5/02 G01J5/026 G01J5/16 G01J2005/068

    Abstract: A radiation thermometer capable of precise measurement without depending upon an absolute precision of an infrared ray sensor for detecting infrared ray or a temperature sensor for measuring a temperature of the infrared ray sensor is provided wherein, controlling means retains a reference temperature for the measurement object, a sensor reference temperature for the sensor, and a sensor reference output for the sensor output when infrared ray radiated from the object of measurement having the object of measurement reference temperature is detected by the infrared ray sensor having the sensor reference temperature, and calculates the temperature of measurement object based on a first difference as a difference between a sensor temperature to be measured by the sensor temperature measuring portion and a sensor reference temperature, a second difference as a difference between a sensor output to be detected by the infrared ray sensor and a sensor reference output and the object of measurement reference temperature.

    Abstract translation: 提供一种能够精确测量的辐射温度计,其不依赖于用于检测红外线的红外线传感器的绝对精度或用于测量红外线传感器的温度的温度传感器,其中控制装置保持测量对象的参考温度, 传感器的传感器参考温度,以及当具有测量基准温度对象的测量对象辐射红外线时,传感器输出的传感器基准输出由具有传感器参考温度的红外线传感器检测,并计算温度 基于作为由传感器温度测量部测量的传感器温度与传感器参考温度之间的差的第一差异的测量对象的第二差值作为由红外线传感器检测的传感器输出与 传感器参考输出和测量对象 参考温度。

    System for digital radiography and dosimetry
    19.
    发明授权
    System for digital radiography and dosimetry 失效
    数码摄影和剂量测定系统

    公开(公告)号:US06583434B2

    公开(公告)日:2003-06-24

    申请号:US09825965

    申请日:2001-04-05

    Abstract: A radiography system is disclosed of the type having means for irradiation of an object in order to form an image of the said object or in order to detect irradiation of said object, said radiography system comprising a sensor having an exposure response function, wherein the sensor is in form of a stimulable storage phosphor plate, comprising stimulable storage phosphors, preferably having a dark-decay of more than 24 hours, wherein energy of stimulation radiation is higher than energy of emission radiation upon stimulation of said storage phosphors.

    Abstract translation: 公开了一种具有用于照射物体以便形成所述物体的图像或为了检测所述物体的照射的装置的类型的射线照相系统,所述射线照相系统包括具有曝光响应功能的传感器,其中所述传感器 是可刺激的存储磷光体板的形式,包括可刺激的储存荧光体,优选具有超过24小时的暗衰变,其中刺激辐射的能量高于在所述存储荧光体刺激时的发射辐射能量。

    Ultra sensitive silicon sensor
    20.
    发明授权

    公开(公告)号:US06489615B2

    公开(公告)日:2002-12-03

    申请号:US09738058

    申请日:2000-12-15

    Applicant: Nathan Bluzer

    Inventor: Nathan Bluzer

    CPC classification number: G01J5/20 G01J5/24

    Abstract: Electro-thermal feedback is utilized for removing thermal conductance between a bolometer's absorber element of a pixel in a thermal radiation sensor assembly and the environments through its mechanical support structure and electrical interconnects, thereby limiting the thermal conductance primarily through photon radiation. Zeroing the thermal conductance associated with the mechanical support structure and electrical interconnects is achieved by electro-thermal feedback that adjust the temperature of an intermediate stage of the mechanical support structure and electrical interconnects to equal the bolometer's absorber element temperature.

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