公开(公告)号：US07407614B2

公开(公告)日：2008-08-05

申请号：US11064005

申请日：2005-02-24

Applicant: Kia Silverbrook

Inventor： Kia Silverbrook

IPC: B27N3/18 ,  B29C59/02 ,  B29C35/08 ,  H01L21/00

CPC classification number: H01L23/315 ,  B29C33/0022 ,  B29C43/36 ,  B29C2035/0822 ,  B29C2043/503 ,  B81B2201/0235 ,  B81B2207/056 ,  B81C1/00269 ,  B81C1/00333 ,  B81C1/00904 ,  B81C2201/034 ,  B81C2203/0127 ,  G01P1/023 ,  G01P15/0802 ,  H01L23/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The present invention relates to a method for forming a protective cap for a device. Typically, the device would be formed on a silicon wafer and is, for example, a MEMS device. The method involves the steps of locating thermosplastic material between a first wafer including a first recess and a second wafer including two second recesses. The first and second wafers are positioned relative to one another so that the first recess is in register with the two second recesses and the thermoplastic material is heated. The first and second wafers are pressed together so that heated thermosplastic material enters the first and second recesses and thereby forms the cap. A method for forming a plurality of protective caps for devices is also provided.

Abstract translation: 本发明涉及一种用于形成装置的保护盖的方法。 通常，器件将形成在硅晶片上，并且例如是MEMS器件。 该方法包括将热塑性材料定位在包括第一凹部的第一晶片和包括两个第二凹槽的第二晶片之间的步骤。 第一和第二晶片相对于彼此定位，使得第一凹槽与两个第二凹部对准，热塑性材料被加热。 将第一和第二晶片压在一起，使得加热的热塑性材料进入第一和第二凹槽，从而形成盖。 还提供了一种用于形成用于装置的多个保护盖的方法。

公开(公告)号：US20080128945A1

公开(公告)日：2008-06-05

申请号：US12024354

申请日：2008-02-01

Applicant: Junichi Seki ,  Tohru Den

Inventor： Junichi Seki ,  Tohru Den

IPC: B28B3/00

CPC classification number: G03F7/0002 ,  B29C35/02 ,  B29C43/003 ,  B29C43/021 ,  B29C59/002 ,  B29C59/022 ,  B29C2043/025 ,  B29C2043/3634 ,  B29C2059/023 ,  B81C99/0085 ,  B81C2201/034 ,  B82Y10/00 ,  B82Y40/00

Abstract: A molding apparatus for patterning a workpiece includes a mold having a pattern to be transferred to the workpiece, with the pattern including recesses, a first support member for supporting the mold, and a second support member, arranged opposite to the first support member, for supporting the workpiece. A pressing mechanism brings the first and second support members close to each other and presses the mold and the workpiece together so as to transfer, to the workpiece, the pattern on the mold. Recessed portions are provided on at least one of a surface of the mold on the first support member side, a region of the first support member, and a region of the second support member. The recessed portions correspond to recesses in the pattern of the mold.

Abstract translation: 用于图案化工件的成型装置包括具有要传送到工件的图案的模具，图案包括凹部，用于支撑模具的第一支撑构件和与第一支撑构件相对设置的第二支撑构件，用于 支撑工件。 按压机构使第一和第二支撑构件彼此靠近，将模具和工件一起压在一起，以将工件上的图案转印到模具上。 在第一支撑构件侧的模具的表面，第一支撑构件的区域和第二支撑构件的区域中的至少一个表面上设置嵌入部分。 凹部对应于模具图案中的凹部。

公开(公告)号：US07347683B2

公开(公告)日：2008-03-25

申请号：US11058195

申请日：2005-02-16

Applicant: Junichi Seki ,  Tohru Den

Inventor： Junichi Seki ,  Tohru Den

IPC: B29C43/04

CPC classification number: G03F7/0002 ,  B29C35/02 ,  B29C43/003 ,  B29C43/021 ,  B29C59/002 ,  B29C59/022 ,  B29C2043/025 ,  B29C2043/3634 ,  B29C2059/023 ,  B81C99/0085 ,  B81C2201/034 ,  B82Y10/00 ,  B82Y40/00

Abstract: A molding apparatus for patterning a workpiece includes a mold having a pattern to be transferred to the workpiece, with the pattern including recesses, a first support member for supporting the mold, and a second support member, arranged opposite to the first support member, for supporting the workpiece. A pressing mechanism brings the first and second support members close to each other and presses the mold and the workpiece together so as to transfer, to the workpiece, the pattern on the mold. Recessed portions are provided on at least one of a surface of the mold on the first support member side, a region of the first support member, and a region of the second support member. The recessed portions correspond to recesses in the pattern of the mold.

Abstract translation: 用于图案化工件的成型装置包括具有要传送到工件的图案的模具，图案包括凹部，用于支撑模具的第一支撑构件和与第一支撑构件相对设置的第二支撑构件，用于 支撑工件。 按压机构使第一和第二支撑构件彼此靠近，将模具和工件一起压在一起，以将工件上的图案转印到模具上。 在第一支撑构件侧的模具的表面，第一支撑构件的区域和第二支撑构件的区域中的至少一个表面上设置嵌入部分。 凹部对应于模具图案中的凹部。

公开(公告)号：US20070254278A1

公开(公告)日：2007-11-01

申请号：US10572764

申请日：2004-09-23

Applicant: Joseph DeSimone ,  Jason Rolland ,  Stephen Quake ,  Derek Schorzman ,  Jason Yarbrough ,  Michael Van Dam

Inventor： Joseph DeSimone ,  Jason Rolland ,  Stephen Quake ,  Derek Schorzman ,  Jason Yarbrough ,  Michael Van Dam

IPC: C07H21/04 ,  C08J7/04 ,  F17D1/16

CPC classification number: B01L3/502707 ,  B01L3/0268 ,  B01L3/502738 ,  B01L7/52 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2400/0481 ,  B01L2400/0655 ,  B81B1/006 ,  B81B2201/058 ,  B81B2203/0323 ,  B81C2201/034 ,  B82Y10/00 ,  B82Y40/00 ,  C08G18/5015 ,  C08G18/8116 ,  C08G65/007 ,  C08G65/33348 ,  C08G2650/48 ,  C09D163/00 ,  C09D171/02 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0026 ,  F16K99/0034 ,  F16K99/0036 ,  F16K99/0042 ,  F16K99/0046 ,  F16K99/0051 ,  F16K99/0059 ,  F16K99/0061 ,  F16K99/0065 ,  F16K2099/008 ,  F16K2099/0084 ,  F16K2099/0086 ,  G03F7/0002 ,  Y10T137/0396 ,  Y10T428/24479 ,  Y10T428/249954 ,  Y10T428/3154

Abstract: A functionalized photocurable perfluoropolyether is used as a material for fabricating a solvent-resistant microfluidic device. Such solvent resistant microfluidic devices can be used to control the flow of small amounts of a fluid, such as an organic solvent, and to perform microscale chemical reactions that are not amenable to other polymer-based microfluidic devices.

Abstract translation: 功能化的光固化全氟聚醚用作制造耐溶剂微流体装置的材料。 这种耐溶剂的微流体装置可用于控制少量流体（例如有机溶剂）的流动，并且执行不适合于其它基于聚合物的微流体装置的微量化学反应。

公开(公告)号：US20070142202A1

公开(公告)日：2007-06-21

申请号：US11657930

申请日：2007-01-24

Applicant: Hong Yang ,  Pascal Deschatelets ,  George Whitesides

Inventor： Hong Yang ,  Pascal Deschatelets ,  George Whitesides

IPC: B29C33/76 ,  C03C3/064

CPC classification number: B81C99/008 ,  B28B7/342 ,  B28B13/021 ,  B81C99/0085 ,  B81C2201/034 ,  B82Y10/00 ,  B82Y30/00 ,  C04B35/571 ,  C04B35/589 ,  C04B35/622 ,  Y10T428/26

Abstract: The invention provides ceramic molded solid articles and methods for making these articles on the micron scale. Articles are molded from ceramic precursors, optionally using molds including at least one portion that is elastomeric.

公开(公告)号：US20060236436A1

公开(公告)日：2006-10-19

申请号：US10544801

申请日：2004-02-13

Applicant: Yangyang Li ,  Frederique Cunin ,  Michael Sailor ,  Jamie Link ,  Ting Gao

Inventor： Yangyang Li ,  Frederique Cunin ,  Michael Sailor ,  Jamie Link ,  Ting Gao

IPC: H01L51/40

CPC classification number: B29D11/00346 ,  B29D11/0074 ,  B81B2201/06 ,  B81B2203/0361 ,  B81C99/0085 ,  B81C2201/0115 ,  B81C2201/034 ,  Y10S977/921

Abstract: A method of generating three-dimensional nanostructures that includes providing a silicon substrate, creating a porous silicon template from the silicon substrate, wherein the template is created to have a predetermined configuration, depositing a predetermined material on the porous silicon template, and removing the porous silicon template from the deposited material to leave a freestanding nanostructure.

Abstract translation: 一种产生三维纳米结构的方法，其包括提供硅衬底，从所述硅衬底产生多孔硅模板，其中所述模板被创建为具有预定构型，在所述多孔硅模板上沉积预定材料，以及除去所述多孔硅模板 硅模板从沉积的材料离开独立的纳米结构。

公开(公告)号：US20060197004A1

公开(公告)日：2006-09-07

申请号：US11419298

申请日：2006-05-19

Applicant: Kenneth Powell ,  Larry Monahan ,  Burton Sage

Inventor： Kenneth Powell ,  Larry Monahan ,  Burton Sage

IPC: B29C33/42

CPC classification number: B29C33/405 ,  A61M37/0015 ,  A61M2037/0046 ,  A61M2037/0053 ,  B29C33/424 ,  B29C45/372 ,  B29C2045/0094 ,  B29K2883/00 ,  B29L2031/7544 ,  B29L2031/756 ,  B81B2201/055 ,  B81C1/00111 ,  B81C2201/034

Abstract: A device, preferably a micro-device, is molded from a plastic material by injection molding, compression molding or embossing. A microabrader can be molded having microneedles for abrading the stratum corneum of the skin to form an abraded site in the tissue for enhancing drug delivery. The micro-device is molded using a mold assembly having a silicon molding surface. The silicon molding surface can include a recess corresponding to the desired shape and length of the microneedles. The silicon molding surface enables micron and submicron size features to be molded from polymeric materials without the polymeric material adhering to the mold surface. Micro-devices having molded features having micron and submicron dimensions can be rapidly produced without the use of a release agent.

Abstract translation: 一种装置，优选一种微型装置，通过注塑，压塑或压花由塑料材料模制。 微型造型机可以模制成具有用于研磨皮肤角质层的微针，以在组织中形成用于增强药物递送的磨损部位。 使用具有硅模制表面的模具组件来模制微型装置。 硅成型表面可以包括对应于所需形状和长度的微针的凹部。 硅成型表面使得微米和亚微米尺寸的特征能够由聚合物材料模制而不会使聚合材料粘附到模具表面。 具有微米和亚微米尺寸的模制特征的微型装置可以在不使用脱模剂的情况下快速生产。

公开(公告)号：US07052268B2

公开(公告)日：2006-05-30

申请号：US10626391

申请日：2003-07-24

Applicant: Kenneth G. Powell ,  Larry A. Monahan ,  Burton H. Sage, Jr.

Inventor： Kenneth G. Powell ,  Larry A. Monahan ,  Burton H. Sage, Jr.

IPC: B29C33/38

CPC classification number: B29C33/405 ,  A61M37/0015 ,  A61M2037/0046 ,  A61M2037/0053 ,  B29C33/424 ,  B29C45/372 ,  B29C2045/0094 ,  B29K2883/00 ,  B29L2031/7544 ,  B29L2031/756 ,  B81B2201/055 ,  B81C1/00111 ,  B81C2201/034

Abstract: A device, preferably a micro-device, is molded from a plastic material by injection molding, compression molding or embossing. A microabrader can be molded having microneedles for abrading the stratum corneum of the skin to form an abraded site in the tissue for enhancing drug delivery. The micro-device is molded using a mold assembly having a silicon molding surface. The silicon molding surface can include a recess corresponding to the desired shape and length of the microneedles. The silicon molding surface enables micron and submicron size features to be molded from polymeric materials without the polymeric material adhering to the mold surface. Micro-devices having molded features having micron and submicron dimensions can be rapidly produced without the use of a release agent.

公开(公告)号：US07040338B2

公开(公告)日：2006-05-09

申请号：US09796871

申请日：2001-02-28

Applicant: Marc A. Unger ,  Hou-Pu Chou ,  Todd A. Thorsen ,  Axel Scherer ,  Stephen R. Quake

Inventor： Marc A. Unger ,  Hou-Pu Chou ,  Todd A. Thorsen ,  Axel Scherer ,  Stephen R. Quake

IPC: F16K31/126

CPC classification number: B29C51/00 ,  B01L3/502707 ,  B01L3/50273 ,  B01L3/502738 ,  B01L2300/0861 ,  B01L2300/0887 ,  B01L2300/123 ,  B01L2400/046 ,  B01L2400/0481 ,  B01L2400/0655 ,  B33Y80/00 ,  B81B5/00 ,  B81B2201/036 ,  B81B2201/054 ,  B81C1/00119 ,  B81C2201/019 ,  B81C2201/034 ,  C12Q1/6874 ,  F04B43/043 ,  F15C1/06 ,  F15C5/00 ,  F16K11/20 ,  F16K13/00 ,  F16K31/126 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0046 ,  F16K99/0048 ,  F16K99/0051 ,  F16K99/0059 ,  F16K2099/0074 ,  F16K2099/0076 ,  F16K2099/0078 ,  F16K2099/008 ,  F16K2099/0094 ,  Y10T137/0491 ,  Y10T137/0497 ,  Y10T137/2224 ,  Y10T137/87249 ,  Y10T156/10 ,  Y10T428/24479 ,  Y10T428/24744 ,  C12Q2535/125

Abstract: A method of fabricating an elastomeric structure, comprising: forming a first elastomeric layer on top of a first micromachined mold, the first micromachined mold having a first raised protrusion which forms a first recess extending along a bottom surface of the first elastomeric layer; forming a second elastomeric layer on top of a second micromachined mold, the second micromachined mold having a second raised protrusion which forms a second recess extending along a bottom surface of the second elastomeric layer; bonding the bottom surface of the second elastomeric layer onto a top surface of the first elastomeric layer such that a control channel forms in the second recess between the first and second elastomeric layers; and positioning the first elastomeric layer on top of a planar substrate such that a flow channel forms in the first recess between the first elastomeric layer and the planar substrate.

公开(公告)号：US20050208171A1

公开(公告)日：2005-09-22

申请号：US11058195

申请日：2005-02-16

Applicant: Junichi Seki ,  Tohru Den

Inventor： Junichi Seki ,  Tohru Den

IPC: B81C99/00 ,  B29C35/00 ,  B29C59/02 ,  G03F7/00 ,  H01L21/027

CPC classification number: G03F7/0002 ,  B29C35/02 ,  B29C43/003 ,  B29C43/021 ,  B29C59/002 ,  B29C59/022 ,  B29C2043/025 ,  B29C2043/3634 ,  B29C2059/023 ,  B81C99/0085 ,  B81C2201/034 ,  B82Y10/00 ,  B82Y40/00

Abstract: A molding apparatus for patterning a workpiece includes a mold having a pattern to be transferred to the workpiece, with the pattern including recesses, a first support member for supporting the mold, and a second support member, arranged opposite to the first support member, for supporting the workpiece. A pressing mechanism brings the first and second support members close to each other and presses the mold and the workpiece together so as to transfer, to the workpiece, the pattern on the mold. Recessed portions are provided on at least one of a surface of the mold on the first support member side, a region of the first support member, and a region of the second support member. The recessed portions correspond to recesses in the pattern of the mold.

Abstract translation: 用于图案化工件的成型装置包括具有要传送到工件的图案的模具，图案包括凹部，用于支撑模具的第一支撑构件和与第一支撑构件相对设置的第二支撑构件，用于 支撑工件。 按压机构使第一和第二支撑构件彼此靠近，将模具和工件一起压在一起，以将工件上的图案转印到模具上。 在第一支撑构件侧的模具的表面，第一支撑构件的区域和第二支撑构件的区域中的至少一个表面上设置嵌入部分。 凹部对应于模具图案中的凹部。